• Journal of Applied Reliability
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• v.15 no.1
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• pp.33-43
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• 2015

The importance of reliability engineering has increased in recent years. Many studies have been carried out into reliability in a variety of research domains, largely focused on industrial engineering, mechanical engineering, electronics engineering, materials engineering and statistical science. However, most of these studies were carried out without collaboration between different areas of study. Here, we analyze research papers and patents regarding reliability that were published during the past five years, and describe core trends in the development of reliability technology from a multidisciplinary perspective.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Electronics and Telecommunications Trends
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• v.38 no.3
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• pp.20-28
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• 2023

Wireless communication technology has mainly been used to fulfill the demands of industrial sites at which performance is not a critical concern. However, ongoing discussions and efforts are now focused on securing core wireless communication technologies to enable the transformation or expansion of wired industrial IoT (Internet of Things) network technology into a flexible and dynamic smart manufacturing system. This paper provides an overview of current wireless industrial IoT network technology and the recent wireless time-sensitive networking technology. It outlines the challenging level of reliability required for wireless communication technology to coexist with or replace its wired counterpart in future smart manufacturing systems. Additionally, we introduce ultra-reliable time deterministic network as the core technology of wireless industrial communications and focus on its reliability and delay characteristics.

• Journal of the Korean institute of surface engineering
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• v.36 no.2
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• pp.214-225
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• 2003

Trends in microelectronics packages such as low cost, miniaturization, high performance, and high reliability made area array interconnecting technologies including flip chip, CSP (Chip Scale Package) and BGA (Ball Grid Array) mainstream technologies. Underfill technology is used for the reliability of the area array technologies, thus electronics packaging industry regards it as very important technology In this paper, the underfill technology is reviewed and the recent advances in the underfill technology including new processes and materials are introduced. These includes reworkable underfills, no-flow underfills, molded underfills and wafer - level - applied underfills.

• 제어로봇시스템학회:학술대회논문집
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• 1986.10a
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• pp.540-543
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• 1986

In this article, recent trends of technology in design of CNC system for machine tools which has increased in number and applications by needs for FA(Factory Automation), save of labor in various industries, are described. These technology improvements in CNC system take place especially in the field of performance, reliability, compactness, price, etc. From these technology improvements, the theme of "performance improvements of CNC system" are selected and mostly described in this article. Also, the major features of a CNC system product of our company and its characteristics in system design are briefly described.described.

• Proceedings of the KIEE Conference
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• 2000.07a
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• pp.188-190
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• 2000

Protective Relays are vital components of power systems. The role of the protective relaying device is more important than ever. Therefore, We have investigated the operating trends of protective relay from 1991 to 1999. we anticipate that reliability in the power systems increases by improving design, manufacture, construction technology and maintenance method of the protective relay.

• Electronics and Telecommunications Trends
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• v.35 no.7
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• pp.67-76
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• 2020

Because of the development and spread of artificial intelligence (AI) technology, new security threats and adverse AI functions have emerged as a real problem in the process of diversifying areas of use and introducing AI-based products and services to users. In response, it is necessary to develop new AI-based technologies in the field of information protection and security. This paper reviews topics such as domestic and international trends on false information detection technology, cyber security technology, and trust distribution platform technology, and it establishes the direction of the promotion of technology development. In addition, the development of international trends in ethical AI guidelines to ensure the human-centered ethical validity of AI development processes and final systems in parallel with technology development are analyzed and discussed. ETRI has developed AI policing technology, information protection, and security technologies as well as derived tasks and implementation strategies to prepare ethical AI development guidelines to ensure the reliability of AI based on its capabilities.

• Electronics and Telecommunications Trends
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• v.35 no.6
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• pp.97-106
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• 2020

This article explains domestic and overseas technology trends as well as an energy trading architecture model that can safely execute energy power trading through blockchain in the community. There is a way to trade energy between homes as well as between homes and the public in the community, but there are currently no institutions that make this possible. However, our aim is to approach these power trading methods collectively through global technology related to blockchain. We try to solve the problems of energy trading using the blockchain technique. We discuss domestic and overseas technology trends in power trading using blockchain and introduce the power trading architecture for the community proposed by ETRI. We propose a framework that supports reliability and interoperability based on blockchain and develop scalable technology capable of supporting not only small-scale electricity trading but also medium-scale power trading.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.66 no.4
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• pp.613-620
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• 2017

The power grid has been changed to a smart grid system to satisfy the growing need for power grid complexity, demand, reliability, security, and efficiency with a combination of existing power and ICT technology. This study analyzes the research trends in smart grid technology in the period since the introduction of the smart grid system and compares it with industrial trends to grasp the progress and characteristics of Smart Grid technology and look for ways to innovate the technology. To do this, we analyze the research trends using dynamic topic modeling, which is capable of time-series research topic analysis. Next, we compare the results of research trends with industrial trends analyzed by Gartner's experts to demonstrate that smart grid research is evolving to the level of industrialization. The results of this study are quantitative analysis through data mining, and it is expected that it will be used in many fields such as companies that want to participate in industry and government agencies that need to establish policies by showing more objective analysis results.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.88-88
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• 2012

High efficiency thin film photovoltaic device technology is reviewed. At present market situation, the industrial players of thin film technologies have to confront the great recession and need to change their market strategies and find technical alternatives again. Most recent technology trends and technical or industrial progress for Silicon thin film and CIGS are introduced and common interests for high efficiency and reliability are discussed.