• 터널과지하공간
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• 제13권4호
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• pp.260-269
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• 2003

In order to introduce to engineers the suitable calculation techniques of TBM advance rate (ad.) and ultimately promote to understand the designing process, this study was carried out. We analyzed the 17 bored data of TBM which applied to the roadway and water supply tunnels in Korea. From this analysis, it was able to how that the average utilization is 30.83% md the correlation equation of Ad and TBM´s diameter (D) is Ad(m/month) = 506.05ㆍ $e^{-0.1162}$$\times$D than the correlation coefficient ($R^2$) is 0.76. In the object of the W tunnel of Seoul-Busan highspeed railway, the Ad of TBM 5.0mø was analyzed by the variety of empirical models and upper correlation equation. Average Ad of the empirical models was calculated to be larger than one of the upper equations. But considering only the results of 3.0~5.0mø TBM in the 17 bored data, the average Ad by the models belongs to the similar range of bored data. Therefore, when the reliability and representative of parameters are decreased, a reliability test should be carried out through the comparison a variety of empirical models with the upper correlation equation.

• 한국강구조학회 논문집
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• 제13권2호
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• pp.177-189
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• 2001

현대 건축물들의 고층화 추세에 따라 등장한 구조물의 공사비 절감을 위한 한 방법으로 H형강보의 웨브 부분에 설비용 덕트와 배관류 등을 관통시키기 위하여 개구부를 두는 유공보를 자주 사용하고 있다. 본 연구에서는 현재 유공보의 설계에 사용되고 있는 기존의 강도식들의 문제점을 살펴보고 소성 붕괴 매커니즘에 기초를 둔 보다 합리적인 강도식을 제안하고자 한다. 제안식은 기존의 강도식들과 비교하여 볼 때 단순하며 이해하기 쉽다. 제안식의 검증은 과거에 이루어진 연구 결과들을 사용하여 평가되어 졌다. 이들 연구결과들을 근거로 제안식의 극한 강도를 비교해 볼 때 현재 실무에서 사용되어 지고있는 강도식들보다 합리적인 결과 값을 기대할 수 있다.

• Tribology and Lubricants
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• 제26권6호
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• pp.329-335
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• 2010

Recently, the End-milling processing is needed the high-precise technique to get a good surface roughness and rapid time in manufacturing of precision machine parts and electronic parts. The optimum surface roughness has an effect on end-milling working condition such as, cutting direction, spindle speed, feed rate and depth of cut, and so on. It needs to form the correlation of working conditions and surface roughness. Therefore this study was carried out to presume of surface roughness on end-milling working condition of Al7075 by regression analysis. The results was shown that the coefficient of determination($R^2$) of regression equation had a fine reliability of 87.5% and nonlinear regression equation of surface rough was made by multiple regression analysis.

• 콘크리트학회논문집
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• 제16권1호
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• pp.102-110
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• 2004

최근 시멘트 및 골재 등 원재료 값의 상승 및 세계적인 유가 급등으로 인한 운송비의 증가로 레미콘 제조원가는 상승하고있다. 그러나 레미콘 제조업체들 간의 과당경쟁으로 인해 레미콘의 납품 단가는 오히려 낮아지고 있는 실정이다. 이를 극복하기 위한 일환으로 레미콘 제조업체들은 레미콘의 제조원가를 최소한으로 줄이고자 하는 노력 중 하나로 고로슬래그미분말 및 플라이애쉬를 혼화재로 사용하는 업체가 증가하고 있다. 그러나 이러한 광물질 혼화재를 사용한 콘크리트의 품질관리에 대한 연구는 미흡한 실정이다. 따라서, 본 연구에서는 고로슬래그미분말 혼합 콘크리트의 28일 압축강도를 조기에 예측하기 위해 열수양생법 및 표준양생에 의한 7일 압축강도를 이용하였다. 고로슬래그미분말 혼합률 별로 선형회귀분석을 실시하여 추정식을 제시하였고 90%의 신뢰구간을 나타내었다. 또한 실험의 신뢰성을 높이기 위해 모든 배합은 3회 반복하였고, 배합순서는 랜덤추출법을 사용하였다. 이러한 실험결과 열수양생법에 의한 1일 촉진강도로서 고로슬래그미분말 혼합 콘크리트의 재령 28일 압축강도를 예측할 수 있는 추정식의 신뢰성을 확인하는 성과를 얻었다.

• 한국건설순환자원학회논문집
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• 제4권4호
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• pp.91-98
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• 2009

최근 시멘트 및 골재 등 원재료 값의 상승 및 세계적인 유가 급등으로 인한 운송비의 증가로 레미콘 제조원가는 상승하고 있다. 그러나 레미콘 제조업체들 간의 과다한 경쟁으로 인해 레미콘의 납품 단가는 오히려 낮아지고 있는 실정이다. 이를 극복하기 위한 일환으로 레미콘 제조업체들은 레미콘의 제조원가를 최소한으로 줄이고자 하는 노력 중 하나로 고로슬래그 미분말 및 플라이애시를 혼화재로 사용하는 업체가 증가하고 있다. 그러나 이러한 광물질 혼화재를 사용한 콘크리트의 품질관리에 대한 연구는 미흡한 실정이다. 따라서, 본 연구에서는 고로슬래그 미분말 혼합 콘크리트의 28일 압축강도를 조기에 예측하기 위해 촉진양법을 이용하였다. 고로슬래그 미분말 혼합률 별로 선형회귀분석을 실시하여 추정식을 제시하였고 90%의 신뢰구간을 나타내었다. 또한 실험의 신뢰성을 높이기 위해 모든 배합은 3회 반복하였고, 배합순서는 랜덤추출법을 사용하였다. 이러한 실험결과 촉진양생법에 의한 1일 촉진강도로서 고로슬래그 미분말 혼합 콘크리트의 재령 28일 압축강도를 예측할 수 있는 추정식의 신뢰성을 확인하는 성과를 얻었다.

• 대한기계학회논문집A
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• 제26권6호
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• pp.1069-1076
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• 2002

The high temperature creep behavior of heat machine systems such as aircraft engines, boilers and turbines in power plants and nuclear reactor components have been considered as an important and needful fact. There are considerable research results available for the design of high temperature tube materials in power plants. However, few studies on the Initial Strain Method (ISM) capable of securing repair, maintenance, cost loss and life loss have been made. In this method, 3 long time prediction Of high temperature creep characteristics can be dramatically induced through a short time experiment. The purpose of present study is to investigate the high temperature creep lift of Udimet 720, SCM 440-STD61 and 1Cr-0.5Mo steel using the ISM. The creep test was performed at 40$0^{\circ}C$ to $700^{\circ}C$ under a pure loading. In the prediction of creep life for each materials, the equation of ISM was superior of Larson-Miller Parameter(LMP). Especially, the long time prediction of creep life was identified to improve the reliability.

• 한국지반공학회논문집
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• 제26권8호
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• pp.59-66
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• 2010

본 연구에서는 동다짐 공법을 적용할 시 개량심도와 진동영향 예측을 유한요소해석을 통해 그 적용성을 규명하였다. 동다짐 공법이 적용된 기존 현장 조건에 따라 지반을 모델링하였으며, 동적하중 모델은 rigid body force를 적용하였다. 개량심도는 심도별 최대 연직 입자 가속도로 예측을 하여 기존 경험식과 비교 분석하였으며, 진동영향은 진동원으로부터 거리별 연직 최대 입자 속도를 도출하여 기존 경험식에 의한 값과 비교 분석하였다. 수치해석 결과, 개량심도의 경우 기존의 경험식과 비슷한 양상을 띄고 있으며, 진동영향의 경우는 기존 식과 특정 구간에서 차이를 보이고 있으나, 어느 정도 소요이격거리를 예측 할 수 있었다. 이들 해석결과는 경험적인 방법과 더불어 동다짐 설계의 신뢰도 향상을 위한 기초적인 자료가 될 것으로 보인다.

• 대한기계학회논문집A
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• 제28권9호
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• pp.1408-1414
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• 2004

The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. ACF (anisotropic conductive film) is one of the major flip-chip technologies, which has short chip-to-chip interconnection length, high productivity, and miniaturization of package. In this study, thermal fatigue lift of ACF bonding flip-chip package has been predicted. Elastic and thermal properties of ACF were measured by using DMA and TMA. Temperature dependent nonlinear hi-thermal analysis was conducted and the result was compared with Moire interferometer experiment. Calculated displacement field was well matched with experimental result. Thermal fatigue analysis was also conducted. The maximum shear strain occurs at the outmost located bump. Shear stress-strain curve was obtained to calculate fatigue life. Fatigue model for electronic adhesives was used to predict thermal fatigue life of ACF bonding flip-chip packaging. DOE (Design of Experiment) technique was used to find important design factors. The results show that PCB CTE (Coefficient of Thermal Expansion) and elastic modulus of ACF material are important material parameters. And as important design parameters, chip width, bump pitch and bump width were chose. 2$^{nd}$ DOE was conducted to obtain RSM equation far the choose 3 design parameter. The coefficient of determination ($R^2$) for the calculated RSM equation is 0.99934. Optimum design is conducted using the RSM equation. MMFD (Modified Method for feasible Direction) algorithm is used to optimum design. The optimum value for chip width, bump pitch and bump width were 7.87mm, 430$\mu$m, and 78$\mu$m, respectively. Approximately, 1400 cycles have been expected under optimum conditions. Reliability analysis was conducted to find out guideline for control range of design parameter. Sigma value was calculated with changing standard deviation of design variable. To acquire 6 sigma level thermal fatigue reliability, the Std. Deviation of design parameter should be controlled within 3% of average value.

• Earthquakes and Structures
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• 제11권5호
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• pp.779-807
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• 2016

Ground Motion Prediction Equations (GMPEs) are essential tools in seismic hazard analysis. With the introduction of probabilistic approaches for the estimation of seismic response of structures, also known as, performance based earthquake engineering framework; new tasks are defined for response spectrum such as the reference criterion for effective structure-specific selection of ground motions for nonlinear time history analysis. One of the recent efforts to introduce a high quality databank of ground motions besides the corresponding selection scheme based on the broadband spectral consistency is the development of SIMBAD (Selected Input Motions for displacement-Based Assessment and Design), which is designed to improve the reliability of spectral values at all natural periods by removing noise with modern proposed approaches. In this paper, a new global GMPE is proposed by using selected ground motions from SIMBAD to improve the reliability of computed spectral shape indicators. To determine regression coefficients, 204 pairs of horizontal components from 35 earthquakes with magnitude ranging from Mw 5 to Mw 7.1 and epicentral distances lower than 40 km selected from SIMBAD are used. The proposed equation is compared with similar models both qualitatively and quantitatively. After the verification of model by several goodness-of-fit measures, the epsilon values as the spectral shape indicator are computed and the validity of available prediction equations for correlation of the pairs of epsilon values is examined. General consistency between predictions by new model and others, especially, in short periods is confirmed, while, at longer periods, there are meaningful differences between normalized residuals and correlation coefficients between pairs of them estimated by new model and those are computed by other empirical equations. A simple collapse assessment example indicate possible improvement in the correlation between collapse capacity and spectral shape indicators (${\varepsilon}$) up to 20% by selection of a more applicable GMPE for calculation of ${\varepsilon}$.

• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.