• Journal of the Korea Convergence Society
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• v.10 no.4
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• pp.45-50
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• 2019

This study proposes a method to measure software reliability according to software reliability measurement model to measure software reliability. The model presented in this study uses the distribution of Non - Homogeneous Poisson Process and presents a measure of the software reliability of the presented model. As a method to select a suitable software reliability growth model according to the presented model, we have studied a method of proposing an appropriate software reliability function by calculating the mean square error according to the estimated value of the reliability function according to the software failure data. In this study, we propose a reliability function to measure the software quality and suggest a method to select the software reliability function from the viewpoint of minimizing the error of the estimation value by applying the failure data.

• Current Photovoltaic Research
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• v.8 no.4
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• pp.124-128
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• 2020

Output power of photovoltaic (PV) modules installed outdoors decreases every year due to environmental conditions such as temperature, humidity, and ultraviolet irradiations. In order to promote the installation of PV modules, the reliability must be guaranteed. One of the important factors affecting reliability is intermetallic compounds (IMC) layer formed in ribbon solder joint. For this reason, various studies on soldering properties between the ribbon and cell have been performed to solve the reliability deterioration caused by excessive growth of the IMC layer. However, the IMC layer of the PV module interconnected by multi-wires has been studied less than using the ribbon. It is necessary to study soldering characteristics of the multi-wire module for improvement of its reliability. In this study, we analyzed the growth of IMC layer of the PV module with multi-wire and the degradation of output power through damp-heat test. The fabricated modules were exposed to damp-heat conditions (85 ºC and 85 % relative humidity) for 1000 hours and the output powers of the modules before and after the damp-heat test were measured. Then, the process of dissolving ethylene vinyl acetate (EVA) as an encapsulant of the modules was performed to observe the IMC layer. The growth of IMC layer was evaluated using OM and FE-SEM for cross-sectional analysis and EDS for elemental mapping. Based on these results, we investigated the correlation between the IMC layer and output power of modules.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.1
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• pp.29-38
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• 1998

We summarize, in this paper, that we have learned from the slftwar reliability analysis of a large switching software composed of functional blocks which form slotware units. To determine the time of management activity related to sopftware reliability growth, we review the process of detection and correction of software failures. Also we apply the two softwre reliability frowth model, Goel-Okumoto and S-shaped model, to estimate the global software reliability growth to a set of failure found during period of the system test. The analysis methods and results can be applied to other large software development projects.

• Journal of Korean Society for Quality Management
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• v.25 no.3
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• pp.96-107
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• 1997

The recent stream to reliability prediction is that it is totally inclusive in depth to consider even the operating and environmental condition at the level of finished goods as well as component itselves. In this study, firstly we present the reliability prediction methods by entire failure rate model which failure rate at the system level is added to the failure rate model at the component level. Secondly we build up the improved bases of reliability demonstration through a, pp.ication of Kaplan-Meier, Cumulative hazard, Johnson's methods as non-parametric and Maximum Likelihood Estimator under exponential & Weibull distribution as parametric. And also present the methods of curve fitting to piecewise failure rate under Weibull distribution, PRST (Probability Ratio Sequential Test), curve fitting to S-shaped reliability growth curve, computer programs of each methods. Lastly we show the practical for determination of optimal burn-in time as a method of reliability enhancement, and also verify the practical usefulness of the above study through the a, pp.ication of failure and test data during 1 year.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.32 no.4
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• pp.228-234
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• 2009

신뢰성성장시험은 주어진 기간 동안에 고장모드를 체계적이고 영구적으로 제거하여 신뢰성을 향상시키려는 것이 목적이다. 이러한 활동은 대부분 매우 제약된 시간에 이루어져야 함으로 신제품개발프로그램에 있어서는 가속수명 시험이 필수적인 신뢰성성장시험 도구로 적용된다. 본 연구에서는 가속수명시험 하에서 신뢰성성장을 계획하고 분석하는데 유용한 도구로 사용할 수 있는 가속 신뢰성성장모델을 제시하였다. 시험전략은 test-find-test 전략으로서 시험중 고장모드가 발견되어도 이 문제에 대한 근본적 조치는 시험이 완성된 이후에 이루어지는 경우를 가정하였다. 이는 시험을 중간에 중단하고 시작하는 비용이 매우 높거나, 시스템이 고도로 복잡하여 완전히 분해하는데 어려움이 있는 경우에 적용된다.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.10
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• pp.49-55
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• 2000

This study describes the fatigue characteristics for Al2024 alloy, which is aircraft structure material. For this work, the plane-strain fracture toughness test, the plane-stress fracture toughness test and the crack growth rates test were conducted under the standard testing method. Test equipment is a computer-controlled closed-loop fatigue testing machine. The data of each test result is very important to aircraft structure reliability estimation, life prediction, design analysis, endurance analysis and damage tolerance analysis. In addition, the fatigue crack growth threshold($\DeltaKth$) value decreased as the stress ratio increased. Also, $\DeltaKth$ decreased as the thickness increased in LT, TL directions.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.4A
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• pp.399-414
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• 2004

In this paper, an evolution of software reliability engineering in a large-scale software project is summarized. The considered software consists of many components, called functional blocks in software of switching system. These functional blocks are served as the unit of coding and test, and the software is continuously updated by adding new functional blocks. We are mainly concerned with the analysis of the effects of these software components in software reliability and reliability evolution. We analyze the static characteristics of the software related to software reliability using collected failure data during system test. We also discussed a pattern which represents a local and global growth of the software reliability as version evolves. To find the pattern of system software, we apply the S-shaped model to a collection of failure data sets of each evolutionary version and the Goel-Okumoto(G-O) model to a grouped overall failure data set. We expect this pattern analysis will be helpful to plan and manage necessary human/resources fur a new similar software project which is developed under the same developing circumstances by estimating the total software failures with respect to its size and time.

• Journal of Applied Reliability
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• v.18 no.3
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• pp.271-279
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• 2018

Purpose: Probabilistic safety analysis was performed to enhance the safety and reliability of nuclear power plants because traditional deterministic approach has limitations in predicting the risk of failure by crack growth. The study introduces a probabilistic approach to establish a basis for probabilistic safety assessment of passive components. Methods: For probabilistic modeling of fatigue crack growth rate (FCGR), various FCGR tests were performed either under constant load amplitude or constant ${\Delta}K$ conditions by using heat treated X-750 at low temperature with adequate cathodic polarization. Bayesian inference was employed to update uncertainties of the FCGR model using additional information obtained from constant ${\Delta}K$ tests. Results: Four steps of Bayesian parameter updating were performed using constant ${\Delta}K$ test results. The standard deviation of the final posterior distribution was decreased by a factor of 10 comparing with that of the prior distribution. Conclusion: The method for developing a probabilistic crack growth model has been designed and demonstrated, in the paper. Alloy X-750 has been used for corrosion fatigue crack growth experiments and modeling. The uncertainties of parameters in the FCGR model were successfully reduced using the Bayesian inference whenever the updating was performed.

• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2000.04a
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• pp.40-45
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• 2000

Presented are the estimation of the probability distribution of fatigue crack growth life and reliability assessment of structures by simulating material resistance to fatigue crack growth along a crack path. The material resistance is treated as a Weibull stochastic process. A non-Gaussian stochastic fields simulation method proposed by Shimozuka, et al is applied with the statistical data obtained experimentally. Test results are obtained for $\Delta$K constant amplitude load in tension with stress ratio of R=0.2 and three specimen thicknesses of 6, 12 and 18mm. This simulation method is useful to estimate the probability distribution of fatigue crack growth life and the smallest life.