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The Types of Secondary School Students' Preconceptions on the Motion of the Earth and the Moon (계통도를 이용한 중.고등학생의 지구와 달의 운동에 관한 개념 유형 연구)

  • Woo, Jong-Ok;Lee, Hang-Ro;Min, Jun-Gyu
    • Journal of The Korean Association For Science Education
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    • v.15 no.4
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    • pp.379-393
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    • 1995
  • In spite of school science learning, the students' conceptions have not been changed easily. Therefore, to make students overcome their non scientific conceptions has been an important issue in science education. The purpose of this study was to identify the conceptions of students and teachers on the motion of the earth and the moon. The instrument was developed for estimating students' understandings of the concepts related to the motion of the earth and the moon. The validity of the instrument was examined by the specialists in Science Educator and Astronomer. At the same time, the two field trials had been executed, and the items were modified. Also, it consists of 12 items including 9 two-tier multiple choice items and 3 multiple choice items. The population of this study consists of 250 eighth-, 299 tenth-, 292 eleventh-grade students, 134 science teachers in secondary school. SPSS/PC+ was adopted for the statistical analysis. The type of misconceptions possessed students were as follows: 1) At 12:00 noon, the sun is directly overhead. 2) First quarter moon is a half of overall surface of the moon. 3) Air don't rotate with the earth surface because it keeps apart from the earth surface. 4) Summer is warmer than winter, because the earth is nearer from the sun in summer. 5) Whenever season is changed, the direction of rotation axis of the earth is changed. 6) The moon is the brightest at the position of new moon, because the distance between the moon and the sun is the shortest and the moon is received strongest sunlight. 7) The moon is not seen at the position of real full moon, because it is covered with shadow of the earth. 8) When the moon is not seen in the earth, sunlight is not reached at the moon. The major findings were as follows : 1) The middle school students had more misconceptions than those of high school students. And female students had more misconceptions than those of male ones. 2) The rate of correct answer and the type of conception in the tenth grade students were very similar with eleventh grade students. 3) The higher cognitive level, the better development of scientific conception and the less misconception. Also, the correlation coefficient between scientific conception score and GALT score was 0.57. 4) The students in scientific part had higher the rate of correct answer than those of students in human part and the former had less misconception than the latter. 5) The rate of correct answer about model and figure items was lower than descriptive ones, because they did not understand about figures itselves. These types of misconceptions will be used for science instruction and studies of other conceptions need.

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Thermo-mechanical Behavior of WB-PBGA Packages with Pb-Sn Solder and Lead-free Solder Using Moire Interferometry (무아레 간섭계를 이용한 유연 솔더와 무연 솔더 실장 WB-PBGA 패키지의 열-기계적 변형 거동)

  • Lee, Bong-Hee;Kim, Man-Ki;Joo, Jin-Won
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.3
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    • pp.17-26
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    • 2010
  • Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.