• Title/Summary/Keyword: Rate of Nucleation

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Nucleation and growth mechanism of nitride films deposited on glass by unbalanced magnetron sputtering

  • Jung, Min J.;Nam, Kyung H.;Han, Jeon G.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2001.06a
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    • pp.14-14
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    • 2001
  • Nitride films such as TiN, CrN etc. deposited on glass by PVD processes have been developed for many industrial applications. These nitride films deposited on glass were widely used for not only decorative and optical coatings but also wear and corrosion resistance coatings employed as dies and molds made of glass for the example of lens forming molds. However, the major problem of nitride coatings on glass by PVD process is non-uniform film owing to pin-hole and micro crack. It is estimated that nonuniform coating is influenced by a different surface energy between metal nitrides and glass due to binding states. In this work, therefore, for the evaluation of nucleation and growth mechanism of nitride films on glass TiN and CrN film were synthesized on glass with various nitrogen partial pressure by unbalanced magnetron sputtering. Prior to deposition, for the examination of relationship between surface energy and film microstructure plasma pre-treatment process was carried out with various argon to hydrogen flow rate and substrate bias voltage, duty cycle and frequency by using pulsed DC power supply. Surface energy owing to the different plasma pre-treatment was calculated by the measurement of wetting angle and surface conditions of glass were investigated by X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscope(AFM). The microstructure change of nitride films on glass with increase of film thickness were analyzed by X-Ray Diffraction(XRD) and Scanning Electron Microscopy(SEM).

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Characteristics of New Particle Formation and Growth Events Observed at Gosan Climate Observatory in Fall 2009 (제주 고산에서 2009년 가을에 관측된 입자 생성 및 성장 현상의 특성)

  • Kim, Yumi;Kim, Sang-Woo;Yoon, Soon-Chang;Jang, Im-Suk;Lee, Suk-Jo;Lee, Meehye;Kim, Ji-Hyoung
    • Atmosphere
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    • v.21 no.1
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    • pp.35-44
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    • 2011
  • We investigated characteristics of new particle formation and growth events observed at Gosan climate observatory using Scanning Mobility Particle Sizer (SMPS) measurements of particle number size distribution with 54 size ranges from 10 to 487 nm in October 2009. Four days (17~20 October) and five days (22~26 October) were classified into strong new particle formation and growth event ($N_S$) and weak particle formation and growth event ($N_W$), respectively. $N_S$ and $N_W$ divided by increase of aerosol number concentration in nucleation mode and continuity of growth from nucleation to Aitken mode. Particle growth rates of $N_S$ (5.34~$9.19nm\;h^{-1}$) were greater than that of $N_W$ (2.15~$3.53nm\;h^{-1}$). $N_S$ and $N_W$ were analyzed with synoptic pattern over East Asia, meteorological elements, and sulfur dioxide ($SO_2$) measured at Gosan. We found that $N_S$ was characterized by a fast and northwesterly wind accompanied cold and dry airmass, but $N_W$ was affected airmass originated from South China and come through the Korea Peninsula. The events ($N_S$ and $N_W$) occurred at conditions of high solar flux ($&gt;700W\;m^{-2}$) and low relative humidity (< 60%). The $SO_2$ concentration on $N_S$ and $N_W$ was higher than that on case of non observed new particle formation.

The study for fabrication and characteristic of Li$_2$O-2SiO$_2$conduction glass system using conventional and microwave energies (마이크로파와 재래식 열원을 이용한 고체 전지용 Li$_2$O-2SiO$_2$계 전도성 유리의 제조 및 특성에 관한 연구)

  • Park, Seong-Soo;Kim, Kyoung-Tae;Kim, Byoung-Chan;Park, Jin;Park, Hee-Chan
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.1
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    • pp.66-72
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    • 2000
  • The behavior of nucleation and crystallization in the $Li_2O_3-SiO_2$ glass heat-treated at different condition under the conventional and microwave processing was studied by differential thermal analysis (DTA), X-ray diffractometry (XRD), optical microscopy (OM), and electrical conductivity measurement. Nucleation temperature and temperature of maximum nucleation rate in both conventionally and microwave heat-treated samples were 460~$500^{\circ}C$ and $580^{\circ}C$, respectively. It was expected that the probability for bulk crystallization increased in microwave heat-treated sample, compared to conventionally heat-treated one. Degree of crystallization increased with increasing crystallization temperature in both conventionally and microwave heat-treated samples. However, pattern of crystallization growth under microwave processing appeared to be quite different from that under the conventional one due to its internal or volumetric heating. Electrical conductivity of conventionally and microwave heat-treated samples were 1.337~2.299, 0.281~~$0.911{\times}10^{-7}\Omega {\textrm}{cm}^{-1}$, respectively.

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Crystallization Kinetics by Thermal Analysis (DTA) on Starting Glass Compositions for PDP(Plasma Display Panel) Rib (열분석에 의한 PDP 격벽용 출발유리조성의 결정화 특성 연구)

  • Jeon, Young-Wook;Cha, Jae-Min;Kim, Dae-Whan;Lee, Byung-Chul;Ryu, Bong-Ki
    • Journal of the Korean Ceramic Society
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    • v.39 no.8
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    • pp.721-727
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    • 2002
  • In order to overcome trade-off among compositions, process and properties of the glasses with high PbO-base composition for PDP Rib, we studied glass crystallization and crystallization kinetics by Differential Thermal Analysis(DTA). Glass powder was obtained through melting/cooling/grinding, with 3 wt%TiO2 addition for the crystal nucleation and growth in $62PbO-19B_2O_3-10SiO_2-9(Al_2O_3-K_2O-BaO-ZnO)$(in wt%) composition glass. This powder was heat-treated for 1 to 10 h at $445^{\circ}C$ for nucleation. DTA measurements were performed to obtain the crystallization peak with $5∼25^{\circ}C/min$ heating rates. DTA crystallization peak temperature increased with increasing the heating rate and decreased with increasing the heating time. Because the Avrami parameter (n) was approximately 1, the surface crystallization occurred. The maximum nucleation time was 2 h.

Analysis of Mean Deviation in Sliding-wear-rate of Carbon Steel with Various Pearlite Volume Fractions (탄소강의 펄라이트 분율에 따른 미끄럼 마멸속도 편차 분석)

  • Kim, M.G.;Gwon, H.;Hur, H.L.;Kim, Y.-S.
    • Transactions of Materials Processing
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    • v.24 no.3
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    • pp.205-211
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    • 2015
  • The current investigation was performed to study sliding-wear-rate deviation (wear-rate data scatter) in carbon steels with various microstructures. Pure iron, 0.2 wt. % C steel, 0.45 wt. % C steel, and bearing steel (AISI52100) were used for the investigation. These steels possess different microstructures. Microstructures of the pure iron, two carbon steel and the bearing steel were full ferrite, ferrite + pearlite and full pearlite, respectively. Depending on the carbon content, the carbon steel had different pearlite-volume fractions. Dry sliding wear tests of the steel were conducted using a ball-on-disk wear tester at a sliding speed of 0.1 m/s using a bearing ball (AISI52100) as a counterpart. Applied load and sliding distance were 100 N and 300 m, respectively. More than three (up to twelve) tests were conducted for each steel under the same conditions, and the mean deviations in the wear rate of the steel (microstructure) were compared. The wear-rate deviation in the steel with ferrite + pearlite microstructure was higher than that with ferrite microstructure, and the deviation decreased with the increase of pearlite volume fraction. The pure iron and the bearing steel specimens showed much less deviation. The high deviation observed from the ferrite + pearlite steel was attributed to irregular subsurface-crack nucleation and growth at the interface between the two micro constituents (ferrite and pearlite) during the wear test.

Prediction for the Dynamically Recrystallized Grain Size of AISI 304 (AISI 304 스테인리스강의 동적 재결정립 예측)

  • Kim S. I.;Yoo Y. C.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2001.05a
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    • pp.143-146
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    • 2001
  • The evolution of dynamic recrystallization (DRX) was studied with torsion test for AISI 304 stainless steel in the temperature range of $900-1000^{\circ}C$ and strain rate range of 0.05-5/sec. The evolution of DRX was investigated with microstructural analysis and change of flow stress curve slope. The investigation of serrated grain boundaries using electron back scattered diffraction (EBSD) analysis indicated that the nucleated new DRX grain size was similar to the size of bulging part. Before the steady state, the dynamically recrystallizing grains do not remain a constant size and gradually grow to the size of fully DRX grain at steady state. The calculation of grain size was based on $X_{DRX}$ and the assumption, which the nucleated DRX grains are growing to the steady state, continuously. It was found that the calculated results agreed with the microstructure of the alloy.

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Characterization of Solid Phase Crystallization in Sputtered and LFCVD Amorphous Silicon Thin Film (스퍼터링 및 저압화학기상증착 비정질 실리곤 박막의 고상 결정화 특성)

  • 김형택
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.11a
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    • pp.89-93
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    • 1995
  • Effects of hydrogenation in amorphous silicon rile growths on Solid Phase Crystallization (SPC) was investigated using x-ray diffractometry, energy dispersive Spectroscopy, and Raman spectrum. Interdiffusion of barium(Ba) and aluminum(Al) compounds of corning substrate was observed in both of rf sputtering and LFCVD films under the low temperature(580$^{\circ}C$) annealing. Low degree of crystallinity resulted from the interdiffusion was obtained. Highly applicable degree of crystallinity was obtained through the mechanical damage induced surface activation on amorphous silicon films. X-ray diffraction intensity of (111) orientation was used to characterize the degree of crystallinity of SPC. Nucleation and growth rate in SPC could be controllable through the employed surface treatment. IIydrogenated LPCVD films showed the superior crystallinity to non-hydrogenated sputtering films. Insignificant effects of activation treatment in sputtered film was of activation treatment in sputtered film was observed on SPC.

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The simulation of hydration of Portland cement blended with chemical inert filler

  • Xiaoyong, Wang;Lee, Han-Seung
    • Proceedings of the Korea Concrete Institute Conference
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    • 2008.04a
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    • pp.1041-1044
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    • 2008
  • The addition of chemical inert filler in blended cement, such as limestone or chemical inert silica fume, will produce a physical effect on cement hydration. Due to the high surface area of inert filler in the mixtures, it provides sites for the nucleation and growth of hydration products, thus improving the hydration rate of cement compounds and consequently increasing the strength at early age. This paper proposes a model of hydration of Portland cement blended with chemical inert filler. This model considers the influence of water to cement ratio, cement particle size, cement composition and addition of chemical inert filler on hydration. The heat evolution, degree of hydration and porosity are obtained as accompanied results in hydration process. The prediction results agree well with experiment results.

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Copper Electroplating on Mg Alloy in Pyrophosphate Solution

  • Van Phuong, Nguyen;Moon, Sungmo
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2016.11a
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    • pp.124.1-124.1
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    • 2016
  • In this work, uniform thickness and good adhesion of electrodeposited copper layer were achieved on AZ91 Mg alloy in alkaline noncyanide copper solution containing pyrophosphate ion by employing appropriate zincate pretreatment. Without zincate pretreatment, the electrodeposited copper layer on AZ91 Mg alloy was porous and showed poor adhesion which was explained by small number of nucleation sites of copper due to rapid dissolution of the magnesium substrate in the pyrophosphate solution. The zincate pretreatment was found as one of the most important steps that can form a conducting layer to cover AZ91 surface which decreased the dissolution rate of AZ91 Mg alloy about 40 times in the copper pyrophosphate solution. Electrodeposited copper layer on AZ91 Mg alloy after an appropriate zincate pretreatment showed good adhesion and uniform thickness with bright surface appearance, independent of the deposition time but the surface roughness of the electrodeposited copper layer increased with increasing Cu deposition time.

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Effect of Microstructure of Substrate on the Metallization Characteristics of the Electroless Copper Deposition for ULSI Interconnection Effect of Plasma

  • 홍석우;이용선;박종완
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2003.03a
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    • pp.86-86
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    • 2003
  • Copper has attracted much attention in the deep submicron ULSI metallization process as a replacement for aluminum due to its lower resistivity and higher electromigration resistance. Electroless copper deposition method is appealing because it yields conformal, high quality copper at relatively low cost and a low processing temperature. In this work, it was investigated that effect of the microstructure of the substrate on the electroless deposition. The mechanism of the nucleation and growth of the palladium nuclei during palladium activation was proposed. Electroless copper deposition on TiN barriers using glyoxylic acid as a reducing agent was also investigated to replace toxic formaldehyde. Furthermore, electroless copper deposition on TaN$\sub$x/ barriers was examined at various nitrogen flow rate during TaN$\sub$x/ deposition. Finally, it was investigated that the effect of plasma treatment of as-deposited TaN$\sub$x/ harriers on the electroless copper deposition.

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