• 제목/요약/키워드: Rapid Thermal Processing

검색결과 159건 처리시간 0.029초

ANALYSIS OF WATER STRESS OF GREENHOUSE PLANTS USING THERMAL IMAGING

  • K. H. Ryu;Kim, G. Y.;H. Y. Chae
    • 한국농업기계학회:학술대회논문집
    • /
    • 한국농업기계학회 2000년도 THE THIRD INTERNATIONAL CONFERENCE ON AGRICULTURAL MACHINERY ENGINEERING. V.III
    • /
    • pp.593-599
    • /
    • 2000
  • Accurate quantification of plant physiological properties is often necessary for optimal control of an automated greenhouse production system. Conventional crop growth monitoring systems are usually burdensome, inaccurate, and harmful to crops. A thermal image analysis system was used to accomplish rapid and accurate measurements of physiological-property changes of water-stressed crops. Thermal images were obtained from several species of plants that were placed in a growth chamber. Analyzing the images provided the pattern of temperature changes in a leaf and the amount of differences in the temperature of stressed plants and non-stressed plants.

  • PDF

열영상 정보를 이용한 온실 재배 작물의 수분 스트레스 분석 (Analysis of Water Stress of Greenhouse Crops Using Infrared Thermography)

  • 김기영;류관희;채희연
    • Journal of Biosystems Engineering
    • /
    • 제24권5호
    • /
    • pp.439-444
    • /
    • 1999
  • Automated greenhouse production systems often require crop growth monitoring involving accurate quantification of plant physiological properties. Conventional methods are usually burdensome, inaccurate, and harmful to crops. A thermal image analysis system can accomplish rapid and accurate measurements of physiological-property changes of stressed crops. In this research a thermal imaging system was used to measure the leaf-temperature changes of several crops according to water deficit. Thermal images were obtained from lettuce, cucumber, pepper, and chinese cabbage plants. Results showed that there were significant differences in the temperature of stressed plants and non-stressed plants. The temperature differences between these two group of plants were 0.7 to 3$^{\circ}C$ according to species.

  • PDF

Bloom용 연속주조 몰드의 열거동 해석 (Thermal Behavior Analysis in Continuous Bloom Casting Mold)

  • 정영진;김성훈;김영모;강충길
    • 소성∙가공
    • /
    • 제13권4호
    • /
    • pp.319-325
    • /
    • 2004
  • Continuous casting machine has been experienced a rapid development to increase productivity with high casting speed and to meet consumer's strict demands for high quality. However, because most of defects and cracks are initially formed in mold and grown into surface cracks during the post process, more specific and clear investigations upon heat transfer mechanism between mold and solidified shell are necessarily needed. In this study heat transfer coefficients which shows the characteristic of heat transfer mechanism are calculated with temperatures measured in bloom mold using optimal algorithm, and thermal analysis are investigated using the calculated heat transfer coefficients. Finally uniformity of solidified shell is investigated for high carbon steel, 0.187%C from thermal analysis.

Study on Thermal Load Capacity of Transmission Line Based on IEEE Standard

  • Song, Fan;Wang, Yanling;Zhao, Lei;Qin, Kun;Liang, Likai;Yin, Zhijun;Tao, Weihua
    • Journal of Information Processing Systems
    • /
    • 제15권3호
    • /
    • pp.464-477
    • /
    • 2019
  • With the sustained and rapid development of new energy sources, the demand for electric energy is increasing day by day. However, China's energy distribution is not balanced, and the construction of transmission lines is in a serious lag behind the improvement of generating capacity. So there is an urgent need to increase the utilization of transmission capacity. The transmission capacity is mainly limited by the maximum allowable operating temperature of conductor. At present, the evaluation of transmission capacity mostly adopts the static thermal rating (STR) method under severe environment. Dynamic thermal rating (DTR) technique can improve the utilization of transmission capacity to a certain extent. In this paper, the meteorological parameters affecting the conductor temperature are analyzed with the IEEE standard thermal equivalent equation of overhead transmission lines, and the real load capacity of 220 kV transmission line is calculated with 7-year actual meteorological data in Weihai. Finally, the thermal load capacity of DTR relative to STR under given confidence is analyzed. By identifying the key parameters that affect the thermal rating and analyzing the relevant environmental parameters that affect the conductor temperature, this paper provides a theoretical basis for the wind power grid integration and grid intelligence. The results show that the thermal load potential of transmission lines can be effectively excavated by DTR, which provides a theoretical basis for improving the absorptive capacity of power grid.

반도체 열처리 공정을 위한 온도 조절기용 전력 제어장치의 설계 및 제작 (Design and Fabrication of Power Controller for Temperature Control on Semiconductor Thermal Processing)

  • 주동만;민경일;황재효
    • 한국산학기술학회논문지
    • /
    • 제3권4호
    • /
    • pp.257-262
    • /
    • 2002
  • 위상 제어방식을 이용한 급속열처리 장비의 온도조절기용 전력 제어장치를 설계하는 방법을 제시한다. 본 논문에서 제시된 설계 방법에 따라 전력제어장치를 제작·실험한 결과 가변입력제어신호 (0∼10 V)에 대해 가변출력평균전압(0∼198.06 V), 제어 분해능 48.356 mV(12 bit)를 얻었다.

  • PDF

VLM-$_{ST}$ 제품의 국부형상 정밀도 향상을 위한 후가공 공정개발에 관한 연구 (Investigation into development of post-processing system to improve geometrical conformity of VLM-$_{ST}$ parts for the detail shape)

  • 김효찬;안동규;이상호;양동열
    • 한국정밀공학회:학술대회논문집
    • /
    • 한국정밀공학회 2002년도 추계학술대회 논문집
    • /
    • pp.274-278
    • /
    • 2002
  • Surface finishing is still indispensable for most rapid prototyping (RP) processes because of the inherent stair-stepped surface and shrinkage of the parts. These problems can be minimized in the $VLM-_ST$ Process, because it uses expandable polystyrene foam sheets, each of which has a thickness of3.9 mm and a linear-interpolated side slope. The use of thick layers, however, limits the process capability of constructing fine details. This study focuses on the design of post-processing tool for fine details of $VLM-_ST$ parts and investigation of thermal characteristics during EPS foam cutting using the post-processing tool. To calculate the heat flux from the tool into the foam sheet, the tool was modeled as a heat source of radiation for finite element analysis. Results of the analysis agreed well with those of the experiment.

  • PDF

사각판재 보론강을 사용한 유체냉각공정에서의 열변형 해석 (Thermal Deformation Simulation of Boron Steel Square Sheet in Fluid Cooling Process)

  • 서창희;권태하;전효원;오상균;박춘달;최현열;문원식
    • 소성∙가공
    • /
    • 제26권1호
    • /
    • pp.5-10
    • /
    • 2017
  • Fluid cooling is one of the manufacturing processes used to control mechanical properties, and is recently used for hot stamping of automobile parts. The formed part at room temperature is heated and then cooled rapidly using various fluids in order to obtain better mechanical properties. The formed part may undergo excessive thermal deformation during rapid cooling. In order to predict the thermal deformation during fluid cooling, a coupled simulation of different fields is needed. In this study, cooling simulation of boron steel square sheet was performed. Material properties for the simulation were calculated from JMatPro, and three convection heat transfer coefficients such as water, oil and air were obtained from the experiments. It was found that the thermal deformation increased when the difference of cooling rate of sheet face increased, and the thermal deformation increased when the thickness of sheet decreased.

Progess in Fabrication Technologies of Polycrystalline Silicon Thin Film Transistors at Low Temperatures

  • Sameshima, T.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
    • /
    • pp.129-134
    • /
    • 2004
  • The development of fabrication processes of polycrystalline-silicon-thin-film transistors (poly-Si TFTs) at low temperatures is reviewed. Rapid crystallization through laser-induced melt-regrowth has an advantage of formation of crystalline silicon films at a low thermal budget. Solid phase crystallization techniques have also been improved for low temperature processing. Passivation of $SiO_2$/Si interface and grain boundaries is important to achieve high carrier transport properties. Oxygen plasma and $H_2O$ vapor heat treatments are proposed for effective reduction of the density of defect states. TFTs with high performance is reported.

  • PDF

LQG 설계에 의한 RTP 온도제어 시스템 (An RTP Temperature Control System Based on LQG Design)

  • 송태승;유준
    • 제어로봇시스템학회논문지
    • /
    • 제6권6호
    • /
    • pp.500-505
    • /
    • 2000
  • This paper deals with wafer temperature uniformity control essential in rapid thermal processing (RTP). One of the important control objectives of RTP is to keep the temperature over the wafer surface as uniformly as possible. For this, a discrete time state equation around the operating point is first identified by using the subspace fitting method, and a multivariable LQG(Linear Quadratic Gaussian) controller is designed based on the identified model. Simulation and experimental results show improvement in temperature uniformity over the conventional PID method.

  • PDF

소성 조건과 Zr/Ti 몰비에 따른 졸겔 $Pb(Zr_{1-x}Ti_x)O_3$ 박막의 구조 및 강유전 특성 (Structural and ferroelectric characteristics of sol-gel $Pb(Zr_{1-x}Ti_x)O_3$ thin films according to the sintering conditions and Zr/Ti mol%)

  • 김준한;윤현상;박정흠;장낙원;박창엽
    • E2M - 전기 전자와 첨단 소재
    • /
    • 제9권8호
    • /
    • pp.836-850
    • /
    • 1996
  • In this study, we have analyzed structural analysis and measured ferroelectric characteristics of PZT thin films prepared by sol gel process with different sintering conditions and different Zr/Ti mot%. When the Zr mot% of PZT thin film was increased, it was found that the remanent. polarization and coercive field were decreased and increased, respectively. Also, the maxium dielectric constant of PZT(50/50) thin film was 786.8. We got double hysteresis(anti-fcrroelectric) curve from PbZrO$_{3}$ thin film. As heating rate goes up, pyrochlore phase of PZT thin film was decreased and dielectric and ferroelectric characteristics were improved. As a result of variation of sintering temperature and time 500.deg. C-800.deg. C and 5 sec.-8 hours, respectively, we got optimal sintering temperature and time. The optimium sintering temperature and time of conventional furnace method and rapid thermal processing method were 650.deg. C-700.deg. C for 30-60 minutes and 700.deg. C/20 seconds-2 minutes, respectively.

  • PDF