• Title/Summary/Keyword: RF device

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A Study for the Characteristics of multi-layer VOx Thin Films for Applying to IR Absorbing Layer (적외선 흡수층 응용을 위한 다층 산화 바나듐 박막의 특성에 관한 연구)

  • 박철우;문성욱;오명환;정홍배
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.10
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    • pp.859-864
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    • 2000
  • Recently IR detecting devices using MEMS have been actively studied. Microbolometer, one of these devices, detects the change of resistivity as the change of temperature of the device by absorbing IR, IR absorbing materials for microbolometer should have high TCR value and low noise characteristics which depends on resistivity. We fabricated multi-layer VOx thin films to improve the IR detectivity of uncooled IR devices and analyzed IR absorbing characteristics. We fabricated multi-layer VOx thin films by RF reactive sputtering method on SiNx substrate and changed characteristics using the different thickness of V and V$_2$O$\_$5/ thin films. Then we annealed them under 300$\^{C}$. The TCR (Temperature Coefficient of Resistance) measurement was carried out to estimate the IR detectivity of multi-layer VOx thin films. XRD (X-Ray Diffraction) analysis was carried out to estimate the IR detectivity of multi-layer VOx thin films. ZXRD (X-Ray Diffraction) analysis was used to find out phases and structures of V and V$_2$O$\_$5/ thin films. AES (Auger Electron Spectroscopy) analysis was used to find out composition of multi-layer VOx thin films before and after annealing. We obtained the optimum thickness range of V and V$_2$O$\_$5/ thin films from the result of AES analysis. We changed the thickness of V$_2$O$\_$5/ about 20 to 150 $\AA$ and thickness of V about 10 to 20 $\AA$. As the result of this, TCR value of multi-layer VOx thin films was about -2%/k and the resistivity was ∼1Ωcm.

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Design and Fabrication of 5.5GHZ SSB optical modulator with polarization reversed structure (LiINbO3 기판의 분극반전을 이용한 5.5 GHz 대역 SSB 광변조기의 설계 및 제작)

  • Jeong, W.J.;Kim, W.K.;Yang, W.S.;Lee, H.M.;Lee, H.Y.;Kwon, S.W.
    • Korean Journal of Optics and Photonics
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    • v.17 no.2
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    • pp.175-180
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    • 2006
  • A single sideband(SSB) modulator operating at 5.5 GHz was fabricated by polarization inversion techniques. The dimension of domain inversion in a $LiINbO_3$ Mach-Zehnder structure was precisely controlled so that the RF signal applied on two Mach-Zehnder arms gives rise to $90^{\circ}$ effective phase difference. The single sideband suppression was maximized by optimization of the polarization status of the optical input and by the DC bias value. The fabricated device showed the center frequency of 5.8 GHz and the maximum sideband suppression of 33dB, where the bandwidth of 15 dB sideband suppression ranged over a 2.5 GHz span. The optical phase delay could be regulated by the DC bias voltage, fur example, the enhanced optical modulation sideband was distinctively switched from the upper sideband to the lower sideband by changing the DC bias voltage from 1.9 V to -10.6 V.

Estimation of Tree Heights from Seasonal Airborne LiDAR Data (계절별 항공라이다 자료에 의한 수고 추정)

  • Jeon, Min-Cheol;Jung, Tae-Woong;Eo, Yang-Dam;Kim, Jin-Kwang
    • Journal of the Korean Society of Surveying, Geodesy, Photogrammetry and Cartography
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    • v.28 no.4
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    • pp.441-448
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    • 2010
  • This paper estimates the tree height using Airborne LiDAR that is obtained for each season to analyze its influence based on a canopyclosure and data fusion. The tree height was estimated by extracting the First Return (RF) from the tree and the Last Return (LR) from the surface of earth to assume each tree via image segmentation and to obtain the height of each tree. Each data on tree height that is collected from seasonal data and the result of tree height acquired from the data fusion were compared. A tree height measuring device was used to measure on site and its accuracy was compared. Also, its applicability on the result of fused data that is obtained through the Airborne LiDAR is examined. As a result of the experiment, the result of image segmentation for an individual tree was closer to the result of site study for 1 meter interval when compared to the 0.5 meter interval of point cloud. In case of the tree height, the application of fused data enables a closer site measurement result than the application of data for each season.

Fabrication of Nickel Oxide Film Microbolometer Using Amorphous Silicon Sacrificial Layer (비정질 실리콘 희생층을 이용한 니켈산화막 볼로미터 제작)

  • Kim, Ji-Hyun;Bang, Jin-Bae;Lee, Jung-Hee;Lee, Yong Soo
    • Journal of Sensor Science and Technology
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    • v.24 no.6
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    • pp.379-384
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    • 2015
  • An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

Investigation of InAs/InGaAs/InP Heterojunction Tunneling Field-Effect Transistors

  • Eun, Hye Rim;Woo, Sung Yun;Lee, Hwan Gi;Yoon, Young Jun;Seo, Jae Hwa;Lee, Jung-Hee;Kim, Jungjoon;Kang, In Man
    • Journal of Electrical Engineering and Technology
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    • v.9 no.5
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    • pp.1654-1659
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    • 2014
  • Tunneling field-effect transistors (TFETs) are very applicable to low standby-power application by their virtues of low off-current ($I_{off}$) and small subthreshold swing (S). However, low on-current ($I_{on}$) of silicon-based TFETs has been pointed out as a drawback. To improve $I_{on}$ of TFET, a gate-all-around (GAA) TFET based on III-V compound semiconductor with InAs/InGaAs/InP multiple-heterojunction structure is proposed and investigated. Its performances have been evaluated with the gallium (Ga) composition (x) for $In_{1-x}Ga_xAs$ in the channel region. According to the simulation results for $I_{on}$, $I_{off}$, S, and on/off current ratio ($I_{on}/I_{off}$), the device adopting $In_{0.53}Ga_{0.47}As$ channel showed the optimum direct-current (DC) performance, as a result of controlling the Ga fraction. By introducing an n-type InGaAs thin layer near the source end, improved DC characteristics and radio-frequency (RF) performances were obtained due to boosted band-to-band (BTB) tunneling efficiency.

Thermal Distribution in a Phantom Using 8MHz RF Capacitive Type Hyperthermia (8 MHz 고주파 유전형 가열장치로 가열한 모형에서의 열분포)

  • Lee Jong Young;Park Kyung Ran;Kim Kye Jun;Sung Ki Joon
    • Radiation Oncology Journal
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    • v.9 no.2
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    • pp.171-176
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    • 1991
  • To evaluate the temperature distribution according to the size of the electorde and the thickness of the phantom using 8MHz radiofrequency capacitive heating device, various sized electrodes and phantoms were used in combination. The radii of the electrodes are 10, 15, 20, 25, and 30 cm and the thickness of cylindrical phantoms with diameter 30 cm were 10, 15, 20, 25, 30, and 35 cm. When the thickness of the phantom was 25 cm or 30 cm, homogenous heating was achieved by using the electrode which diameter was equal to or greater than the thickness of the phantom. When the thickness of the phantom was 20 cm or less. homogenous heating was not achieved by using the electrode which diameter was equal to the thickness of the phantom, but achieved by the larger diameter of the electorode. When the sizes of paired electrodes were not equal, the smaller electrode side was preferentially heated.

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Implementation of the Matching System between User-Centered Ubiquitous Virtual Reality and Real-World for Smart Home Control (스마트 홈 제어를 위한 사용자 중심의 유비쿼터스 가상현실과 실세계 정합시스템 구현)

  • Choi, Jae-Myeong;Lee, Hyun-Jik;Park, Ki-Hong;Kim, Yoon-Ho
    • Journal of Advanced Navigation Technology
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    • v.17 no.3
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    • pp.306-313
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    • 2013
  • In this paper, we implemented the matching system between user-centered ubiquitous virtual reality and the real world for smart home control. Implemented system consists of the smart devices that are equipped with the ubiquitous virtual reality, the hardware for a real-world representation, and the matching software. To communication and data control, we designed the TCP/IP communication protocol, and used the WPAN-based 802.15.4 ZigBee module. The main point of proposed the authoring tool-based ubiquitous virtual reality is the user-centered environment that users can place the objects such as smart TV, home appliances similar to embellish their home structure. Some experiments are conducted so as to verify the proposed model, and as a results, the proposed matching system is well performed.

Interface Characteristics and Electrical Properties of SiO2 and V2O5 Thin Films Deposited by the Sputtering (스퍼터링 방법으로 증착한 SiO2와 V2O5박막의 전류특성과 계면분석)

  • Li, Xiangjiang;Oh, Teresa
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.4
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    • pp.66-69
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    • 2018
  • This study was researched the electrical properties of semiconductor devices such as ITO, $SiO_2$, $V_2O_5$ thin films. The films of ITO, $SiO_2$, $V_2O_5$ were deposited by the rf magnetron sputtering system with mixed gases of oxygen and argon to generate the plasma. All samples were cleaned before deposition and prepared the metal electrodes to research the current-voltage properties. The electrical characteristics of semiconductors depends on the interface's properties at the junction. There are two kinds of junctions such as ohmic and schottky contacts in the semiconductors. In this study, the ITO thin film was shown the ohmic contact properties as the linear current-voltage curves, and the electrical characteristics of $SiO_2$ and $V_2O_5$ films were shown the non-linear current-voltage curves as the schottky contacts. It was confirmed that the electronic system with schottky contacts enhanced the electronic flow owing to the increment of efficiency and increased the conductivity. The schottky contact was only defined special characteristics at the semiconductor and the interface depletion layer at the junction made the schottky contact which has the effect of leakage current cutoff. Consequently the semiconductor device with shottky contact increased the electronic current flow, in spite of depletion of carriers.

Characteristics of Cu-Doped Ge8Sb2Te11 Thin Films for PRAM (PRAM용 Cu-도핑된 Ge8Sb2Te11 박막의 특성)

  • Kim, Yeong-Mi;Kong, Heon;Kim, Byung-Cheul;Lee, Hyun-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.5
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    • pp.376-381
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    • 2019
  • In this work, we evaluated the structural, electrical and optical properties of $Ge_8Sb_2Te_{11}$ and Cu-doped $Ge_8Sb_2Te_{11}$ thin films prepared by rf-magnetron reactive sputtering. The 200-nm-thick deposited films were annealed in a range of $100{\sim}400^{\circ}C$ using a furnace in an $N_2$ atmosphere. The amorphous-to-crystalline phase changes of the thin films were investigated by X-ray diffraction (XRD), UV-Vis-IR spectrophotometry, a 4-point probe, and a source meter. A one-step phase transformation from amorphous to face-centered-cubic (fcc) and an increase of the crystallization temperature ($T_c$) was observed in the Cu-doped film, which indicates an enhanced thermal stability in the amorphous state. The difference in the optical energy band gap ($E_{op}$) between the amorphous and crystalline phases was relatively large, approximately 0.38~0.41 eV, which is beneficial for reducing the noise in the memory devices. The sheet resistance($R_s$) of the amorphous phase in the Cu-doped film was about 1.5 orders larger than that in undoped film. A large $R_s$ in the amorphous phase will reduce the programming current in the memory device. An increase of threshold voltage ($V_{th}$) was seen in the Cu-doped film, which implied a high thermal efficiency. This suggests that the Cu-doped $Ge_8Sb_2Te_{11}$ thin film is a good candidate for PRAM.

Effect of Composition on Electrical Properties of Multifunctional Silicon Nitride Films Deposited at Temperatures below 200℃ (200℃ 이하 저온 공정으로 제조된 다기능 실리콘 질화물 박막의 조성이 전기적 특성에 미치는 영향)

  • Keum, Ki-Su;Hwang, Jae Dam;Kim, Joo Youn;Hong, Wan-Shick
    • Korean Journal of Metals and Materials
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    • v.50 no.4
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    • pp.331-337
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    • 2012
  • Electrical properties as a function of composition in silicon nitride ($SiN_x$) films grown at low temperatures ($<200^{\circ}C$) were studied for applications to photonic devices and thin film transistors. Both silicon-rich and nitrogen-rich compositions were successfully produced in final films by controlling the source gas mixing ratio, $R=[(N_2\;or\;NH_3)/SiH_4]$, and the RF plasma power. Depending on the film composition, the dielectric and optical properties of $SiN_x$ films varied substantially. Both the resistivity and breakdown field strength showed the maximum value at the stoichiometric composition (N/Si = 1.33), and degraded as the composition deviated to either side. The electrical properties degraded more rapidly when the composition shifted toward the silicon-rich side than toward the nitrogen-rich side. The composition shift from the silicon-rich side to the nitrogen-rich side accompanied the shift in the photoluminescence characteristic peak to a shorter wavelength, indicating an increase in the band gap. As long as the film composition is close to the stoichiometry, the breakdown field strength and the bulk resistivity showed adequate values for use as a gate dielectric layer down to $150^{\circ}C$ of the process temperature.