• 제목/요약/키워드: RF characteristics test

검색결과 105건 처리시간 0.031초

실리콘기판위에 양극접합된 MLCA의 기계적 특성 (Mechanical Characteristics of MLCA Anodic Bonded on Si wafers)

  • 김재민;이종춘;윤석진;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.160-163
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    • 2003
  • This paper describes on anodic bonding characteristics of MLCA(Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100 %, input power $1\;/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-008 %FS. Moreover, any damages or separation of MICA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MICA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

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파일렉스 #7740 글라스 매개층을 이용한 MEMS용 MCA와 Si기판의 양극접합 특성 (Anodic bonding characteristics of MCA to Si-wafer using pyrex #7740 glass intermediatelayer for MEMS applications)

  • 안정학;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.374-375
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    • 2006
  • This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

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CCD Pixel Correction Table Generation for MSC

  • Kim Young Sun;Kong Jong-Pil;Heo Haeng-Pal;Park Jong-Euk;Paik Hong-Yul
    • 대한원격탐사학회:학술대회논문집
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    • 대한원격탐사학회 2004년도 Proceedings of ISRS 2004
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    • pp.471-474
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    • 2004
  • Not all CCD pixels generate uniform value for the uniform radiance due to the different process of manufacture and each pixel characteristics. And the image data compression is essential in the real time image transmission because of the high line rate and the limited RF bandwidth. This pixel's nonuniformity and the loss compression make CCD pixel correction necessary in on-orbit condition. In the MSC system, the NUC unit, which is a part of MSC PMU, is charge of the correction for CCD each pixel. The correction is performed with the gain and the offset table for the each pixel and the each TDI mode. These correction tables are generated and programmed in the PMU Flash memory through the various image data tests at the ground test. Besides, they can be uploaded from ground station after onorbit calibration. This paper describes the principle of the table generation and the test way of the non-uniformity after NUC

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초생추 유래 Salmonella속균의 생물학적 특성 (Studies on Salmonella isolated from chicks)

  • 오강희;최원필
    • 대한수의학회지
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    • 제34권3호
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    • pp.501-510
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    • 1994
  • This paper deals with the distribution, reservoir and mode of spread of infection on 6 hatcheries in Taegu, Kyungpook and 5 broiler farms in Kyungpook during the period from June 1991 to June 1992. Isolated Salmonella were examined for serotypes, biotyping of Salmonella(S) typhimurtum, antibiotic susceptibility and some biochemical characteristics. Forty two Salmonella strains were isolated from 42(2.7% of 1,577 caecal samples of chicks, and their serotypes were S typhimurium 10, S typhimurium var Copenhagen 5, S infantis 4, S thompson 3, and untypable 20. The isolation rate of Salmonella varied from 0 to 5.1% in 6 hatcheries and that of Salmonella from 5 broiler farms was 10. 5%. Biotypes of 10 S typhimurium and 5 S typhimurium var Copenhagen strains isolated from chicks of hatcheries and broiler farms were biotype 2(86.6%), 8(6.7%), and 10a(6.7%), and 26i(6.7%) according to Duguid's scheme. Antibiotic susceptibility test of Salmonella isolated were performed by agar dilution method, using 9 antibiotics as follows: ampicillin(Am), chloramphenicol(Cm), gentamicin(Gm), kanamycin(Km), nalidixic acid(Na), rifampicin(Rf), streptomycin(Sm), sulfadimethoxine(Su), and tetracycline(Tc), All the strains were sensitive to RF. But 8 strans(23.8%) were resistant to one or more drugs and the most common resistance patterns of transferred R plasmids were SmSuGm and SmSu. Among 42 isolates, one had transferable citrate utilizing plasmid. S typhimurium and S typhimurium var copenhagen strains were resistant to killing by 90% normal guinea pig serum.

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Conventional UV 리소그라피와 경사각증착에 의한 0.5$mu$m 전력용 CaAs MESFET 제작에 관한 연구 (Studies on fabrication of 0.5$mu$m GaAs power MESFET's using a conventional UV lithography and angle evaporations)

  • 이일형;김상명;윤진섭;이진구
    • 전자공학회논문지A
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    • 제32A권12호
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    • pp.130-135
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    • 1995
  • GaAs power MESFET's with 0.5 .mu.m gate length using a conventional UV lithography and angle evaporations are fabricated and then DC and RF characteristics are measured and carefully analyzed. The 0.5$\mu$m GaAs power MESFET's are fabricated on epi-wafers which have an undoped GaAs layer inbetween n+ and n GaAs layers grown by MBE, and by the processes such as an image reversal(IR), air-bridge, and our developed 0.5 .mu.m gate fabrication techniques. The total gate widths of the fabricated 0.5$\mu$m GaAs power MESFETs are 0.6-3.0 mm, the current saturation of them 80-400 mA, the maximum linear and RF output power of them 60-265 mW. The current gain cut-off frequencies for the 0.5$\mu$m GaAs power MESFETs varies 13-16 GHz. For the test frequency of 10 GHz the maximum unilateral transducer power gains and the power added efficiencies of the GaAs power devices are 7.0-2.5 dB and 35.68-30.76 %, respectively.

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위상배열레이다용 초단파대역 송수신모듈의 설계 및 구현에 대한 연구 (A Study on the Design and Implementation of VHF band TRM for Phased Array Radar)

  • 김기중;신승규;장윤희
    • 한국전자통신학회논문지
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    • 제13권2호
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    • pp.321-326
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    • 2018
  • 본 연구는 RCS가 작은 목표물에 대한 탐지를 목적으로 하는 초단파대역 레이다의 송수신모듈 설계 및 구현에 대해 기술하였다. 사전 레이다 RF시스템의 송/수신단 시뮬레이션을 통하여 송수신모듈의 주요 규격에 대하여 사전 검증을 하였다. 송수신모듈의 제작 후 출력 특성, 잡음지수 등 주요특성에 대해서 만족여부를 확인하였다. 향후 송수신모듈 및 안테나 복사소자, 레이다 파형을 발생 및 수신하는 송수신기 등에 대해 조립을 완료하여 레이다 시스템 시험을 진행할 예정이다.

유리 기판과 패인 홈 모양의 홀을 갖는 웨이퍼를 이용한 웨이퍼 레벨 패키지 (Wafer Level Package Using Glass Cap and Wafer with Groove-Shaped Via)

  • 이주호;박해석;신제식;권종오;신광재;송인상;이상훈
    • 전기학회논문지
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    • 제56권12호
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    • pp.2217-2220
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    • 2007
  • In this paper, we propose a new wafer level package (WLP) for the RF MEMS applications. The Film Bulk Acoustic Resonator (FBAR) are fabricated and hermetically packaged in a new wafer level packaging process. With the use of Au-Sn eutectic bonding method, we bonded glass cap and FBAR device wafer which has groove-shaped via formed in the backside. The device wafer includes a electrical bonding pad and groove-shaped via for connecting to the external bonding pad on the device wafer backside and a peripheral pad placed around the perimeter of the device for bonding the glass wafer and device wafer. The glass cap prevents the device from being exposed and ensures excellent mechanical and environmental protection. The frequency characteristics show that the change of bandwidth and frequency shift before and after bonding is less than 0.5 MHz. Two packaged devices, Tx and Rx filters, are attached to a printed circuit board, wire bonded, and encapsulated in plastic to form the duplexer. We have designed and built a low-cost, high performance, duplexer based on the FBARs and presented the results of performance and reliability test.

UWB 병사통신 단말기의 구현 (Implementation of an UWB Terminal for Tactical Ad Hoc Networks)

  • 최한승;이현석;구명현;신정호
    • 전자공학회논문지
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    • 제50권5호
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    • pp.50-58
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    • 2013
  • 이 논문은 UWB 방식을 사용하는 병사통신용 단말기 구현 결과를 보여준다. 병사통신 망의 주요 특성들인 i)음성데이터가 주된 전송데이터이고, ii)보행자 수준의 이동 속도를 가지고, iii)높은 망의 안정성이 필요함을 고려하여 물리계층부터 응용계층까지 전 프로토콜 계층들을 설계하였다. 설계된 프로토콜 계층들은 RF ASIC, FPGA, DSP, GPP 등을 이용하여 소프트웨어와 하드웨어 형태로 구현되었다. 시험을 통해 구현된 단말기가 1대1 통신, 멀티홉 통신 환경에서 음성데이터를 정상적으로 전송함을 확인하였다.

Machine Learning for Flood Prediction in Indonesia: Providing Online Access for Disaster Management Control

  • Reta L. Puspasari;Daeung Yoon;Hyun Kim;Kyoung-Woong Kim
    • 자원환경지질
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    • 제56권1호
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    • pp.65-73
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    • 2023
  • As one of the most vulnerable countries to floods, there should be an increased necessity for accurate and reliable flood forecasting in Indonesia. Therefore, a new prediction model using a machine learning algorithm is proposed to provide daily flood prediction in Indonesia. Data crawling was conducted to obtain daily rainfall, streamflow, land cover, and flood data from 2008 to 2021. The model was built using a Random Forest (RF) algorithm for classification to predict future floods by inputting three days of rainfall rate, forest ratio, and stream flow. The accuracy, specificity, precision, recall, and F1-score on the test dataset using the RF algorithm are approximately 94.93%, 68.24%, 94.34%, 99.97%, and 97.08%, respectively. Moreover, the AUC (Area Under the Curve) of the ROC (Receiver Operating Characteristics) curve results in 71%. The objective of this research is providing a model that predicts flood events accurately in Indonesian regions 3 months prior the day of flood. As a trial, we used the month of June 2022 and the model predicted the flood events accurately. The result of prediction is then published to the website as a warning system as a form of flood mitigation.

RF 열플라즈마를 이용한 이차전지 음극재용 탄소나노실리콘복합소재 합성 (Synthesis of Carbon Nano Silicon Composites for Secondary Battery Anode Materials Using RF Thermal Plasma)

  • 이순직;김대신;연정미;박원규;신명선;최선용;주성후
    • 한국재료학회지
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    • 제33권6호
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    • pp.257-264
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    • 2023
  • To develop a high capacity lithium secondary battery, a new approach to anode material synthesis is required, capable of producing an anode that exceeds the energy density limit of a carbon-based anode. This research synthesized carbon nano silicon composites as an anode material for a secondary battery using the RF thermal plasma method, which is an ecofriendly dry synthesis method. Prior to material synthesis, a silicon raw material was mixed at 10, 20, 30, 40, and 50 wt% based on the carbon raw material in a powder form, and the temperature change inside the reaction field depending on the applied plasma power was calculated. Information about the materials in the synthesized carbon nano silicon composites were confirmed through XRD analysis, showing carbon (86.7~52.6 %), silicon (7.2~36.2 %), and silicon carbide (6.1~11.2 %). Through FE-SEM analysis, it was confirmed that the silicon bonded to carbon was distributed at sizes of 100 nm or less. The bonding shape of the silicon nano particles bonded to carbon was observed through TEM analysis. The initial electrochemical charging/discharging test for the 40 wt% silicon mixture showed excellent electrical characteristics of 1,517 mAh/g (91.9 %) and an irreversible capacity of 133 mAh/g (8.1 %).