• 한국전기전자재료학회논문지
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• 제17권3호
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• pp.340-347
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• 2004

Ultra-small size, high-performance, solenoid-type RF chip inductors utilizing low-loss A1$_2$O$_3$ core materials were investigated. The dimensions of the RF chip inductors fabricated were 1.0mm${\times}$0.5mm${\times}$0.5mm and copper coils were used. The materials (96％ A1$_2$O$_3$) and shape (I-type) of the core, the diameters (40${\mu}{\textrm}{m}$) and position (middle) of the coil, and the lengths (0.35mm) of solenoid were determined by a high-frequency structure simulator (HFSS) to maximize the performance of the inductors. The high-frequency characteristics of the inductance (L) and quality-factor (Q) of the developed inductors were measured using a RF impedance/material analyzer (E4991A with E16197A test fixture). The developed inductors exhibit an inductance of 11 to 11.3nH and a qualify factor of 22.3 to 65.7 over the frequency ranges of 250 MHz to 1.7 GHz, and show results comparable to those measured for the inductors prepared by Coilcraft$^{TM}$. The simulated data described the high-frequency data of the L and Q of the fabricated inductors well.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권11호
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• pp.501-507
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• 2003

In this study, microscale, high-performance, solenoid-type RF chip inductors were investigated. The size of the RF chip inductors fabricated in this work was 1.0${\times}$0.5${\times}$0.5㎣. 96% $Al_2$ $O_3$and I-type were used as the material and shape of the core, respectively. The copper (Cu) wire with 6 turns was employed as the coils. The diameter (40${\mu}{\textrm}{m}$) and position (middle) of the coil and the length (0.35mm) of solenoid were determined by a high-frequency structure simulator (HFSS) to maximize the performance of the inductors. High frequency characteristics of the inductance (L) and quality-factor (Q) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The inductors developed have inductances of 10.8nH and quality factors of 25.2 to 50 over the frequency ranges of 250MHz to l GHz, and show results comparable to those measured for the inductors prepared by CoilCraf $t^{Tm}$ . The simulated data predicted the high-frequency data of the L and Q of the inductors developed well.l.

• 한국전자파학회논문지
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• 제16권10호
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• pp.1020-1027
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• 2005

본 논문에서는 지능형 교통망(ITS)에 사용될 수 있도록 5.8 GHz 대역에서 경제적이며 초소형 RF 송신기 모듈을 구현하였다. LTCC 방식으로 설계하여 회로의 소형화와 함께 전기적 성능을 개선하였다. 제작된 모듈은 ASK 데이터 변조 장치, 주파수 합성기, 송신용 전력 증폭 회로 등으로 구성되었으며 모듈 크기는 0.8 CC이다. 측정결과 1.024 Mbps 데이터를 5.8 GHz의 주파수 대역으로 직접 ASK 변조시켜 출력 10 dBm 이상과 인접 채널 간섭비 -40 dBc 등의 RF 송신 성능을 나타낸다. 송신기의 신호원으로서 설계 제작된 주파수 합성기는 26 usec의 채널 이동시간(lock time)을 보여주며 중심 주파수에서 1 MHz 떨어진 지점에서 -115 dBc/Hz의 우수한 위상 잡음 특성을 나타낸다.

• 한국전기전자재료학회논문지
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• 제13권10호
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• pp.840-846
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• 2000

In this work, small-size, high-performance solenoid-type RF chip inductors utilizing a low-loss Al$_2$O$_3$core material were investigated. The size of the chip inductors fabricated in this work were 15$\times$10$\times$0.7㎣, 2.1$\times$1.5$\times$10㎣, and 2.4$\times$2.0$\times$1.4㎣ and copper (Cu) wire with 40 ㎛ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors were measured suing an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 7 have the inductance of 33 to 100nH and exhibit the self-resonant frequency (SRF) of .26 to 1.1 GHz. The SRF of inductors decreases with increasing the inductance and the inductors have the quality factor of 60 to 80 in the frequency range of 300 MHz to 1.1 GHz. In this study, small-size solenoid-type RF chip inductors with high inductance and high quality factor were fabricated successfully. It is suggested that the thin film-type inductor is necessary to fabricate the smaller size inductors at the expence of inductance and quality factor values.

• 한국재료학회지
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• 제9권11호
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• pp.1083-1087
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• 1999

마그네트론 스퍼터로 알루미나 기판위에 $\textrm{SnO}_2$박막을 증착하여 증착온도, rf 전력, 공정기체 중 산소분율(O$_2$/Ar)등 공정변수에 따른 박막의 미세구조와 가스검지 특성을 조사하였다. 증착된 박막의 미세구조는 결정성이 없는 비정질 구조(A), 비정질 기지 중에 결정이 분산된 구조(A=P), 방향성이 거의 없는 다결정 구조(P), 미세 기둥구조(FC), 조대한 기둥구조(CC), 고밀도 특성을 보이는 섬유상 구조(Zone T)의 6가지로 분류되었다. 공정 중 산소를 첨가하지 않았을 때, 저온, 낮은 rf 전력에서 A 구조가, 저온, 높은 rf 전력에서 A+P 구조가, 고온, 높은 rf 전력에서 P 구조가 형성되었고, 산소 첨가 시는 낮은 rf 전력, 저온에서 FC 구조가, 낮은 rf 전력, 고온에서 CC 구조, 높은 rf 전력, 저온에서 Zone T 구조가 형성되었다. 위의 미세구조를 가진 박막들을 센서로 제작하여 $200^{\circ}C$, $300^{\circ}C$, $400^{\circ}C$에서 CO 가스에 대한 민감도를 측정한 결과$200^{\circ}C$에서는 감도가 나타나지 않으며, $300^{\circ}C$, $400^{\circ}C$에서는 FC 구조를 가진 센서가 다른 미세구조를 가진 센서에 비해 우수한 감도를 나타냈다. 이는 미세한 column 들로 이루어진 FC 구조의 높은 비표면적으로 인해 산소와 피검가스의 흡착이 많아지게 되고, 가스흡착에 의한 저항변화, 즉 감도가 높게 나타나는 것으로 판단된다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제55권7호
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• pp.339-343
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• 2006

In this study, the variations of the important characteristics of solenoid-type RF chip inductors utilizing a low-loss A1203 core material on inductor dimensions were investigated systematically. Four dimensions of the chip inductors fabricated in this work were $1.0\times0.5\times0.5mm^3,\;1.5\times1.0\times0.7mm^3,\;2.1\times1.5\times1.0mm^3,\;and\;2.4\times2.0\times1.4mm^3$ and copper (Cu) wire with $40{\mu}m$ diameter was used as the coils. High frequency characteristics of the inductance, quality factor, and impedance of developed inductors as a function of inductor dimensions were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). It was observed that the developed inductors with the number of turns of 6 have the inductance (L) of 12 to 82 nH and exhibit the self-resonant frequency (SRE) of 3.6 to 1.2 GHz. The SRF of inductors decreases with increasing the inductor size while the L increases with the inductor size. The smallest inductors of $1.0\times0.5\times0.5mm^3$ exhibited the L of 12 nH, SRF of 3.6 GHz, and the quality factor of 67 near the frequency of 1.1 GHz. The calculated data predicted the high-frequency data of the L, and Q of the developed inductors well.

• KSTLE International Journal
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• 제9권1_2호
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• pp.31-35
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• 2008

DLC (Diamond Like Carbon) films have predominant tribological properties like a high hardness, low friction and high chemical resistance; therefore, DLC films are applied in a wide range of industrial fields. This paper evaluated the characteristics of DLC films deposited on bearing steel with different hardness by RF-PECVD (Radio Frequency - Plasma Enhanced Chemical Vapor Deposition) method. Si-interlayer was deposited on bearing steel to improve adhesion strength by RF-Sputtering method. The DLC film structures were analyzed with Raman spectra and Gaussian function. Adhesion strength of DLC films was measured with a scratch tester. Friction and wear test were carried out with a ball-on -disc type to investigate the tribological characteristics. Experimental results showed that DLC films deposited on bearing steel under same deposition condition have typical structure DLC films regardless of hardness of bearing steel. Adhesion strength of DLC film is increased with a hardness of bearing steel. Friction coefficient of DLC film showed lower at the high hardness of bearing steel.

• 마이크로전자및패키징학회지
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• 제8권4호
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• pp.11-15
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• 2001

본 연구에서는 RF-MEMS소자의 웨이퍼레벨 패키징에 적용하기 위한 밀봉 실장 방법에 대하여 연구를 하였다. 비전도성 B-stage에폭시를 사용하여 밀봉 실장하는 방법은 플립칩 접합 방법과 함께 MEMS 소자 패키징에 많은 장점을 줄 것이다. 특히 소자의 동작뿐만 아니라 기생성분의 양을 줄여야 하는 RF-MEMS 소자에는 더욱더 많은 장전을 보여준다. 비전도성 B-stage 에폭시는 2차 경화가 가능한 것으로 우수한 밀봉 실장 특성을 보였다. 패키징시 상부기관으로 사용되는 유리기판 위에 500 $\mu\textrm{m}$의 밀봉선을 스크린 프린팅 방식으로 패턴닝을 한 후에 $90^{\circ}C$와 $170^{\circ}C$에서 열처리를 하였다. 2차 경화 후 패턴닝된 모양이 패키징 공정이 끝날 때까지 계속 유지가 되었다. 패턴닝 후 에폭시 놀이가 4인치 웨이퍼에서 $\pm$0.6$\mu\textrm{m}$의 균일성을 얻었으며, 접합강토는 20 MPa을 얻었다. 또한 밀봉실장 특성을 나타내는 leak rate는 $10^{-7}$ cc/sec를 얻었다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.785-788
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• 2005

In this study, micro-scale, high-performance, solenoid-type RF chip inductors were investigated. The size of the RF chip inductors fabricated in this work was $1.0{\times}0.5{\times}0.5mm^3$ The material and shape of the core were 96% $Al_2O_3$ and I-type. The material and number of turn of coil were copper (Cu) and 6. The diameter ($40{\mu}m$) of coil and length (0.35mm) of solenoid were determined by a Maxwell three-dimensional field simulator to maximize the performance of the inductors. High frequency characteristics of the inductance (L) and quality-factor (Q) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The inductors developed have inductances of 10.8nH and quality factors of 25.2 at 250MHz, and show results comparable to those measured for the inductors prepared by CoilCraftTm that is one of the best chip inductor company in the world. The simulated data predicted the high-frequency data of the Land Q of the inductors developed well.

• 전자공학회논문지
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• 제54권5호
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• pp.123-127
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• 2017

본 논문에서는 FET의 채널저항을 이용한 이미지 제거 혼합기를 제작하여 그 특성을 분석하였다. 이 혼합기는 IF 50MHz~90MHz, LO 8.17GHz 및 RF 8.08GHz~8.12GHz로써 8GHz대역의 64QAM에 적용할 수 있도록 하였다. 측정 결과 -20dBm의 IF 신호와 10dBm의 LO 신호를 인가하였을 때 -33.2dBm의 RF 출력을 얻었으며, 약 12.9dB의 변환손실을 보였으며, 8.1GHz RF 신호에 대하여 LO 신호는 14.3dB, 이미지 신호는 10.4dB의 억압특성을 얻을 수 있었다. 또한 2-tone실험 결과 51.7dBc의 IMD 특성을 얻을 수 있었다.