• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.902-905
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• 2006

This paper presents a new RF testing scheme based on a design-for-testability (DFT) method for measuring functional specifications of RF integrated circuits (IC). The proposed method provides input impedance. gain, noise figure. input voltage standing wave ratio (VSWR) and output signal-to-noise ratio (SNR) of a low noise amplifier (LNA). The RF test scheme is based on theoretical expressions that produce the actual RF device specifications by output DC voltages from the DR chip.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.15 no.3
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• pp.632-638
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• 2011

This paper presents on-chip Design-for-Testability (DFT) circuit for radio frequency System-on-Chip (SoC) applications. The proposed circuit measures functional specifications of RF integrated circuits such as input impedance, gain, noise figure, input voltage standing wave ratio (VSWRin) and output signal-to-noise ratio (SNRout) without any expensive external equipment. The RF DFT scheme is based on developed theoretical expressions that produce the actual RF device specifications by output DC voltages from the DFT chip. The proposed DFT showed deviation of less than 2% as compared to expensive external equipment measurement. It is expected that this circuit can save marginally failing chips in the production testing as well as in the RF system; hence, saving tremendous amount of revenue for unnecessary device replacements.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.18 no.5
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• pp.223-228
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• 2018

In this paper the water sensor using a coaxial cavity resonator is designed and manufactured. The water sensor which can sense water drop linearly has been constructed with voltage controlled oscillator(VCO), coaxial cavity resonator, RF switch, RF detector, A/D converter, DAC and micro controller. The operating frequency range of the designed water sensor is from 2.5GHz to 3.2GHz and the input voltage and current source are 24[V/DC] and 1[A]. The designed sensor circuit includes VCO, RF switch, RF detector which varies the frequency characteristics of the devices in the high frequency of 3GHz. And so we should correct the error of the frequency characteristics of those devices in the sensor circuit. To do this, we make the reference path which switches the signals to the RF detector directly without sending it to the resonator. According to the result of simulation and measurement, we can see that there is 0-50MHz difference between simulated resonator frequency and manufactured resonator frequency.

• Journal of the Korean Institute of Telematics and Electronics S
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• v.35S no.9
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• pp.19-27
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• 1998

The Transmitter part of single RF transceiver chip for an extended GSM handset application was circuit-designed, fabricated adn evaluated. The RF-IC Chip was processed by 0.8${\mu}m$ Si BiCMOS, 80 pin TQFP of $10 {\times} 10mm$ size, 3.3V operated RF-IC reveals, in general, quite reasonable integrity and RF performances. This paper describes development resuts of RF transmitter section, which includes IF/RF up-conversion mixer, IF/RF polyphase and pre-amplifier. The test results show that RF transmitter section is well operated within frequency range of 880~915MHz, which is defined on the extended GSM(E-GSM) specification. The transmitter section also reveals moderate power consumption of 71mA and total output power of 8.2dBm.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.7 no.1
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• pp.83-91
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• 1996

The SPICE circuit analysis program has a limited math capability and, in general, cannot be used for RF and microwave simulation because a complex arithmetic is required to compute S-parameters from node voltages. This paper presents two test bench models that can be used to obtain node voltages proportional to incident, reflected, and transmitted signals. From SPICE computed node voltages, S-parameters are computed using the math capability of the PSPICE post processor, PROBE, as an example for a low-pass filter consisting of transmission line sections. The results of this example are compared with another high frequency circuit analysis program, TOUCHSTONE. The difference between the results of these two programs in magnitude was less than 0.003 and in phase was a few tenths of a degree. By using these test benchs to simulate a filter, RF and microwave analysis can be made with the SPICE, which can be a cost-effective and readily available computational tool for educators and practicing engineers.

• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.2
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• pp.60-70
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• 2002

최근 고성능/고집적 RF 소자 및 시스템들의 경박 단소화 추세에 따라 RF 무선 통신 분야에도 초소형미세 가공 기술인 MEMS 기술이 크게 주목받고 있다. 이에 본 고에서는 RF 부품 및 시스템을 MEMS 기술로서 실장하는 RF MEMS 패키지 기술에 대하여 간단히 살펴보았다. 우선, 실리콘 기반의 MEMS 패키지가 우수한 열 전달 특성과 저 손실의 고주파특성으로 인해 RF 시스템의 실장에 매우 적합함을 확인하였다. 또한, MEMS 기술을 이용함으로써 RF회로와 패키지 제작 공정이 동시에 이루어질 수 있도록 하는 일괄터리공정에 대하여 소개하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.638-646
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• 2005

In recent wireless communications, direct conversion transceiver or If sampling SDR-based receivers have being designed as an alternative to conventional transceiver topologies. In direct conversion receiver a.chitectu.e, the 1.equency/phase offset between the RF input signal and the local oscillator signal is a major impairment factor even though the conventional AFC/APC compensates the service deterioration due to the offset. To rover the limited tracking range of the conventional method and effectively aid compensation scheme in terms of I/Q channel imbalances, the frequency/phase offset compensation in RF-front end signal stage is proposed in this paper. In RF-front end, the varying phase offset besides the fixed large frequency/phase offset are corrected by using early-late phase compensator. A more simple frequency and phase tacking function in digital signal processing stage of direct conversion receiver is effectively available by an ingenious frequency/phase offset tracking method in RF front-end stage.

• Proceedings of the Optical Society of Korea Conference
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• 2002.11a
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• pp.214-215
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• 2002

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.133-133
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• 2010

중성입자빔 입사장치(neutral beam injection, NBI)의 중성빔 에너지 효율은 이온원의 수소 이온밀도 분율이 결정한다. 이온원에서 만들어진 $H^+$, $H_2^+$ 그리고 ${H_3}^+$는 중성화 과정(neutralization) 중 해리(dissociation) 때문에 각각 입사 에너지의 1, 1/2 그리고 1/3을 가진 중성입자가 된다. 중성빔 에너지 효율 제고하기 위해서는 이온원의 전체 이온 중 단원자 수소 이온 밀도 증가가 필요하다. 유도결합형 수소 플라즈마 이온원에서 RF 안테나 주파수에 따른 플라즈마 밀도와 단원자 수소 이온 밀도 비율 변화를 관찰하였다. RF 플라즈마에서 가스 압력이 결정하는 전자의 운동량 전달 충돌 주파수 대비 높은 RF 안테나 주파수(13.56 MHz)와 낮은 RF 안테나 주파수(수백 kHz)의 전력을 인가하였으며, Langmuir 탐침, 안테나 V-I 측정기 그리고 QMS(quadrupole mass spectrometer)을 이용하여 플라즈마 특성을 진단하였다. 플라즈마 밀도와 수소 이온 밀도 분율은 플라즈마 가열 메커니즘과 수소 플라즈마 내 반응 메커니즘에 의해 결정된다. 플라즈마 가열 메커니즘에 따른 실험 결과에 대한 RF 안테나 주파수 효과는 플라즈마 트랜스포머 회로 모델을 통해 해석하였으며, 수소 플라즈마 내 반응은 0-D 정상 상태의 입자 및 전력 평형 방정식 결과로 해석하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.423-424
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• 2011

This paper has proposed a 920 MHz RF front-end for IEEE 802.15.4g SUN (Smart Utility Network) systems. The proposed 920 MHz RF front-end consists of a driver amplifier, a low noise amplifier, and a RF switch. In the TX mode, the driver amplifier has been designed as a single-ended topology to remove a transformer which causes a loss of the output power from the driver amplifier. In addition, a RF switch is located in the RX path not the TX path. In the RX mode, the proposed low noise amplifier can provide a differential output signal when a single-ended input signal has been applied to. A LC resonant circuit is used as both a load of the drive amplifier and a input matching circuit of the low noise amplifier, reducing the chip area. The proposed 920 MHz RF Front-end has been implemented in a 0.18-um CMOS technology. It consumes 3.6 mA in driver amplifier and 3.1 mA in low noise amplifier from a 1.8 V supply voltage.