• Journal of the Korean Vacuum Society
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• v.2 no.2
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• pp.209-219
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• 1993

Evaporated Al/Pd thin films were irradiated with various doses to produce intermetallic compounds. In order to study the first phase formation and phase sequence, RBS and TEM studies have been used. It was found that the initial phase formed by irradiation of $5{\times}10^{15}Ar^+/cm^2$ was $Al_3Pd_2$, while $1.5{\times}10^{16}Ar^+/cm^2$ gave the subsequent phase of AlPd. This phenomenon was analysed using effective heat of formation (${\Delta}$H') model. The experimental results agree with that predicted by effective heat of formation model. This model has been extended to predict the first phase formation and phase sequence by ion beam mixing in metal/Si systems as well as metal-metal systems.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• Korean Journal of Crystallography
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• v.19 no.1
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• pp.7-13
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• 2008

고체 표면의 구조해석 방법에는 LEED(저에너지 전자선 회절법)나 RHEED(반사 고에너지 전자선 회절법) 등과 같이 표면의 2차원적 회절상을 해석하는 방법이 있고(역격자 공간의 해석), 또는 ISS(이온산란 분광법), RBS(러더포드 후방산란법) 등과 같이 표면 원자의 실공간에 대한 정보를 직접 얻는 방법이 있다. 실제로는 두 가지 종류의 분석법을 상호 보완적으로 조합하여 효율적인 구조해석을 수행한다. 본고에서는 직충돌 이온산란 분광법(ICISS: Impact Collision Ion Scattering Spectroscopy)에 대한 원리, 장치, 측정방법 등을 소개한 전고에 이어서 이를 이용한 반도체 표면구조 해석에 관하여 기술하고자 한다. 표면의 원자구조를 알아내기 위해서는 산란된 입자의 강도를 입사각도와 출사각도에 대하여 조사하여야 하는데, 이온이 원자와 충돌하여 산란될 때 원자의 후방으로 형성되는 shadow cone에 의하여 생성되는 집속 효과(focusing effect) 및 가리움 효과(blocking effect) 중에서 ICISS는 집속 효과만을 고려하여 해석하면 실공간에서의 원자구조를 해석할 수 있다. 본 고에서는 ICISS를 이용하여 금속 또는 절연체 물질이 반도체 표면 위에서 흡착 또는 성장될 때 초기의 계면 구조 해석, 금속/반도체 계면에서 시간에 따른 동적변화 해석, III-V족 반도체의 표면구조 해석, 반도체 기판 위에서 박막 성장 과정 해석 등에 관한 연구 사례를 소개하고자 한다.

• Journal of the Korean Vacuum Society
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• v.5 no.1
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• pp.25-32
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• 1996

An ERD-TOF system is constructed for the nondestructive depth profiling of light elements in thin films in the range of several thousand angstroms. The particles, recoiled by 10 $MeV^{35}Cl$ projectiles, were detected by a Time-Of-Flight spectrometer composed of a MCP (Micro Channel Plate) and a SSB (Silicon Surface Barrier) detector. A two parameter data acquisition system composed of two PC's was constructed for registering simultaneous time and energy signals. A $Si_3N_4$/poly-Si/$SiO_2$/Si sample was anlayzed and the result is compared with RBS. The detection limit, maximum probable depth and depth resolution for light elements in silicon are about $4\times10^{14}atoms/\textrm{cm}^2$, 5, 000$\AA$ and 100$\AA$, respectively.

• Journal of the Korean institute of surface engineering
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• v.27 no.5
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• pp.253-260
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• 1994

Ta-N films were reactively sputter deposited by dc magnetron sputtering from a Ta target with a various Ar-N, gas ratio. Electrical resistivity of pure Ta film was 150$\mu$$\Omega$cm and decreased initially with nitrogen addition, and then increased to a value of 220$\mu$$\Omega$-cm~260$\mu$$\Omega$-cm at 9%~23% nitrogen partial flow. Rutherford backscattering spectrometry(RBS) and Auger electron spectroscopy (AES) analysis show that nitrogen content in the film is increased with the nitrogen partial flow. The film contains 58at.% nitrogen at 36% nitrogen partial flow. Both the phase and the microstructure of the as-deposisted films were investigated by x-ray diffractometry(XRD) adn transmission electron microscopy (TEM) at various nitrogen content. The phase of pure Ta film is identified as $\beta$-Ta with a 200$\AA$~300$\AA$ grain size. The phase of Ta film is changed to bcc-Ta as small amount of nitrogen is added. Crystalline Ta2N film was deposited at 24at.% nitrogen content. Amorphous phase is formed over a range of nitrogen content from about 33at.% to 35at.% while crystalline fcc-TaN is observed to form at 39at.%~48at.% nitrogen content.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.68-68
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• 2000

펄스레이저 증착법(이하 PLD)을 이용하여 마이크로파 유전체 소자 및 절연 산화막으로의 응용을 위한 MgTiO3 박막을 다양한 기판상에서 증착하였다. 사파이어 기판에 (a,c-plane Al2O3) 성장된 MgTiO3 박막은 에피텍셜 성장(epitaxial growth)이 되었으며, SiO2/Si 및 Pt/Ti/Si 기판위세 성장된 MgTiO3 박막의 경우 003방향으로 배향(oriented) 되었다. MgTiO3 박막은 450~75$0^{\circ}C$까지 기판온도를 변화시키면서 증착시켰으며, 증착시 산소분압은 50~200 mTorr로 변화시켰다. PLD 증착시 타켓에 조사된 레이저 에너지 밀도는 약 2J/cm2였으며, MgTiO3 박막 증착후 200Torr O2 분위기에서 상온까지 1$0^{\circ}C$/min 의 속도로 냉각시켰다. 사파이어 c-plane 상에서 일머나잇(ilminite) MgTiO3 구조가 55$0^{\circ}C$ 에피텍셜 성장하는 것을 관찰할 수 있었으며, 사파이어 a-plane 상에서는 MgTiO3 구조가 $650^{\circ}C$ 이상부터 110방향으로 배향되며 성장하였다. $600^{\circ}C$ 이상에서 c-축으로 배향된 구조를 갖고 있었다. 증착된 MgTiO3 박막의 조성분석(stoichio metric analysis)을 위해 RBS 분석을 수행하여, 증착에 이용된 타켓과 동일한 조성을 갖는 MgTiO3 박막이 성장된 것을 확인할 수 있었다. 사파이어 기판상에 증착된 MgTiO3 박막은 가시영역에서 투명하였으며, 약 270nm 파장을 갖는 영역에서 급격한 흡수단을 보였다. 이때의 MgTiO3 박막은 AFM 분석을 통해 약 0.87mn rms roughness 값을 갖는 매우 평탄한 표면구조를 갖고 있는 것을 확인하였다. MIM(Pt/MgTiO3/Pt) 구조의 캐패시터를 형성시켜 MgTiO3 박막의 유전특성(dielectric properties)을 관찰하였다. PLD로 성장된 MgTiO3 박막의 유전율(relative dielectric constant)은 약 22였으며, 1MHz에서 약 1.5%의 유전손실(dielectirc loss) 값을 보였다. 또한 이때 MgTiO3 박막은 낮은 유전분산값을 보였다.

• Korean Journal of Construction Engineering and Management
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• v.5 no.2 s.18
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• pp.115-122
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• 2004

This study identifies various risk factors associated with activities of early construction stage, then establishes the Risk Breakdown Structure(RBS) by classifying the risks into the three groups; Common risks, risks for Earth works, and risks for Foundation works. The Common risks are identified and classified by considering various aspects of the early construction stage such as financial, political, constructional aspects, etc. The risks for Earth works and Foundation works are identified in detail by surveying technical specifications, relevant claim cases and interviewing with experts. These risks are classified based on the Wok Breakdown Structure(WBS) of the early construction stage. The WBS presented in this study classifies the works of early construction stage into four categories; excavation, sheeting works, foundation works, footing works. This study suggests a risk analysis method using fuzzy theory for construction projects. Construction risks are generally evaluated as vague linguistic value by subjective decision making. Fuzzy theory is a proper method to quantify vague conditions of construction activities. Therefore, this study utilizes fuzzy theory to analyse construction risks. The weight of risks is estimated by reflecting the interrelationship among risk factors from absolute weights obtained by fuzzy measure into the relative weights by Analytical Hierarchy Process(AHP). The interrelationship is estimated by Sugeno-fuzzy measure.

• Journal of the Korean Vacuum Society
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• v.5 no.4
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• pp.359-364
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• 1996

$SrTiO_3$ thin films were deposited on Pt/Ti/$SiO_2$/Si substrates at low temperatures below $300^{\circ}C$ by r.f. magnetron sputtering. The materials and the electrical properties of the deposited films were investigated with controlling deposition parameters such as substrate temperature(T_s) and positive substrate d.c. bias voltage. Stoichiometric $SrTiO_3$ films were obtained at Ts of $300^{\circ}C$, but Sr content in the film was less than that of a target when Ts was lower than $300^{\circ}C$, resulting in poor electrical properties. By introducing a positive substrate d.c. bias during deposition, the crystallinity and the dielectric properties of the films were markedly improved. 400 nm thick $SrTiO_3$, films deposited at $300^{\circ}C$ with a positive substrate d.c. bias of 20V showed a columnar structure with <211> crystallographic direction and a dielectric constant of 98.

• Journal of the Korean Magnetics Society
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• v.11 no.3
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• pp.97-103
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• 2001

Polycrystalline thin films of La$_{2}$3/Sr$_{1}$3/MnO$_3$(LSMO) were prepared by water-based sol-gel processing on thermally oxidized Si(100) substrate. The thickness dependence of the low-field tunnel-type magnetoresistance properties at room temperature was studied. Tunnel-type magnetoresistance at low-field is found to be strongly dependent on film thickness. Maximum value of tunnel-type magnetoresistance of LSMO thin films was appeared at the film thickness of ~1500 $\AA$. This behavior can be explained in terms of dead layer between LSMO thin film and Si(100) substrate and thermal lattice strain effect in the LSMO thin films.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.274-274
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• 2016

터치스크린패널로 응용하기 위하여 80%이상의 높은 투과도와 낮은 저항이 요구된다. 그 중에서도 무반사 효과 (anti-reflective, AR) 를 크게하여 투과도를 향상시키는 방법으로 나노구조물, 증착시 경사각, 다층박막 방법 등이 연구 개발되고 있다. 단일 박막을 이용하여 무반사 코팅을 하는 경우, 정밀한 굴절률 조절이 어려우며 낮은 반사율 영역의 선폭이 좁은 단점이 있다. 반면, 저/고굴절률 다층박막의 경우 비교적 굴절률 조절이 용이하고 가시광영역 전반적으로 높은 투과도를 가질 수 있다. plasma enhanced chemical vapor deposition (PECVD) 증착법을 이용하여 무반사 효과를 증대시키기 위해 저/고굴절률 다층구조의 박막을 두께조합에 따라 평가하였으며, 가장 널리 사용되고 있는 Sputtering증착법과 비교하여 연구하였다. 제작된 다층박막의 구조는 glass(sub.)/SiN/SiO2/ITO 이며, 무반사 코팅층인 SiN/SiO2층은 각각 PECVD와 Sputtering 증착법을 통해 성장되었고, ITO는 스퍼터링 증착법을 이용하여 동일하게 성장하였다. 그 결과 PECVD 증착법이 Sputtering 증착법에 비하여 가시광영역(400~800nm)에서 더 높은 투과도를 얻게 되었다. 결과의 차이에 대해서 PECVD 증착법과 Sputtering 증착법으로 성장된 SiN, SiO2 박막의 광학적 특성과 물리적 특성의 변화를 spectroscopic ellipsometry (SE), Rutherford backscattering (RBS), atomic force microscopy (AFM) 을 이용하여 비교, 분석하였다.