• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.1
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• pp.23-32
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• 1997

The change in moisture content of moisture sensitive products in moisture-semipermeable packages was investigated for the purpose of predicting the shelf life of a product-package combination. A mathematical model, and a computer program based on the physiochemical properties of the product and the moisture permeability of the package was developed. The moisture content for products in moisture-semipermeable packages was determined under various environmental conditions and the results were compared with the predicted values by means of the simulation model. These experimental studies demonstrated that the prediction of the change in moisture content of packaged products over time by the simulation model is accurate, within a practical range of temperature and relative humidity values. The developed semi-empirical model is considered to have applications in industry, since it provides product shelf life information for a range of temperature and relative humidity conditions, with a limited number of experimentally obtained data points.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.67-79
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• 2007

• Proceedings of the Korean Nuclear Society Conference
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• 2005.05a
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• pp.713-714
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• 2005

• Proceedings of the Korean Nuclear Society Conference
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• 2005.10a
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• pp.665-666
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• 2005

• Communications for Statistical Applications and Methods
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• v.29 no.3
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• pp.393-396
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• 2022

• Proceedings of the KWS Conference
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• v.43
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• pp.58-60
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• 2004

In the field of welding the behavior of a welded structure under consideration may be predicted via heat transfer and residual stress analysis. In order to facilitate the industrial applications of welding, numerical modeling of heat transfer and residual stress in weldment has been carried out applying Finite Element Method (FEM) and the analysis with the external load including this residual stress due to welding has been done. The present work includes the specialized finite element codes for the calculation of nonlinear heat transfer details and residual stress redistributed along with the external load in the welded structures. A basic interface, which allows models, built in commercial preprocessing package access to the data necessary to build standard input decks for these specialized FEM codes, which are not supported by commercial package. The results from the FEM codes are imported back into commercial package for visualization. In addition the residual stress values are exported to commercial package (such as ANSYS, PATRAN etc.) for further analysis with the external loads, which make the FEM codes fully applicable to the industrial purpose.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2005.06a
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• pp.457-463
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• 2005

KHNP(Korea Hydro and Nuclear Power Ltd., Co.) is developing a HIC transport package which is satisfying domestic and IAEA regulations and NETEC(Nuclear Environment Technology Institute) is conducting a conceptual design. In this study, the shielding thickness was calculated using the data from radionuclide assay program which is currently using in nuclear sites and Micro Shield code. Considering the structural safety, carbon steel was chosen as shielding material and the shielding thickness was calculated for 500 R/hr and 100 R/hr at HIC surface, respectively. Through the shielding analysis, it was evaluated that the regulation limit is satisfied when the shielding thickness is 22 cm for 500 R/hr and 17 cm for 100/hr.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.17-20
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• 2003

The EMC's rheological effects on molding process are evaluated in this study. When considering mold processing for IC packages, the major concerning items in current studies are incomplete fill, severe wire sweeping and paddle shifts etc. To simulate EMC's fast curing rheokinetics with 3D mold flow behavior, one should select appropriate rheometry which characterize each EMC's rheological motion and finding empirical parameters for numerical analysis current studies present the new rheometry with parallel plate rheometry for reactive rheokinetic experiments, the experiment and numerical analysis is done with the commercial higher filler loaded EMC for the case of Thin Quad Plant Packages (TQFP) with package thickness below 1.0 mm. The experimental results and simulation results based on new rheometry matches well in point of the prediction of wire sweep, filling behavior of melt front advancement and void trapping position.

• Korean Journal of Food Science and Technology
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• v.31 no.2
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• pp.441-447
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• 1999

Changes in flavor characteristics of roasted coffee in 6 package models during storage were investigated by GC/MS analysis and sensory evaluation to establish the criteria of the shelf-life of the roasted coffee in three flavor quality-'fresh', 'satisfying' and 'minimally acceptable' levels. In direct headspace method of GC/MS, 47 volatile compounds were analyzed and the light volatile compounds were reduced sharply at initial stage of storage and faster in the package with air. The correlation between % retention of 2,3-butanedione and overall aroma of roasted coffee showed good linear-relation, of which correlation coefficient (R) were from 0.999 to 0.904 depending on package models, indicating that 2,3-butanedione would be an index chemical for evaluating the freshness of roasted coffee. In sensory evaluation of 6 package models during storage, roasted whole beans (RB) and roasted and ground (RG) coffee in air-package were preserved in 'fresh quality' for $0.5{\sim}1$ week, 'satisfying quality' for $2{\sim}3$ weeks and 'minimally acceptable quality' for 12 weeks, while roasted whole beans in valve-package and roasted and ground coffees in vacuum-package, nitrogen-package and oxygen absorbent-package were preserved in 'fresh quality' for $2{\sim}4$ weeks, 'satisfying quality' for $12{\sim}24$ weeks and 'minimally acceptable quality' for 52 weeks. The oxygen absorbent-package was slightly less effective than other three methods.