• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.6
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• pp.591-598
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• 2006

The research was tried to investigate the hydrogen generation from water by the pulsed power plasma process. Hydrogen was generated by way of the electrical pulse power discharge process with the ultrasonic wave. The yield on the hydrogen generation was also studied with and without operating the ultrasonic generator, in which the applied high voltage was varied from 10 kV to 15 kV. Nitrogen and argon gases were used as working gases. As the results, the generation yield using the pure nitrogen gas is better than argon and mixed gases such as argon and nitrogen. Hydrogen concentration are significantly increased when the ultrasonic generator was operated with the electrical discharge simultaneously. It is increased with increasing the applied ultrasonic level as well.

• Journal of Adhesion and Interface
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• v.7 no.1
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• pp.23-29
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• 2006

Polymer thin films of pentafluorostyrene (PFS) were prepared by RF plasma (13.56 MHz) polymerization in continuous wave (CW) mode, as a function of plasma power and monomer pressure. Conditions for film preparation were optimized by measuring the solvent resistance of plasma polymer thin films in DMAc, NMP, THF, acetone and chloroform, as well as by evaluating the optical clarity via UV-VIS measurements. Pulsed mode plasma polymerization was also utilized to enhance the optical properties of the films by varying the period of on-time and duty cycle. Finally, the films were subjected to refractive index measurements and analyzed by ${\alpha}$-step, TGA and FT-IR.

• Proceedings of the Korean Geotechical Society Conference
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• 2010.03a
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• pp.832-839
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• 2010

The pulse discharge anchor is a method to increase the capacity of anchors using electric discharge geotechnical technologies, which is also known as pulse discharge and electric-spark technologies. The pulse discharge anchor has bulbed bond length that is expanded by high voltage electrokinetic pulse energy. 24 anchors were installed in the weathered soil and sandy clay at the Geotechnical Experimentation Site at Sungkyunkwan University in Suwon, Korea and attached strain gauge at 10 anchors. The numerical predictions by Beam-Column analysis were compared with observed measurements in a field load test.

• Journal of Mechanical Science and Technology
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• v.20 no.10
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• pp.1680-1690
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• 2006

As a promising and novel manufacturing technology, laser aided direct metal deposition (DMD) process produces near-net-shape functional metal parts directly from 3-D CAD models by repeating laser cladding layer by layer. The key of the build-up mechanism is the effective control of powder delivery and laser power to be irradiated into the melt-pool. A feedback control system using two sets of optical height sensors is designed for monitoring the melt-pool and real-time control of deposition dimension. With the feedback height control system, the dimensions of part can be controlled within designed tolerance maintaining real time control of each layer thickness. Clad nugget shapes reveal that the feedback control can affect the nugget size and morphology of microstructure. The pore/void level can be controlled by utilizing pulsed-mode laser and proper design of deposition tool-path. With the present configuration of the control system, it is believed that more innovation of the DMD process is possible to the deposition of layers in 3-D slice.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.23 no.9
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• pp.1079-1086
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• 2012

In this paper, X-band 60 W Solid-State Power Amplifier with sequential control circuit and pulse width variation circuit for improve bias of SSPA module was designed. The sequential control circuit operate in regular sequence drain bias switching of GaAs FET. The distortion and efficiency of output signals due to SSPA nonlinear degradation is increased by making operate in regular sequence the drain bias wider than that of RF input signals pulse width if only input signal using pulsed width variation. The GaAs FETs are used for the 60 W SSPA module which is consists of 3-stage modules, pre-amplifier stage, driver-amplifier stage and main-power amplifier stage. The main power amplifier stage is implemented with the power combiner, as a balanced amplifier structure, to obtain the power greater than 60 W. The designed SSPA modules has 50 dB gain, pulse period 1 msec, pulse width 100 us, 10 % duty cycle and 60 watts output power in the frequency range of 9.2~9.6 GHz and it can be applied to solid-state pulse compression radar using pulse SSPA.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.46 no.12
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• pp.14-21
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• 2009

In this paper, a Ka-band 10 W power amplifier module with seven power MMIC bare dies is designed and fabricated using MIC technology which combines multiple MMIC chips on a thin film substrate. Modified Wilkinson power dividers/combiners and CBFGCPW-Microstrip transitions for suppressing resonance and reducing connection loss are utilized for high-gain and high-power millimeter wave modules. A new TTL pulse timing control scheme is proposed to improve output power degradation due to large bypass capacitors in the gate bias circuit. Pulse-mode operation time is extended more than 200 nsec and output power increase of 0.62 W is achieved by applying the proposed scheme to the Ka-band 10 W power amplifier module operating in the pulsed condition of 10 kHz and $5\;{\mu}sec$. The implemented power amplifier module shows a power gain of 59.5 dB and an output power of 11.89 W.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.3
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• pp.295-305
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• 2018

We present a passively Q-switched monolithic Er:Yb:glass microchip laser developed in our lab. The microchip laser can produce pulses at 1535 nm of the 'eye-safe' wavelengths with the pulse energy of 50 uJ and the pulse width of 4-6 ns. Using the laser we also designed and developed a pulsed Er:Yb:glass microchip laser rangefinder. Expressions for background and signal power, noise, and signal-to-noise ratio are reviewed. A computer simulation was used to optimize laser power, receiver aperture, and preamplifier bandwidth for the efficient system design of the laser rangefinder. Experimental results are presented to compare with the theory.

• Proceedings of the KIPE Conference
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• 2018.07a
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• pp.48-50
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• 2018

본 논문은 광물 탐사용 25kW 양극성 펄스전원장치에 대해 기술한다. 고효율 LCC 공진형 컨버터와 풀 브리지 기반 바이폴라 펄스 스위칭부로 구성된 500V, 12.5A 단위 모듈을 설계한다. LCC 공진형 컨버터는 도전 손실을 줄이기 위해 사다리꼴 모양의 공진 전류를 갖도록 하고, 높은 전력 밀도를 달성하기 위해 변압기의 누설 인덕턴스를 공진 인덕턴스로 활용한다. 또한, 반복적인 짧은 펄스 기반으로 설계된 게이트 구동 회로는 DC에서 8kHz의 주파수 범위를 동작시키고 게이트 변압기의 사이즈를 줄이기 위해 제안된다. 개발된 양극성 펄스전원장치는 4개의 모듈이 직병렬로 결선되어 부하 조건에 따라 Grounded dipole mode (2kV, 12.5A) 또는 Loop mode (500V, 50A)로 동작한다. 네 모듈의 출력 전압 밸런싱을 충족시키기 위해 LCC 공진형 컨버터의 변압기에 보상권선이 감긴다. 본 논문에서는 양극성 펄스전원 장치의 상세설계에 대해 기술하고, 시뮬레이션 및 실험 결과를 통해 이를 검증한다.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.335-339
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• 2018

The optical characteristics of a terahertz (THz) antenna-coupled bolometer (ACB) detector were evaluated using a pulsed quantum cascade laser (QCL) and radiation blackbody sources. We investigated a method for measuring the responsivity and noise-equivalent power (NEP) of the THz detector using two different types of light sources. When using a QCL source with a frequency of 3 THz, the average responsivity of 24 devices was $1.44{\times}10^3V/W$ and the average NEP of those devices was $3.33{\times}10^{-9}W/{\surd}Hz$. The average responsivity and NEP as measured by blackbody source were $1.79{\times}10^5V/W$ and $6.51{\times}10^{-11}W/{\surd}Hz$, respectively, with the measured values varying depending on the light source. This was because the output power of each light source was different, with the laser source being driven by a pulse type wave and the blackbody source being driven by a continuous wave. The power input to the THz sensor was also different. Futhermore, the responsivity and NEP values measured using band pass filter (BPF) were similar to those measured when using only THz windows. It was found that ACB sensor responds normally in the THz region to both the laser and the blackbody source, and the method was confirmed to effectively evaluate the characteristics of the THz sensor.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.155.2-155.2
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• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.