• Journal of Korean Society of Water and Wastewater
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• v.25 no.6
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• pp.861-867
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• 2011

Wastewater from crude oil reserve base usually contains large amount of non-biodegradable contaminants. The conventional wastewater treatment progress can hardly meet the regulation of wastewater effluent quality. This study investigated the removal of non-biodegradable organic contaminants in wastewater from crude oil reserve base using a pulse UV treatment. The modified process incorporating pulse UV process was set up to treat the wastewater from crude oil reserve base. The treatment process is composed with coagulation and flocculation, micro-bubble flotation, sand filter, pulse UV system, and GAC filter. The results show CODMn was effectively removed by the process with pulse UV system and it can meet the wastewater effluent regulation. The single effect of pulse UV process in CODMn removal was not significant(9~15% based on sand filtered effluent), however with the subsequent activated carbon filter the removal ratio CODMn was increased up to 28% compared to the process without pulse UV syetem.

• Journal of Korean Society of Water and Wastewater
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• v.23 no.1
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• pp.69-75
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• 2009

The characteristics of disinfection and organic removal were investigated with pulse UV lamp in this study. The intensity and emission wavelength of pulse UV Lamp were compared with low pressure UV lamp. The emission spectrum range of pulse UV lamp was between 200 and 400 nm while the emission spectrum of low pressure UV lamp was only single wavelength of 254nm. 3 Log inactivation rate of B. subtilis spore by pulse UV and low pressure UV irradiation was determined as $44.71mJ/cm^2$ and $57.7mJ/cm^2$, respectively. This results implied that wide range of emission spectrum is more effective compared to single wavelength emission at 254nm. 500ng/L of initial 2-MIB concentration was investigated on the removal efficiency by UV only and $UV/H_2O_2$ process. The removal efficiency of UV only process achieved approximately 80% at $8,600mJ/cm^2$ dose. 2-MIB removal rate of $UV/H_2O_2$ (5 mg/L $H_2O_2$) process was 25 times increased compared to UV only process. DOC removal efficiency for the water treatment plant effluent was examined. The removal efficiency of DOC by UV and $UV/H_2O_2$ was no more than 20%. Removal efficiency of THMFP(Trihalomethane Formation Potential), one of the chlorination disinfection by-products, is determined on the UV irradiation and $UV/H_2O_2$ process. Maximum removal efficiency of THMFP was approximately 23%. This result indicates that more stable chemical structures of NOM(Natural Organic Matter) than low molecule compounds such as 2-MIB, hydrogen peroxide and other pollutants affect low removal efficiency for UV photolysis. Consequently, pulse UV lamp is more efficient compared to low pressure lamp in terms of disinfection due to it's broad wavelength emission of UV. Additional effect of pulse UV is to take place the reactions of both direct photolysis to remove micro organics and disinfection simultaneously. It is also expected that hydrogen peroxide enable to enhance the oxidation efficiency on the pulse UV irradiation due to formation of OH radical.

• Journal of Korean Society of Water and Wastewater
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• v.26 no.2
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• pp.219-228
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• 2012

Problems due to the taste and odor in drinking water are common in treatment facilities around the world. Taste and odor are perceived by the public as the primary indicators of the safely and acceptability of drinking water, and are mainly caused by the presence of two semi-volatile compounds-2-methylisoborneol(2-MIB) and geosmin. Conventional treatment processes in water treatment plants, such as coagulation, sedimentation and chlorination have been found to be ineffective for the removal of 2-MIB and geosmin. Pulse UV system is a new UV irradiation system that is a non-mercury lamp-based alternative to currently used continuous wave systems for water disinfection. This study shows pulse UV system to be effective in treatment of these two compounds. Geosmin removal efficiency of UV process alone achieved approximately 70% at 10sec contact time. 2-MIB removal efficiency of UV only process achieved approximately 60% at 10sec contact time. The addition of $H_{2}O_{2}$ 7mg/L increased geosmin and 2-MIB removal efficiency upto approximately 94% and 91%, respectively.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.5
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• pp.98-103
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• 2011

Recently, UV(ultra-violet rays) camera has attracted a great deal of interest from the view point of easy judgement in inspections and diagnoses of the safety of power equipment. Especilly, UV camera is applied the inspection of UV with corona discharge. One of the most important and difficult problems is the basic research of filter design, materials and corona discharge. In this paper, we will report on the UV generation, corona pulse count and the polarity effect of positive and negative DC surface discharge in air. Also, corona discharge characteristics are analyzed using prototype UV camera of Korea. UV generation and corona pulse count due to surface discharge in positive needle is higher than that of negative needle.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2004.05b
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• pp.324-326
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• 2004

We have obtained ultra-short pulses with a wavelength of 616 nm from a Distributed Feedback Dye Laser pumped by excimer laser. Using the second harmonic generation, we obtained ultra-short pulse at 308nm in ultraviolet region and also performed amplification in 3 stages of XeCl amplifiers.

• Laser Solutions
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• v.8 no.2
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.11a
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• pp.303-304
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• 2008

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.26 no.5
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• pp.91-96
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• 2012

The surface of bushing is contaminated with rain, dust, salt and others. A bushing with contaminations in air is serious problem in insulation. Therefore, it is important to understand the inspection and diagnoses of the safety. The ultra-violet rays(UV) camera has attracted interest from the view point of easy judgement. In this paper, we will report on the corona discharge characteristics of surface flashover model with contaminations in air. Also, UV images of discharge and corona pulse count in air are analyzed using prototype UV camera of Korea and a UV sensor with an optic lens. These results are studied at both AC and DC voltage under a non-uniform field.

• Journal of the Semiconductor & Display Technology
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• v.6 no.1 s.18
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• pp.11-15
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• 2007

Low-k wafer engraving process has been investigated by using UV pico-second laser with high repetition rate. Wavelength and repetition rate of laser used in this study are 355 nm and 80 MHz, respectively. Main parameters of low-k wafer engraving processes are laser power, work speed, assist gas flow, and protective coating to eliminate debris. Results show that engraving qualities of low-k layer by using a laser with UV pico-second pulse width and high repetition rate had better kerf edge and higher work speed, compared to one by conventional laser with nano-second pulse width and low repletion rate in the range of kHz. Assist gas and protective coating to eliminate debris gave effects on the quality of engraving edge. Total engraving width and depth are obtained less than $20\;{\mu}m$ and $10\;{\mu}m$ at more than 500 mm/sec work speed, respectively. We believe that engraving method by using UV pico-second laser with high repetition rate is useful one to give high work speed in laser material process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.9 no.3
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• pp.56-61
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• 2010

Recently, UV pulse laser is widely used in micro machining of the research, development and industry field of IT, NT and BT products because the laser short wavelength provides not only micro drilling, micro cutting and micro grooving which has a very fine line width, but also high absorption coefficient which allows a lot of type of materials to be machined more easily. To analyze the dynamic deformation during a very short processing time, which is nearly about several tens nanoseconds, the commercial Finite Element Analysis (FEA) code, LS-DYNA 3D, was employed for the computitional simulation of the UV laser micro machining behavior for thin copper material in this paper. A finite element model considering high strain rate effect is especially suggested to investigate the micro phenomena which are only dominated by mechanically pressure impact in disregard of thermally heat transfer. From these computational results, some of dynamic deformation behaviors such as dent deformation shapes, strains and stresses distributions were observed and compared with previous experimental works. These will help us to understand micro interaction between UV laser beam and material.