• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1996년도 춘계학술대회 논문집
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• pp.59-62
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• 1996

Plasma displays (PDP) as a large area wall-hanging display device are rabidly developed with flat CRT, TPT LCD and etc. Especially, AC Plasma Display Panels(AC PDPs) have the inherent memory function which is effective for large area displays. The memory function in AC PDPs is caused by the accumulation of the electrical charge on the protecting layer formed on the dielectric layer. This MgO protective layer prevents the dielectric layer from sputtering by ion in discharge plasma and also has the additional important roll in lowering the firing voltage due to the large secondary electron emission coefficient). Until now, the MgO Protective layer is mainly formed by E-Beam evaporation. With increasing the panel size, this process is difficult to attain cost reduction, and are not suitable for large quantity of production. To the contrary, the methode of shuttering are easy to apply on mass production and to enlarge the size of the panel and shows the superior adhesion and uniformity of thin film. In this study, we have prepared MgO protective layer on AC PDP Cell by reactive magnetron sputtering and studied the effect of MgO layer on the surface discharge characteristics of ac PDP.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.518-521
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• 2004

The degradation characteristics of MgO protective layer and phosphors have been investigated in terms of the ion-induced secondary electron emission coefficient ${\gamma}$ and static margin of discharge voltages, respectively, in this experiment. The ion-induced secondary electron emission coefficients ${\gamma}$ for the degraded MgO protective layer and phosphors have been studied by ${\gamma}$ -focused ion beam system. The energy of Ne+ ions used is from 80 eV to 200 eV in this experiment. The degraded MgO and phosphor layers are found to have higher ${\gamma}$ than that of normal ones without degradations or aged one. Also, the static margin of discharge voltages for test panels with degraded MgO protective layer and phosphors been found to be seriously decreased in comparison with those of normal ones without degradations.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.148-151
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• 2000

$Mg_{2-2x}Ti_xO_2$ films were prepared by e-beam evaporation method to be used as possible substitutes for the conventional MgO protective layer. The oxygen content in the films and in turn, the ratio of metal to oxygen gradually increased with increasing the $TiO_2$ content in the starting materials. The pure MgO films exhibited the crystallinity with strong (111) orientation. The $Mg_{2-2x}Ti_xO_2$ films, however, had the crystallinity with (311) preferred orientation. When the $[TiO_2/(MgO+TiO_2)]$ ratios of 0.1 and 0.15 were used, the deposited films exhibited the secondary electron emission yields improved by 50% compared to that of the conventional MgO protective layer, which resulted in reduction in discharge voltage by 12%.

• 조명전기설비학회논문지
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• 제24권2호
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• pp.106-112
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• 2010

플라즈마 디스플레이 패널(Plasma Hsplay Panel :PDP)이 다른 평판 디스플레이 분야(Liquid Crystal Displays(LCDs) and organic light emitting diodes(OLEDs)등)와 경쟁에서 이기기 위해서는 제품의 고화질화, 저소비전력와 고속구동 등의 성능향상이 필요하다. 본 논문에서는 PDP의 성능향상을 위하여 유전체 보호층으로 쓰이는 MgO 박막에 Fe를 미량 첨가한 박막을 증착하고, 그 특성에 대하여 연구하였다. e-beam 증착법으로 증착된 Fe 도핑 된 MgO 박막의 표면특성과 전기광학적 특성을 4인치 테스트 패널을 제작하여 연구하였다. Fe가 도핑된 MgO 박막을 가지는 PDP는 Fe가 도핑되지 않은 PDP에 비해 낮은 방전전압 특성을 나타내었으며, 이는 박막에서 측정된 2차전자방출계수의 실험결과와 잘 일치되었다. 증착된 박막의 결정성과 표면 거칠기는 XRD 와 AFM 측정방법을 통하여 결정되었다. 또한, Fe가 도핑된 PDP는 고속구동을 위한 향상된 어드레스 방전 늦음의 특성을 나타내었다.

• Computers and Concrete
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• 제13권3호
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• pp.411-421
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• 2014

A central pullout test was conducted to investigate the bonding properties between high strength rebar and reactive powder concrete (RPC), which covered ultimate pullout load, ultimate bonding stress, free end initial slip, free end slip at peak load, and load-slip curve characteristics. The effects of varying rebar buried length, thickness of protective layer and diameter of rebars on the bonding properties were studied, and how to determine the minimum thickness of protective layer and critical anchorage length was suggested according the test results. The results prove that: 1) Ultimate pull out load and free end initial slip load increases with increase in buried length, while ultimate bonding stress and slip corresponding to the peak load reduces. When buried length is increased from 3d to 4d(d is the diameter of rebar), after peak load, the load-slip curve descending segment declines faster, but later the load rises again exceeding the first peak load. When buried length reaches 5d, rebar pull fracture occurs. 2) As thickness of protective layer increases, the ultimate pull out load, ultimate bond stress, free end initial slip load and the slip corresponding to the peak load increase, and the descending section of the curve becomes gentle. The recommended minimum thickness of protective layer for plate type members should be the greater value between d and 10 mm, and for beams or columns the greater value between d and 15 mm. 3) Increasing the diameter of HRB500 rebars leads to a gentle slope in the descending segment of the pullout curve. 4) The bonding properties between high strength steel HRB500 and RPC is very good. The suggested buried length for test determining bonding strength between high strength rebars and RPC is 4d and a formula to calculate the critical anchorage length is established. The relationships between ultimate bonding stress and thickness of protective layer or the buried length was obtained.

• Journal of Information Display
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• 제10권4호
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• pp.137-142
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• 2009

Transparent top-gate Al-Zn-Sn-O (AZTO) thin-film transistors (TFTs) with an $Al_2O_3$ protective layer (PL) on an active layer were studied, and a transparent 2.5-inch QCIF+AMOLED (active-matrix organic light-emitting diode) display panel was fabricated using an AZTO TFT backplane. The AZTO active layers were deposited via RF magnetron sputtering at room temperature, and the PL was deposited via two different atomic-layer deposition (ALD) processes. The mobility and subthreshold slope were superior in the TFTs annealed in vacuum and with oxygen plasma PLs compared to the TFTs annealed in $O_2$ and with water vapor PLs, but the bias stability of the TFTs annealed in $O_2$ and with water vapor PLs was excellent.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.384-387
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• 2008

We have studied the adsorption of contaminations on the MgO protective layer by Thermal Desorption Spectrometry (TDS). The result shows that the increase in exposure time, MgO thickness and humidity multiply the quantity of adsorbed contaminations. It is also found that the desorption activation energy and contamination quantity is decreased by the additional firing process of MgO layer under oxygen environment.

• 한국화재소방학회논문지
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• 제31권2호
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• pp.17-23
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• 2017

소방용 특수방화복의 열보호 성능 평가를 위해 대류와 복사 열원을 이용한 시험방법을 비교하였다. 특히 특수방화복을 구성하는 겉감, 중간층, 안감이 각각 열보호 성능에 미치는 영향을 대류와 복사 열원에 대해 비교하였다. 대류 열원에 대한 열보호 성능시험은 KS K ISO 9151, 복사 열원에 대한 시험은 KS K ISO 6942 그리고 대류와 복사열원을 함께 사용하는 시험은 KS K ISO 17492의 방법에 따라 수행하였다. 같은 입사 열유속 조건($80kW/m^2$)에서 시험했을 때 대류 열원에 비해 복사 열원에 대한 열전달지수($t_{12}$, $t_{24}$) 값이 보다 크게 나왔다. 이는 대류에 비해 복사에 의한 영향이 느리게 나타났음을 의미한다. 대류 열원에 대해서는 안감이 열보호 성능에 가장 크게 영향을 미쳤고 이어서 중간층, 겉감 순서였다. 그러나 복사 열원에 대해서는 안감, 겉감, 중간층 순서로 열보호 성능에 미치는 영향이 컸다. 대류와 복사는 열전달 메카니즘이 근본적으로 다르며, 열원이 달라지면 재질 구성에 따라 열보호 성능 결과가 다르게 나올 수 있다. 따라서 특수방화복의 열보호 성능을 평가하기 위해서는 대류 열원 뿐만 아니라 복사 열원에 대한 시험도 중요함을 확인하였다.

• 전기학회논문지
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• 제61권2호
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• pp.243-250
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• 2012

In this study, we attempted to reduce firing voltage of AC-PDP by alloying MgO protective Layer with CaO. Also, spray coating of single crystal MgO powder has been used to improving Exo-electron emission characteristics and reducing the statistical discharge delay in plasma displays. The properties of discharge depending upon the single crystal MgO powder are investigated. Plasma display having powder coated MgCaO Protective Layer shows lower driving voltage and higher efficacy than of uncoated, conventional panel.

• 한국재료학회지
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• 제12권8호
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• pp.676-681
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• 2002

Microstructure, mechanical properties, and oxidation resistance of TiAIN thin films deposited on quenched and tempered STD61 tool steel by arc ion plating were studied using XRD, XPS and micro-balance. The TiAIN film was grown with the (200) orientation. The grain size of TiAIN thin film decreased with increasing Al contents, while chemical binding energy increased with Al contents. When hard coating films were oxidized at $850^{\circ}C$ in air, oxidation resistance of both TiN and TiCN films became relatively lower since the surface of films formed non-protective film such as $TiO_2$. However, oxidation resistance of TiAIN film was excellent because its surface formed protective layer such as $_A12$$O_3$ and $_Al2$$Ti_{7}$$O_{15}$, which suppressed oxygen intrusion.