• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.4
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• pp.425-435
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• 2016

This paper describes a spread-spectrum clock generation method by utilizing a ${\Delta}{\Sigma}$ digital PLL (DPLL) which is solely based on binary phase detection and does not require a linear time-to-digital converter (TDC) or other linear digital-to-time converter (DTC) circuitry. A 1-bit high-order ${\Delta}{\Sigma}$ modulator and a hybrid finite-impulse response (FIR) filter are employed to mitigate the phase-folding problem caused by the nonlinearity of the bang-bang phase detector (BBPD). The ${\Delta}{\Sigma}$ DPLL employs a two-point modulation technique to further enhance linearity at the turning point of a triangular modulation profile. We also show that the two-point modulation is useful for the BBPLL to improve the spread-spectrum performance by suppressing the frequency deviation at the input of the BBPD, thus reducing the peak phase deviation. Based on the proposed architecture, a 3.2 GHz spread-spectrum clock generator (SSCG) is implemented in 65 nm CMOS. Experimental results show that the proposed SSCG achieves peak power reductions of 18.5 dB and 11 dB with 10 kHz and 100 kHz resolution bandwidths respectively, consuming 6.34 mW from a 1 V supply.

• Journal of the Korean Magnetics Society
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• v.19 no.3
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• pp.100-105
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• 2009

The high-temperature isothermal aging is studied in ultra-supercritical steel, which is attractive to the next generation of power plants. The effects of microstructure on reversible permeability are discussed. Isothermal aging was observed to coarsen the tempered carbide ($Cr_{23}C_6$), generate the intermetallic ($Fe_2W$) phase and grow rapidly during aging. The dislocation density also decreases steeply within lath interior. The dynamic coercivity, measured from the peak position of the reversible permeability profile decreased drastically during the initial 500 h aging period, and was thereafter observed to decrease only slightly. The variation in dynamic coercivity is closely related to the decrease in the number of pinning sites, such as dislocations, fine precipitates and the martensite lath.

• Korean Journal of Social Welfare
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• v.69 no.2
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• pp.9-30
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• 2017

Generally, regime shift occurs less frequently than policy change and/or government change. Regime shift needs alterations and changes along the three critical components which constitute a domestic regime: (1) the character of the socioeconomic coalition that rules the country; (2) the political and economic institutions through which power is acquired and exercised; and (3) the public policy profile that give political direction to the nation. This paper tries to examine characteristics of the welfare regime of Korea, and explore policy reform options for the welfare regime shift in Korea. From the viewpoint of livelihood security perspective, I firstly tries to examine development process of Korean welfare regime and specify the main characteristics of that regime. Secondly, I present three policy reform options: (1) reform of the formal political institutions such as electoral system and government type; (2) restructuring of the composition of government expenditure structure; and (3) reduction of the informal employment. These three policy reform options are related to the alteration of socioeconomic coalitions and the changes of the political and economic institutions. Instead of concluding remarks, I finally suggest two debate topics to the round table discussion.

• Publications of The Korean Astronomical Society
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• v.30 no.2
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• pp.389-392
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• 2015

We identify a strong lensing galaxy in the cluster IRC 0218 that is spectroscopically confirmed to be at z = 1.62, making it the highest-redshift strong lens galaxy known. The lens is one of the two brightest cluster galaxies and lenses a background source galaxy into an arc and a counterimage. With Hubble Space Telescope (HST) grism and Keck/LRIS spectroscopy, we measure the source redshift to be $z_S=2.26$. Using HST imaging, we model the lens mass distribution with an elliptical power-law profile and account for the effects of the cluster halo and nearby galaxies. The Einstein radius is $^{\theta}E=0.38^{+0.02{\prime}{\prime}}_{-0.01}$ ($3.2^{+0.2}_{-0.1}kpc$) and the total enclosed mass is $M_{tot}(<^{\theta}_E)=1.8^{+0.2}_{-0.1}{\times}10^{11}M_{\odot}$. We estimate that the cluster environment contributes ~ 10% of this total mass. Assuming a Chabrier IMF, the dark matter fraction within $^{\theta}E$ is $f^{Chab}_{DM}=0.3^{+0.1}_{-0.3}$, while a Salpeter IMF is marginally inconsistent with the enclosed mass ($f^{Salp}_{DM}=-0.3^{+0.2}_{-0.5}$).

• The Journal of Korean Institute of Communications and Information Sciences
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• v.30 no.2A
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• pp.34-42
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• 2005

In orthogonal frequency-division multiple access (OFDMA) uplink environments, asynchronously received signals can cause multiple access interference (MAI). This paper focuses on the performance degradation due to the MAI over frequency-selective fading channels. We first introduce the timing misalignment, which is defined as the relative timing difference between asynchronous timing error of uplink user and reference time of the base station, and analytically derive the MAI using the power delay profile of wide-sense stationary uncorrelated scattering (WSSUS) channel model. Then, the effective signal-to-noise ratio (SNR) and the average symbol error probability (SEP) are derived. The proposed analytical results are verified through simulations with respect to the region of the timing misalignment and the number of asynchronous users.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.396-401
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• 1999

In this study, $Ar^+$ ion laser etching process of single/poly-crystalline Si with $CCl_2F_2$ gas is investigated for MEMS applications. In general, laser direct etching process is useful in microelectronic process, fabrication of micro sensors and actuators, rapid prototyping, and complementary processing because of the advantages of 3D micromachining, local etching/deposition process, and maskless process with high resolution. In this study, a pyrolytic method, in which $CCl_2F_2$ gasetches molten Si by the focused laser, was used. In order to analyze the temperature profile of Si by the focused laser, the 3D heat conduction equation was analytically solved. In order to investigate the process parameters dependence of etching characteristics, laser power, $CCl_2F_2$ gas pressure, and scanning speed were varied and the experimental results were observed by SEM. The aspect ratio was measured in multiple scanning and the simple 3D structure was fabricated. In addition, the etching characteristics of $6\mum$ thick poly-crystalline Si on the insulator was investigated to obtain flat bottom and vertical side wall for MEMS applications.

• Journal of the Korean Society of Systems Engineering
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• v.4 no.1
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• pp.35-43
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• 2008

Generally, in analysis of reliability of Design and Development Phase, reliability of electrical components is analyzed based on standards such as MIL-HDBK-217F, Bellcore Issue 4,5,6 by analyzing stress of architectural side (Power, Voltage, Current and quality level of components) of weapon system and stress of operational side (operational environment, operational temperature, Operational Profile). But the reliability of mechanical components is analyzed based on the data book of failure history of mechanical parts called NPRD-95(Nonelectronic Parts Reliability Data-95) without any analysis of above stress. However, even if it's the same mechanical parts, it might have different failure rate(fatigue, wear, corrosion) during operation depending on how weary(stress : pressure, vibration, temperature during operation) the parts are. Therefore, analyzing reliability using just data book can cause big difference in reliability instead of analyzing based upon stressfulness that parts might have, operational concept, and other various factors. Thus, This paper will guide the way of predicting reliability by organizing ways of predicting reliability for system organization and adopt ing NSWC-98/LE1(Naval Surface Warfare Center-98/LE1) for mechanical components.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.242-242
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• 2006

Increasingly complex tasks are performed by computers or cellular phone, requiring more and more memory capacity as well as faster and faster processing speeds. This leads to a constant need to develop more highly integrated circuit systems. Therefore, there have been numerous studies by many engineers investigating circuit patterning. In particular, PCB including module/package substrates such as FCB (Flip Chip Board) has been developed toward being low profile, low power and multi-functionalized due to the demands on miniaturization, increasing functional density of the boards and higher performances of the electric devices. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. The imprint technique. is one of promising candidates, especially due to the fact that the expected resolution limits are far beyond the requirements of the PCB industry in the near future. For applying imprint lithography to FCB, it is very important to control thermal properties and mechanical properties of dielectric materials. These properties are very dependent on epoxy resin, curing agent, accelerator, filler and curing degree(%) of dielectric materials. In this work, the epoxy composites filled with silica fillers and cured with various accelerators having various curing degree(%) were prepared. The characterization of the thermal and mechanical properties wasperformed by thermal mechanical analysis (TMA), thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), rheometer, an universal test machine (UTM).

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.131-131
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• 2010

We compared the electrical, optical, structural, and interface properties of indium zinc oxide (IZO)-Ag-IZO and IZO-Au-IZO multilayer electrodes deposited by linear facing target sputtering system at room temperature for organic photovoltaics. The IZO-Ag-IZO and IZO-Au-IZO multilayer electrodes show a significant reduction in their sheet resistance (4.15 and 5.49 Ohm/square) and resistivity ($3.9{\times}10^{-5}$ and $5.5{\times}10^{-5}$Ohm-cm) with increasing thickness of the Ag and Au layers, respectively. In spite of its similar electrical properties, the optical transmittance of the IZO-Ag-IZO electrode is much higher than that of the IZO-Au-IZO electrode, due to the more effective antireflection effect of Ag than Au in the visible region. In addition, the Auger electron spectroscopy depth profile results for the IZO/Ag/IZO and IZO/Au/IZO multilayer electrodes showed no interfacial reaction between the IZO layer and Ag or Au layer, due to the low preparation temperature. To investigate in detail the Ag and Au structures on the bottom IZO electrode with increasing thickness, a synchrotron x-ray scattering examination was employed. Moreover, the OSC fabricated on the IZO-Ag-IZO electrode shows a higher power conversion efficiency (3.05%) than the OSC prepared on the IZO-Au-IZO electrode (2.66%), due to its high optical transmittance in the wavelength range of 400-600 nm, which is the absorption wavelength of the P3HT:PCBM active layer.

• Journal of Internet Computing and Services
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• v.11 no.1
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• pp.143-151
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• 2010

According to increasing requirements in embedded systems. embedded software has been more complicated then before. a optimum software is difficult in embedded system. software developer make a difficult optimum software. this paper suggests a software profiling tool with which a software developer can easily profiling the embedded system software in cross-development environments. the suggested tool is designed based on host/target architecture. this tool insert program source for make profiling log to target program. a target program executed in target system. a target system communicate profiling log to host system. this tool in host system analyze profiling log data. and make a XML of profiling log and a profiling report. a profiling report is graphic viewer based GUI. a target system in this tool needs a few computing power. and XSLT can conversion of profile log XML to other format data. and suggested tool based on eclipse plug-in, therefore developer can use operates in eclipse.