• 제목/요약/키워드: Processing Module

검색결과 1,562건 처리시간 0.03초

위성항법 지상국 감시제어시스템 품질 감시 기법 분석 (Quality Monitoring Method Analysis for GNSS Ground Station Monitoring and Control Subsystem)

  • 정성균;이상욱
    • 한국항공운항학회지
    • /
    • 제18권1호
    • /
    • pp.11-18
    • /
    • 2010
  • GNSS(Global Navigation Satellite System) Ground Station performs GNSS signal acquisition and processing. This system generates error correction information and distributes them to GNSS users. GNSS Ground Station consists of sensor station which contains receiver and meteorological sensor, monitoring and control subsystem which monitors and controls sensor station, control center which generates error correction information, and uplink station which transmits correction information to navigation satellites. Monitoring and control subsystem acquires and processes navigation data from sensor station. The processed data is transmitted to GNSS control center. Monitoring and control subsystem consists of data acquisition module, data formatting and archiving module, data error correction module, navigation determination module, independent quality monitoring module, and system maintenance and management module. The independent quality monitoring module inspects navigation signal, data, and measurement. This paper introduces independent quality monitoring and performs the analysis using measurement data.

ECG 신호의 분산처리를 위한 Preprocess Module에 관한 연구 (A Design of the Preprocess Module for the Distributed Process of the ECG signals)

  • 송향봉;이경중;윤형로;이명호
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1987년도 전기.전자공학 학술대회 논문집(II)
    • /
    • pp.1338-1340
    • /
    • 1987
  • This paper describes the design of ECG data preprocess module for the ECG signals. This module process the data obtained from two channels. It is composed of the AID converter, QRS detector, one chip micro-computer and memory. This module performs the following functions;digital filtering, R wave detection and determination of reference point for the ST segment. The measured points are transfered to the next data module by the interrupt process. This preprocessor data module is available to the basis for the parallel data processing for the real time automatic diagnosis.

  • PDF

Design and Implementation of a Fully Synthesizable Bluetooth Baseband Module Considering IP Reuse

  • Chun, Ik-Jae;Kim, Bo-Gwan
    • 대한전자공학회:학술대회논문집
    • /
    • 대한전자공학회 2002년도 ITC-CSCC -2
    • /
    • pp.1304-1307
    • /
    • 2002
  • In this paper, we describe the structure and the test results of a Bluetooth baseband module we have developed. The module has a distributed buffer, i.e. FIFO, for data stream. Bus interface of the module is designed on the basis of interface of microprocessor widely used and the external interface is designed to consider chips connected directly. Since the module performs as many hardware efficient tasks as possible, processing load of microprocessor is very small. It can also be controlled either by software or by hardware for flexibility. The fully synthesizable baseband module was fabricated in a $0.25\mu\textrm{m}$ CMOS technology occupying $2.79\times2.8{\textrm{mm}^2}$ area. And an FPGA implementation of this module is tested for file and bit-stream transfers between PCs.

  • PDF

지능형 센서의 데이터 처리 모듈 개발 (Development of data processing module of intelligent sensor)

  • 김인욱;임동진
    • 대한전기학회:학술대회논문집
    • /
    • 대한전기학회 1999년도 하계학술대회 논문집 B
    • /
    • pp.954-956
    • /
    • 1999
  • In the case of using sensor in the industrial control systems, the location of sensor is not close to the system which utilizes the sensor data. Two main functions of intelligent sensor are data processing and communication. In this paper, we will show that the developed result of intelligent sensor, which process the sensor data inside of the sensor module, except for the communication function. For this, we refered to the Profibus and Fieldbus Foundation standard.

  • PDF

USB 보안 모듈과 Active Directory를 활용한 최적의 보안정책에 관한 연구 (A study on optimal security policy using USB security module and Active.)

  • 안수용;이덕규
    • 한국정보처리학회:학술대회논문집
    • /
    • 한국정보처리학회 2020년도 추계학술발표대회
    • /
    • pp.475-476
    • /
    • 2020
  • 자체 제작한 프로그램인 USB security module과 Active Directory를 활용하여 서버에서 다수의 클라이언트를 관리할 수 있는 시스템을 구축한다. USB 보안 모듈과 Active Directory의 보안정책을 결합하여 극단적이고 폐쇄적인 강력한 보안을 가능케 하며 보안정책별 효용성을 살펴보고자 한다.

상호연관성 분석을 이용한 웹서버 보안관리 시스템 (Web-Server Security Management system using the correlation analysis)

  • 김성락
    • 한국컴퓨터정보학회논문지
    • /
    • 제9권4호
    • /
    • pp.157-165
    • /
    • 2004
  • 본 논문에서는 현재 증가하고 있는 웹 서비스 공격을 정확하고 빠르게 탐지할 수 있고, 잘못된 공격탐지를 줄여줄 수 있는 웹서버 보안관리시스템을 제안한다. 이 시스템은 여러 단위보안모듈들의 결과를 실시간으로 수집하고 상호연관성 분석과정을 통해 탐지의 정확성을 향상시킨다. 단위보안모듈은 네트웍기반 침입탐지시스템 모듈, 파일무결성 검사 모듈, 시스템로그분석 모듈 그리고 웹로그분석 모듈로 구성되며, 그리고 각각의 단위보안모듈들의 결과에 연관성을 부여하여 실시간으로 분석하는 상호연관성 분석 모듈이 있다. 제안한 시스템은 공격탐지의 정확성 뿐 아니라 단위보안모듈의 추가 그리고 상호연관성 분석의 범위확장이 용이한 프레임워크를 제공한다. 그리고 제안한 시스템의 단위보안모듈 중 침입탐지시스템 모듈은 다중 쓰레드 기반으로 Snort를 재구성하여 보다 빠른 공격 탐지 시간을 갖는다. 처리량이 많은 단위보안모듈의 처리시간을 단축함으로서 웹서버 보안관리시스템 처리 성능을 향상시킬 수 있다.

  • PDF

Ultrasonic wireless sensor development for online fatigue crack detection and failure warning

  • Yang, Suyoung;Jung, Jinhwan;Liu, Peipei;Lim, Hyung Jin;Yi, Yung;Sohn, Hoon;Bae, In-hwan
    • Structural Engineering and Mechanics
    • /
    • 제69권4호
    • /
    • pp.407-416
    • /
    • 2019
  • This paper develops a wireless sensor for online fatigue crack detection and failure warning based on crack-induced nonlinear ultrasonic modulation. The wireless sensor consists of packaged piezoelectric (PZT) module, an excitation/sensing module, a data acquisition/processing module, a wireless communication module, and a power supply module. The packaged PZT and the excitation/sensing module generate ultrasonic waves on a structure and capture the response. Based on nonlinear ultrasonic modulation created by a crack, the data acquisition/processing module periodically performs fatigue crack diagnosis and provides failure warning if a component failure is imminent. The outcomes are transmitted to a base through the wireless communication module where two-levels duty cycling media access control (MAC) is implemented. The uniqueness of the paper lies in that 1) the proposed wireless sensor is developed specifically for online fatigue crack detection and failure warning, 2) failure warning as well as crack diagnosis are provided based on crack-induced nonlinear ultrasonic modulation, 3) event-driven operation of the sensor, considering rare extreme events such as earthquakes, is made possible with a power minimization strategy, and 4) the applicability of the wireless sensor to steel welded members is examined through field and laboratory tests. A fatigue crack on a steel welded specimen was successfully detected when the overall width of the crack was around $30{\mu}m$, and a failure warnings were provided when about 97.6% of the remaining useful fatigue lives were reached. Four wireless sensors were deployed on Yeongjong Grand Bridge in Souht Korea. The wireless sensor consumed 282.95 J for 3 weeks, and the processed results on the sensor were transmitted up to 20 m with over 90% success rate.

패킷 음성/데이터 집적 단말기의 개발 (Development of an Integrated Packet Voice/Data Terminal)

  • 전홍범;은종관;조동호
    • 한국통신학회논문지
    • /
    • 제13권2호
    • /
    • pp.171-181
    • /
    • 1988
  • 본 논문에서는 packet-switched network에서 음성을 서비스하는데 있어서 고려해야 할 여러가지 점들을 살펴보고, 실제로 음성과 데이터를 동시에 서비스하는 packet voice/data terminal을 구현하였으며 그 성능 분석을 시도하였다. PVDT의 software는 OSI 7 layer architecture에 맞추어 설계하였으며 음성과 데이터를 link level부터 구별하여 서비스하였다. 또한 음성 packet의 전송 delay를 작게 하기 위해 데이터보다 음성을 우선적으로 서비스하도록 하였으며 간략화된 protocol로 재전송에 의한 overhead를 없앴다. PVDT의 hardware의 구성은 기능별로 master control module, speech processing module, speech activity detection module, telelphone interface module, input/output inteface module로 나누어진다. Packet음성통신망에 대한 해석으로는 음성 packet의 전송 delay의 variance에 의한 영향을 줄이기 위한 최적 재생지연시간을 전송 delay의 분포를 통해 계산하였다.

  • PDF

3D feature profile simulation for nanoscale semiconductor plasma processing

  • Im, Yeon Ho
    • 한국진공학회:학술대회논문집
    • /
    • 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
    • /
    • pp.61.1-61.1
    • /
    • 2015
  • Nanoscale semiconductor plasma processing has become one of the most challenging issues due to the limits of physicochemical fabrication routes with its inherent complexity. The mission of future and emerging plasma processing for development of next generation semiconductor processing is to achieve the ideal nanostructures without abnormal profiles and damages, such as 3D NAND cell array with ultra-high aspect ratio, cylinder capacitors, shallow trench isolation, and 3D logic devices. In spite of significant contributions of research frontiers, these processes are still unveiled due to their inherent complexity of physicochemical behaviors, and gaps in academic research prevent their predictable simulation. To overcome these issues, a Korean plasma consortium began in 2009 with the principal aim to develop a realistic and ultrafast 3D topography simulator of semiconductor plasma processing coupled with zero-D bulk plasma models. In this work, aspects of this computational tool are introduced. The simulator was composed of a multiple 3D level-set based moving algorithm, zero-D bulk plasma module including pulsed plasma processing, a 3D ballistic transport module, and a surface reaction module. The main rate coefficients in bulk and surface reaction models were extracted by molecular simulations or fitting experimental data from several diagnostic tools in an inductively coupled fluorocarbon plasma system. Furthermore, it is well known that realistic ballistic transport is a simulation bottleneck due to the brute-force computation required. In this work, effective parallel computing using graphics processing units was applied to improve the computational performance drastically, so that computer-aided design of these processes is possible due to drastically reduced computational time. Finally, it is demonstrated that 3D feature profile simulations coupled with bulk plasma models can lead to better understanding of abnormal behaviors, such as necking, bowing, etch stops and twisting during high aspect ratio contact hole etch.

  • PDF