• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.632-635
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• 2003

As a process technology of nano pattern with a new conception for economic and practical technology of alternative nano process. process technologies such as Embossing, Imprinting. Molding and Inking are beginning to make its appearance. Among these alternative processes, nano mold process is a process that is of benefit to mass production and keeps excellency of reproduction and high quality of parts. In this study, we experienced micro precision machining technology of nano stamper for the injection mold of optical disk with big capacity. Especially, Flatness and uniformity are important for nano stamper with global area, for the purpose of developing polishing technology of micro precision of Back polishing only being used for nano stamper, we carried out a basic study to secure flatness standards

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
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• pp.387-392
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• 2001

Kobe Steel, LTD. and Midrex Technologies Inc. jointly developed the FASTMET$\circledR$ process as a steel mill waste recycle technology in which the DRI product meets BF feed material or BOF/EAF feed material requirements. FASTMET(R) process turns value-less wastes into valuable DRI and sellable zinc oxide, and gives the solution for the steel mill wastes recycling from both economical and environmental viewpoints. During the development of the process, Laboratory, Pilot Plant and Demonstration Plant tests were carried out from 1990 to 1998. The first FASTMET(R) commercial plant began operation in April, 2000 and the second commercial plant started in April, 2001 Both commercial plants have proceeded successfully preying that FASTMET$\circledR$ is a suitable process for recycling steel mill waste and for producing DRI as an iron source.

• 반도체디스플레이기술학회지
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• 제4권3호
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• pp.23-27
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• 2005

The effects of the base vacuum level on a plasma display panel (PDP) produced by the vacuum in-line sealing technology were investigated. The main equipment of the vacuum in-line sealing process consists of the sealing chamber, pumping systems for evacuating, mass flow controller for introducing the plasma gases, and other measuring systems. During the sealing process, the impurity gases were fully evacuated and the panel was prevented from the adsorption of impurity gases. As a result, the brightness increased as the impurity gas density decreased, so we found that the vacuum in-line sealing process was more efficient technology an the conventional sealing process.

• 반도체디스플레이기술학회지
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• 제5권4호
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• pp.23-27
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• 2006

Semiconductor industry has been dramatically developed with the information era of 21C, and the trend now is to consider that the technology of management system of the computer utility that has a high efficiency is important. This study investigated the intelligent decision system for residual gas purge process to effectively remove the residual gas in the tube after replacing the cylinder that is used for the gas cabinet or BSGS(Bulk Specialty Gas Supply System) of the semiconductor process. It was suggest from this study that it is possible to decide the type, frequency and volume of purge gas using various toxic gases which is necessary for each process. Also, this result will be utilized for operating the system, increasing the efficiency of management and saving energy.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.366-367
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• 2006

Carbon nanotubes (CNTs) have attracted remarkable attention as reinforcement for composites owing to their outstanding mechanical properties. The CNT/Cu nanocomposite is fabricated by a novel fabrication process named molecular level process. The novel process for fabricating CNT/Cu composite powders involves suspending CNTs in a solvent by surface functionalization, mixing Cu ions with CNT suspension, drying, calcination and reduction. The molecular level process produces CNT/Cu composite powders whereby the CNTs are homogeneously implanted within Cu powders. The mechanical properties of CNT/Cu nanocomposite, consolidated by spark plasma sintering of CNT/Cu composite powders, shows about 3 times higher strength and 2 times higher Young's modulus than those of Cu matrix.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.357-360
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• 2008

In roll forming process, a sheet metal is continuously progressively formed into a product with required cross-section and longitudinal shape, such as a circular tube with required diameter, wall-thickness and straightness, by passing through a series of forming rolls in arranged in tandem. In this process, each pair of forming rolls installed in a forming machine play a particular role in making up the required cross-section and longitudinal shape of the product. In recent years, that process is often applied to the bumper rail in the automotive industries. In this study, a optimal SILL SIDE manufacturing technology, model deign and proper roll-pass sequences can be suggested by forming number of roll-pass and bending angle. And also effects of the process parameters on the final shape formed by roll forming defects were evaluated.

• 반도체디스플레이기술학회지
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• 제16권3호
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• pp.106-110
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• 2017

Due to the plasma applied from the outside, which acts as an etchant during the etching process, considerable heat is transferred to the wafer and a separate cooling process is performed to effectively remove the heat after the process. In this case, a direct cooling method using a refrigerant is suitable for cooling through effective heat exchange. The direct cooling method using the refrigerant using the latent heat exchange is superior to the cooling method using the sensible heat exchange. Therefore, in this paper, AMESim is used to design a direct refrigerant cooling system using latent heat exchange simulator was built.The constructed simulator is reliable compared with the actual experimental results. It is expected that this simulator will help to design and search for optimal process conditions.

• Journal of Multimedia Information System
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• 제8권4호
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• pp.285-294
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• 2021

The development process of domestic CG (Computer Graphics) needs to be studied by classifying the technical part and the design part. This paper analyzes how early domestic broadcast equipment evolved and focused on what went through the development process. Domestic broadcasting companies have introduced and used overseas equipment and have begun to develop their own technology. The development process of the early domestic production technology of broadcasting stations was classified into Character Generator, On-line Real-Time Graphic and Sport Coder. It was found that the orientation of broadcasting technology was conclusively focused on visualization, with socio-cultural factors acting along with the evolution of hardware and software. This research is meaningful in reorganizing the history of the development process of domestic CG technology in the early days through previous research (primary verification), newspaper articles and news coverage (secondary verification). This paper looks at what is missing by regaining the past of CG, and argues that with the advent of new technologies today, we must develop through appropriate division of roles and collaboration between engineers and designers.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.

• 대한안전경영과학회:학술대회논문집
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• 대한안전경영과학회 2008년도 추계학술대회
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• pp.599-610
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• 2008

It is an important and urgent issue to improve process capability in quality control. Process capability refers to the uniformity of the process. The variability in the process is a measure of the uniformity of output. A simple, quantitative way to express process capability, the degree of variability from target in specification is defined by process capability index(PCI). Almost process capability indices are defined under normal distribution. However, these indices can not be applied to the process of non-normal distribution including reliability. We investigate current research on the process of non-normal distribution, and advanced method and technology for developing more reliable and efficient PCI. Finally we suggest the perspective for future study.