• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.295-298
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• 2009

Oxygen ionic conductors of CeScSZ electrolyte in SOFC unit cell are applied to anode and cathode as well as electrolyte to have the triple-phase-boundaries of electrochemical reaction, and it is required to decrease the sintering temperature of anode-supported electrolyte by the nanoscale of CeScSZ electrolyte powder. In this report, nanoscale CeScSZ electrolyte powder was synthesized by chemical synthesis method. The particle size, surface area and morphology of the powder were observed by SEM and BET. Thin film electrolyte of under $10{\mu}m$ was fabricated by tape casting using the synthesized CeScSZ electrolyte powder, and ionic conductivity and gas permeability of electrolyte film were evaluated. Finally the SOFC unit cell was fabricated using the anode-supported electrolyte prepared by a tape casting method and co-sintering, in which the active layer, measuring $20{\mu}m$, was introduced in the anode layer to provide a more efficient reaction. Electrochemical evaluations of the SOFC unit cell, including measurements such as power density and impedance, were performed and analyzed.

• Korean Journal of Materials Research
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• v.19 no.5
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• pp.288-292
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• 2009

This article shows various factors that influence the thermal-cycling reliability of semiconductor devices utilizing the lead-on-chip (LOC) die attach technique. This work details how the modification of LOC package design as well as the back-grinding and dicing process of semiconductor wafers affect passivation reliability. This work shows that the design of an adhesion tape rather than a plastic package body can play a more important role in determining the passivation reliability. This is due to the fact that the thermal-expansion coefficient of the tape is larger than that of the plastic package body. Present tests also indicate that the ceramic fillers embedded in the plastic package body for mechanical strengthening are not helpful for the improvement of the passivation reliability. Even though the fillers can reduce the thermal-expansion of the plastic package body, microscopic examinations show that they can cause direct damage to the passivation layer. Furthermore, experimental results also illustrate that sawing-induced chipping resulting from the separation of a semiconductor wafer into individual devices might develop into passivation cracks during thermal-cycling. Thus, the proper design of the adhesion tape and the prevention of the sawing-induced chipping should be considered to enhance the passivation reliability in the semiconductor devices using the LOC die attach technique.

• Progress in Superconductivity and Cryogenics
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• v.16 no.1
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• pp.27-31
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• 2014

2G HTS tapes are widely used for various electric machines. In addition, stacked or parallel connected HTS tapes are essentially used to raise transport current level for large capacity electric machines. Therefore, critical current characteristic of stacked tapes need to be studied. Recently developed 2G HTS tapes are fabricated with various defects doping so that tapes possess pinning center to improve the critical current characteristic. During this process, the critical current is determined minimum value in not perpendicular magnetic field but a specific magnetic field angle according to the reported research. However, the effects of magnetic field angle to critical current of multi-stacked 2G HTS tapes have not been examined. In this paper, field coil which is a race-track coil wound by using an HTS tape with iron-core was fabricated to apply angle adjustable magnetic field to the 2G HTS tape samples. We measured critical current of single and multi-stacked two tapes that have different characteristic depending on various magnetic field angle and magnitude in liquid nitrogen environment. Furthermore, results of single and multi-stacked tapes were compared and analyzed.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.169-172
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• 2002

This study demonstrated the feasibility of using tape-casting followed by sintering as a low-cost alternative for coating glass-ceramic or glass film on a metal substrate. The process has been successfully used to fabricate a glass-on-stainless steel and a glass-ceramic-on-molybdenum electrostatic chuck(ESC) with the insulating layer thickness about $150{\mu}{\textrm}{m}$. Electrical resistivity data of the coaling were obtained between room temperature and 55$0^{\circ}C$; although the resistivity values dropped rapidly with increasing temperature in both coatings, the glass-ceramic still retained a high value of $10^{10}$ ohm-cm at $500^{\circ}C$. Clamping pressure measurements were done using a mechanical apparatus equipped with a load-cell at temperatures up to $350^{\circ}C$ and applied voltages up to 600V; the clamping behavior of all ESCs generally followed the voltage-squared curve as predicted by theory. Based on these results, we believe that we have a viable technology for manufacturing ESCs for use in reactive-ion etch systems.

• Progress in Superconductivity and Cryogenics
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• v.12 no.2
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• Progress in Superconductivity and Cryogenics
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• v.9 no.3
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• pp.9-12
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• 2007

In this study. we searched for the mechanical and electrical properties of laminated coated conductors with stabilizer tape. Stabilizer tape plays a role for mechanical and electrical stability and environmental protection. Cu material stabilizer was laminated to Ag capping layer on SmBCO conductor layer. This architecture allows the wire to meet operational requirements including the stressless at cryogenic temperature and winding tension as well as mechanical bending requirements including thermal and electrical stability under fault current conditions. First, we have experimentally studied mechanical bonding properties of the laminated Cu stabilizers on SmBCO coated conductors. We have laminated SmBCO coated conductors by continuous dipping soldering process, Second, we have investigated electrical properties of the SmBCO coated conductors with stabilizer lamination. We evaluated bonding properties, peeling strength and critical current for laminated SmBCO coated conductors with Cu stabilizers.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.230-233
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• 2003

Among the various manufacturing processes of composites, the tape lay-up process of thermoset prepreg has many advantages compared to autoclave or hot press forming. It has a high potential to process automation and continuous fabrication. In this study, temperature distribution of composite exposed in hot gas was studied numerically and the validity of the analysis was verified by the experiments.

• Composites Research
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• v.18 no.3
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• pp.38-46
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• 2005

In order to characterize the outstanding performance of three-dimensional (3D) composites, the low velocity impact test has been carried out. 3D fiber structures have been achieved by using the automated tape placement (ATP) process and a stitching method. Materials for the ATP and the stitching process were carbon/epoxy prepreg tapes and Kevlar fibers, respectively. Two-dimensional composites with the same stacking sequence as 3D counterparts have also been fabricated for the comparison of damage tolerance. For the assessment of damage after the impact loading, specimens were subjected to C-Scan nondestructive inspection. Compression after impact (CAI) tests were conducted to evaluate residual compressive strength. The damage area of 3D composites was greatly reduced $(30-40\%)$ compared with that of 2D composites. Although the CAI strength did not show drastic improvement for 3D composites, the ratio of retained strength was $5-10\%$ higher than 2D samples. The effect of stitching on the impact performance was negligible above the energy level of 35 Joules.

• Journal of the Korean Ceramic Society
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• v.34 no.10
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• pp.1083-1091
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• 1997

As one of the chemical powder fabrication methods, the powder preparation method by using oxalate has the following advantages; (1) easy to control the chemical stoichiometry, (2) easy to fabricate homogeneous and fine particles, and (3) easy to be thermaly decomposed at low temperature. In the present study, the initial morphology and size distribution of the powder were controlled and the homogeniaty was improved. By carefully controlling the pH with NH4OH, the Bi(Pb)-Sr-Ca-Cu-O superconducting powders were prepared and investigated for their properties. The microstructures and the superconducting properties of the pelletized samples were investigated. Also, the microstructures and electrical properties of the samples prepared by tape casting method were investigated. The fabricated powders were spherical with less than 400 nm, but most of them were agglomerated to be 1~3 ${\mu}{\textrm}{m}$ in size. The critical temperature of the pelletized sample annealed at 84$0^{\circ}C$ for 72 hours in air was 110K. And the critical currents of annealed samples in air prepared by tape casting process for 24 hours and 72 hours were 0.6 A (Jc=600A/$\textrm{cm}^2$) and 1.9A (Jc=1, 900A/$\textrm{cm}^2$) respectively.

• Journal of the Korean Ceramic Society
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• v.52 no.5
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• pp.320-324
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• 2015

Optimization of the fabrication process of NiO-yttrium doped barium zirconate (BZY) composite anode substrates using tape-casting for high performance thin-film protonic ceramic fuel cells (PCFCs) is investigated. The anode substrate is composed of a tens of microns-thick anode functional layer laminated over a porous anode substrate. The macro-pore structure of the anode support is induced by micron-scale polymethyl methacrylate (PMMA) pore formers. Thermal gravity analysis (TGA) and a dilatometer are used to determine the polymeric additive burn-out and sintering temperatures. Crystallinity and microstructure of the tape-cast NiO-BZY anode are analyzed after the sintering.