• Journal of the Korean Society for Precision Engineering
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• v.23 no.4 s.181
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• pp.132-138
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• 2006

A tape feeder is an important part to supply a micro chip such as 1005 and 0603 components in SMT process. Traditional sprocket wheel type feeder has several problems such as backlash and indexing errors, low compatibility and confidence. However, it is very difficult to solve such problems due to the inevitable fraction defectives of sprocket wheel. Thus, the object of this works is to develop a linear type high precision tape feeding system using cam-slider mechanism. The proposed cam-slider mechanism is composed of several links and a plate, pneumatic actuator is used to generate linear motion. The proposed mechanism has distinct advantages over the conventional mechanism. It has reduced feeding errors, long lift-cycle, and slim width. As a result, the developed tape feeder using cam-slider mechanism shows special characteristics far high precision feeding for chip-mounters.

• Journal of Gifted/Talented Education
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• v.12 no.4
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• pp.108-119
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• 2002

We have analyzed students' reports on a problem for 'adhesive tape' among ten assigned problems in the first Korean youth physics tournament (KYPT). There were five team' s reports on this problem. Students reported that the reasons for lightening coming out from the stripping down adhesive tape are caused by electrostatic friction, electron transfer, energy transformation, etc. However, only few teams suggest new creative ideas with divergent thinking during their inquiry process. Because the KYPT is a debate based on the problem solving by inquiries, the reports should include the creative investigations by their own ideas in every steps of inquiry up to their final conclusions.

• Journal of Institute of Convergence Technology
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• v.5 no.1
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• pp.13-17
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• 2015

In wafer level molding progress, the thermal releasing failure phenomenon is shown up as the important problem. This phenomenon can cause the problem including the warpage, crack of the molded wafer. The thermal releasing failure is due to the insufficiency of adhesion strength degradation of the molding tape. To solve this problem, we studied experimental method increasing the release property of the molding tape through the plasma surface treatment on the wafer substrate. In this research, the vacuum plasma treatment system is used for release property improvement of the molding tape and controls the operating condition of the hydrophilic($O_2$, 100kW, 10min) and hydrophobic($C_2F_6$, 200kW, 10min). In order to perform the peeling test for measuring the releasing force precisely, we remodel the micro scale material property evaluation system developed by Korea institute of industrial technology. In case of hydrophilic surface treatment on the wafer substrate, we can figure out the releasing property of molding tape increase. In order to grasp the effect that it reaches to the release property increase when repeating the hydrophilic treatment, we make an experiment with twice treatment and get the result to increase about 12%. We find out the hydrophilic surface treatment method using plasma can improve releasing property of molding tape in the wafer level molding process.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.73-76
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• 2020

Silver nanowires (AgNWs) intrinsically possess high conductivity, ductility, and network structure percolated in a low density, which have led to many advanced applications of transparent and flexible electronics. Most of these applications require patterning of AgNWs, for which photolithographic and printing-based techniques have been widely used. However, several drawbacks such as high cost and complexity of the process disturb its practical application with patterning AgNWs. Herein, we propose a novel method for the patterning of AgNWs by employing UV-curable adhesive tape with a structure of liner/adhesive layer/polyolefin (PO) film and UV irradiation to simplify the process. First, the UV-curable adhesive tape was attached to AgNWs/polyurethane (PU), and then selectively exposed to UV irradiation by using a photomask. Subsequently, the UV-curable adhesive tape was peeled off and consequently AgNWs were patterned on PU substrate. This facile method is expected to be applicable to the fabrication of a variety of low-cost, shape-deformable transparent and wearable devices.

• Journal of Sensor Science and Technology
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• v.31 no.1
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2004.10a
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• pp.241-245
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• 2004

Among the various manufacturing processes of composites, the tape lay-up process of thermoset prepreg has many advantages compared to autoclave or hot press forming. It has a high potential to process automation and continuous fabrication .. Fiber placement developed as a logical combination of filament winding and automated tape placement to overcome some of the limitations of each manufacturing method. Fiber placement uses a compaction device to apply direct contact between the incoming materials in the fiber placement head and Heat is added to the materials at the nip point of the compaction roller. This paper will discuss property of thermoset composite as compaction and heat effect in Automated fiber placement

• 한국초전도학회:학술대회논문집
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• v.10
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• pp.289-292
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• 2000

In order to evade the patent of Oak Ridge National Laboratory (RABiTS process) and search for more economical process, a new process for producing the biaxially textured Ni tape by electrodeposition has been investigated. Electrodeposition was performed in the modified Watts bath. The crystal orientations of electrodeposited Ni were analysed by X-ray pole figure, ${\phi}$-scan and ${\omega}$-scan. The electrodeposited Ni tape showed cube texture with good out-of plane(< 8${\circ}$) and in-plane alignment(< 20${\circ}$).

• Progress in Superconductivity
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• v.3 no.2
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• pp.193-197
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• 2002

There are many problems in wire fabrication of long length Bi-2223 superconductor by using conventional extrusion method. They are mainly due to high surface resistance and inhomogeneous distribution of inner stress. Hydrostatic extrusion process will not only decrease the extrusion pressure but also enhance homogeneous deformation of material by reducing friction force between billet and container Hydrostatic extrusion method is considered to be useful fur fabrication of the homogeneous wire with high density. In this paper, hydrostatic extrusion process is introduced to fabricate Bi-2223 superconducting tape, and also discussed are the interface homogeneity and microstructural aspects of extruded BSCCO/Ag billet.

• Progress in Superconductivity and Cryogenics
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• v.9 no.4
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• pp.1-6
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• 2007

We describe methods for depositing high temperature superconducting films on textured metal tapes by reactive co-evaporation (RCE). We discuss how RCE can be used to deposit on moving tape in a continuous fashion in a Garching-style process. Results are presented on films deposited by RCE at Los Alamos on IBAD-MgO textured tapes. The performance achieved, attaining over 500A/cm-width in self-field at 75.5 K, is competitive with the best results obtained by other processes for coated conductors. Tape production throughput is critical for the economics of the process and high deposition rates achieved in RCE are attractive for this. We present a detailed cost analysis model for HTS deposition using an RCE Garching process. The results indicate that HTS deposition can cost $<$5/kA{\cdot}m$ in a scaled up manufacturing environment.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.24 no.2
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• pp.155-159
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• 2015

Light emitting devices (LEDs) are widely used in the liquid crystal display (LCD) industry, especially for LCD back light units. Therefore, much research has been performed to minimize manufacturing costs. However, the current process does not process LED chips from broken substrates even though the substrate is expensive sapphire wafer. This is because the broken substrates lose their alignment marks. After pre-processing, LED dies are glued onto blue tape to continue post-processing. If auxiliary alignment marks are stamped on the blue tape, post-processing can be performed using some of the LED dies from broken substrates. In this paper, a novel stamper module that can stamp the alignment mark on the blue tape is proposed, designed, and fabricated. In testing, the stamper was reliable even after a few hundred stamps. The module can position the stamp and apply the pattern effectively. By using this module, the LED industry can reduce manufacturing costs.