• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.3
• /
• pp.265-271
• /
• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• Progress in Superconductivity and Cryogenics
• /
• v.5 no.1
• /
• pp.31-34
• /
• 2003

Bi-2223 superconducting wires with 55 filaments were fabricated by stacking, drawing process with different heat-treatment histories. Two kinds of powders were prepared. One was pre-annealed at 760-820 $^{\circ}C$ and low oxygen partial pressure, and the other was only calcined state. Before rolling process, round wires were pre-annealed at 760 -820 $^{\circ}C$ and in a low oxygen partial pressure. We confirmed that pre-annealing step was to transform Bi-2212 orthorhombic structure from Bi-2212 tetragonal structure and to reduce the formation of second phases at superconducting wire. However Bi-2223 phases were formed at higher pre-annealing temperature. Bi-2223 conductor was needed frequently annealing at low temperature because pre-annealing at precursor powder brought about decrease in workability. We could achieve highest Je of 6500 A/$\textrm{cm}^2$ at the tape using Bi-2212 orthorhombic phase by introduced slightly overheating at the 1st sintering process.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.1783-1786
• /
• 2007

The copper film coated by Sn is often used in various applications such as LCD, Mobile Phone and etc. Especially, when the film is used as tape carrier package(TCP) of LCD panel, the film is repeatedly applied by mechanical or(and) thermal stress and then is often failed. Therefore, to guarantee the reliability of the electrical devices using the film, the tensile and fatigue characteristics of the film are important. In this study, to obtain the tensile and fatigue characteristics of the film, the specimen was fabricated by etching process to make a smooth specimen of 2000 ${\mu}m$ width, 8000 ${\mu}m$ length and 15.26 ${\mu}m$ thickness. The 2 kinds of specimen were fabricated by other manufacturing process. These specimens had values of Young's modulus(80.2GPa) lower than literature values(108${\sim}$145GPa) for bulk values, but had high values of the yield and ultimate strength as 317MPa and 437MPa, respectively. And fatigue test of load-control with 20Hz frequency was performed.

• Journal of Sensor Science and Technology
• /
• v.14 no.6
• /
• pp.423-429
• /
• 2005

In this paper, we proposed the fabrication process of the stable e-beam evaporation and the patterning of metals layer on the polydimethylsiloxane (PDMS) substrate. The metal layer was deposited under the various deposition rate, and its effect to the electrical and mechanical properties (e.g.: adhesion-strength of metal layer) was investigated. The influence of surface roughness to the adhesion-strength was also examined via the tape test. Here, we varied the roughness by changing the reactive ion etching (RIE) duration. The electrode patterning was performed through the conventional photolithography and chemical etching process after e-beam deposition of $200{\AA}$ Ti and $1000{\AA}$ Au. As a result, the adhesion strength of metal layer on the PDMS surface was greatly improved by the oxygen plasma treatment. The e-beam evaporation on the PDMS surface is known to create the wavy topography. Here, we found that such wavy patterns do not effect to the electrical and mechanical properties. In conclusion, the metal patterns with minimum $20{\mu}m$ line width was produced well via the our fabrication process, and its electrical conductance was almost similar to the that of metal patterns on the silicon or glass substrates.

• Journal of the Korean institute of surface engineering
• /
• v.32 no.3
• /
• pp.447-451
• /
• 1999

Silver has the highest electrical conductivity of all metals and consequently this property is an attractive feature which makes it a leading candidate for use in electronic devices. The research conducted was focused primarily on the development of a process for obtaining a deposited silver-coating onto alumina, for applications related to electrical-conducting devices and, ancillarily, catalysts. Alumina balls and plane substrates were utilized for the investigation. The coating process employed an aqueous ammoniacal silver-nitrate electrolytes with a formaldehyde solution as the reductant. Modifying additives-an activator which would be expected to promote good deposition-characteristics onto the (dielectric) substrate and an inhibitor which would obviate homogeneous reduction (precipitation) of silver was observed when the activator-containing silver-electrolyte reductant constituents were combined. However, the silver-electrolyte/reductant system with inhibitor could be employed (at 8$0^{\circ}C$) to achieve a viable (subject to future research optimization) coating on alumina. The influence of the processing temperature on the deposition process was delineated during the course of the research. The morphology of the deposited-silver on the alumina balls was assessed by SEM imaging. A tape-peel test was employed, with the plane substrates, to semi-quantitatively characterize the adhesion to the alumina.

• 한국신재생에너지학회:학술대회논문집
• /
• 2008.05a
• /
• pp.13-16
• /
• 2008

Solid oxide fuel cell(SOFC) is an electrochemical energy conversion system with high efficiency and low-emission of pollution. In order to reduce the operating temperature of SOFC system under $800^{\circ}C$, the thickness reduction of YSZ electrolyte to be as thin as possible, e.g., less than 10 ${\mu}m$ are considered with the microstructure control and optimum design of unit cell. Methods for reducing the thickness of YSZ electrolyte have been investigated in coin cell. Moreover, a large unit cell($8cm{\times}8cm$) for SOFC was fabricated using an anode-supported electrolyte assembly with a thinner electrolyte layer, which was prepared by a tape casting method with a co-sintering technique. we studied the design factors such as active layer, electrolyte thickness, cathode composition, etc,. by the coin type of unit cell ahead of the fabrication process of a large unit cell and also reviewed about the evaluation technique of a large size unit cell such as interconnect design, sealing materials and current collector and so forth. Electrochemical evaluations of the unit cells, including measurements such as power density and impedance, were performed and analyzed. Maximum power density and polarization impedance of coin cell were 0.34W/$cm^2$ and $0.45{\Omega}cm^2$ at $800^{\circ}C$, respectively. However, Maxium power density of a large unit cell($5cm{\times}5cm$) decreased to 0.21W/$cm^2$ at $800^{\circ}C$ due to the increase of ohmic resistance. However, It was found that the potential value of a large unit cell loaded by 0.22A/$cm^2$ showed 0.76V at 100hrs without the degradation of unit cell.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.29 no.10
• /
• pp.601-607
• /
• 2016

Piezoelectric thick films of soft $Pb(Zr,Ti)O_3$ (PZT) based commercial material (S55) were fabricated using a conventional tape casting method. Ag-Pd electrodes were printed on the piezoelectric film at room temperature and all 5 layered films with a dimension of $12mm{\times}16mm$ were successfully laminated for a multi-layered piezoelectric ceramic actuator. The laminated specimens were co-fired at $1,100^{\circ}C$ for 1 h. A flat layered and dense microstructure was obtained for the $112{\mu}m$ thick piezoelectric actuator after sintering process. Thereafter, a prototype piezoelectric speaker was fabricated using the multi-layered piezoelectric ceramic actuator which can operate as a bimorph. Its SPL (sound pressure level) characteristic was also evaluated for speaker application. Frequency response revealed that the output SPL with a root mean square voltage of 10 V increased gradually to the highest peak of 87.5 dB for 1.5 kHz and exhibited a relatively stable behavior over the measured frequency range (${\leq}20kHz$) at a distance of 10 cm, implying that the fabricated piezoelectric speaker is potential for speaker applications.

• Journal of Powder Materials
• /
• v.24 no.5
• /
• pp.364-369
• /
• 2017

Ceramic powder, such as MgO, is added as a binder to prepare the green compacts of molten salts of an electrolyte for a thermal battery. Despite the addition of a binder, when the thickness of the electrolyte decreases to improve the battery performance, the problem with the unintentional short circuit between the anode and cathode still remains. To improve the current powder molding method, a new type of electrolyte separator with porous MgO preforms is prepared and characteristics of the thermal battery are evaluated. A Spherical PMMA polymer powder is added as a pore-forming agent in the MgO powder, and an organic binder is used to prepare slurry appropriate for tape casting. A porous MgO preform with $300{\mu}m$ thickness is prepared through a binder burnout and sintering process. The particle size of the starting MgO powder has an effect, not on the porosity of the porous MgO preform, but on the battery characteristics. The porosity of the porous MgO preforms is controlled from 60 to 75% using a pore-forming agent. The batteries prepared using various porosities of preforms show a performance equal to or higher than that of the pellet-shaped battery prepared by the conventional powder molding method.

• Transactions on Electrical and Electronic Materials
• /
• v.1 no.2
• /
• pp.32-37
• /
• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.07a
• /
• pp.551-554
• /
• 2004

Bi-2223 HTS tapes are used widely for application of superconducting power systems. However there are need the properties of high strength and low AC loss. Two kinds of Bi-2223 HTS tapes with different Ag sheath were used to know the effect of sheath alloying for the strength and the resistivity. The workability and reaction degree of superconducting phase at Bi-2223 HTS tapes were investigated. We designed conventional type-Ag/alloy and double sheathed mono filament type-Ag/alloy/alloy in order to increase the strength and resistivity of matrix in Bi-2223 HTS tapes. The effect of axial strain and thermal cycling on the critical current was investigated for the Bi-2223 HTS tapes. Because the workability of double sheath Bi-2223 HTS tape was lower than one sheath Bi-2223 HTS tape, it was need additional softening treatment. Bi-2223 formation reaction was decreased by Ag alloy matrix during sintering process. Two kinds of Bi-2223/Ag tapes with different Ag sheath were used to know the effect of sheath alloying for the tensile strain. Critical current is drastically decreased for Ag/alloy and Ag/alloy/alloy sheathed tapes at tensile strain above 0.24 % and 0.34 %, respectively. This result showed that mechanical strength was increased over than 40 % by introduce double sheath at mono filament stage.