• 한국세라믹학회지
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• 제28권6호
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• pp.488-494
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• 1991

In this study, the effects of catalyst and DCCA content were investigated in order to determine the optimum conditions of monolithic silica gel formation through sol-gel process. Formamide, oxalic acid, glycerol and dimethylformamide are used as DCCA. To observe the phenomena in drying and heat-treating of gels, we examined structural exchange of gels using FT-IR, TG-DTA and XRD. Monolithic gels were obtained by adding formamide and dimethylformamide as DCCA. According to the heat treatment schedule, silica glass is prepared by heat-treatment up to 1050$^{\circ}C$.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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• pp.336-340
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• 2001

Theoretical efforts were taken to investigate an optimum heat treatment process in martensitic stainlesssteel. The approach is based on the combination of the interpolation and extrapolation method of a standard heat treatment technology with the principle of quenching and tempering temperature difference. The relationship of macroscopic structure and fracture toughness and ductility as well as the Hardness and strength has been focused to induce a simple rule to apply with feasibility. As a result it was found that the grain size influences to the fracture toughness and ductility significantly.

• 한국산업융합학회 논문집
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• 제23권2_2호
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• pp.281-288
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• 2020

In this paper, we propose a control method to solve the surface hardness non-uniformity due to flow non-uniformity occurring in the heat treatment process of marine CAM. In the water cooling method including the decarbonization method, an automation device for deformation control has been developed and applied. LSTM was used to estimate the water cooling conditions, and the proposed method was found to be meaningful by improving the prototype results.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.303-308
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• 1994

The finite element method has been used to model and analyze the heat transfer phenomena during manufacturing process of MoSi $_{2}$ by SHS. For this urpose nonlinear transient heat transfer analyses by using ANSYS have been performed to compute the temperature distributiuon and the peak temperature in the test specimen. The effects of manufacturing process parameters such as a pre-heating temperature, the velocity of reaction zone have also been investigated. The results of the analysis have been compared with the experimental results.

• 대한기계학회논문집A
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• 제27권5호
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• pp.815-822
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• 2003

The ring rolling process involves not only three-dimensional non-steady material flow and continuous change of radius and thickness of the ring workpiece but also heat transfer among workpiece, rolls and environment. In this study, deformation and heat transfer analyses were conducted by using the three-dimensional thermo-rigid-plastic finite element method. Three cases of plain ring rolling process were, respectively, simulated for the predictions of roll forces and the highest temperature zone during the aluminum process that ductile fracture often occurs. In addition, to prevent fishtail phenomena of the ring workpiece, axial rolls were used for this study.

• 한국기계가공학회지
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• 제5권2호
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• pp.56-64
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• 2006

Rapid progress in many branches of technology has led to a demand on new materials such as high strength light weight alloys, powdered alloys and composite materials. The hydrostatic extrusion is essentially a method of extruding a clad rod through a die. In order to investigate the effect of the process conditions such as friction heat, deformation and clad thickness on the clad extrusion process, viscoplastic finite element simulations were conducted. A specific model for theoretical analysis used in this study is The single scalar variable version of Hart's model. An experiment also has been carried out using 1.5MN hydrostatic extruder with variable speed ram, LVDT and load cell for comparison. It is found that the hydrostatic extrusion pressure considering the effect of heat dissipation in this theoretical work was closer to the experimental pressure than the isothermal hydrostatic extrusion pressure.

• 대한기계학회논문집B
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• 제25권1호
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• pp.36-46
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• 2001

Finite element analyses of the ceramic drying process are performed. The heat and moisture movements in green ceramics caused by temperature gradient, moisture gradient, conduction, convection and evaporation are considered. The finite element formulation for solving the temperature and moisture distributions which not only change the volume but also induce the hygro-thermal stress is carried out. In order to verify the formulation, the drying process of a ceramic electric insulator is simulated. Temperature distribution, moisture distribution, and hygro-thermal stress are compared with those of other researcher. Good agreements are achieved.

• 한국표면공학회지
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• 제46권2호
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• pp.61-67
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• 2013

Thin film solar cells have attracted much attention due to their high cell efficiency, comparatively low process cost, and applicability to flexible substrates. In particular, CIGS solar cells have been widely studied and produced because they demonstrated the highest cell efficiency. However, the deposition process of CIGS films generally includes the selenization process conducted at elevated temperature using toxic $H_2Se$ gas. To avoid this selenization process, CIGS thin films were, in this study, deposited by RF sputtering using single composite CIGS target. In addition, the effects of sputtering bias voltage and heat treatment on the microstructural and morphological changes in deposited CIGS films were investigated and discussed.

• 센서학회지
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• 제31권1호
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• pp.36-40
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• 2022

High-power devices, such as LEDs and radars, inevitably generate a large amount of heat, which is the main cause of shortening lifespan, deterioration in performance, and failure of electronic devices. The embedded IC process can be a solution; however, when applied to large-area substrates (larger than 8 in), there is a limit owing to the difficulty in the process after wafer thinning. In this study, an 8-in wafer-level high-power electronic package based on the embedded IC process was implemented with temporary bonding and debonding technology using double-sided thermal release tape. Good heat-dissipation characteristics were demonstrated both theoretically and experimentally. These findings will advance the commercialization of high-power electronic packaging.

• Journal of Welding and Joining
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• 제17권5호
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• pp.77-82
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• 1999

Resistance spot welding process is completed in very short time and there are many factors affecting on the generation of heat. It is difficult to control these experimental factors and monitor distribution of the temperature and stresses in the experimental analysis case. and too much time and expense are required for the experimental trials to fine proper welding condition. So numerical analyses have been attempted steadily, but most numerical analyses on the resistance spot welding are mainly focused on thermal behavior. Therefore, in this paper, the numerical analysis of mechanical behavior as well as heat conduction is carried out for the spot welding process. For this numerical analysis, axial symmetric computer program for the spot welding analysis by F.E.M. has been developed considering heat conduction and thermal elastic-plastic theory. Material properties depending on temperature such as density, heat conductivity, heat expansion coefficient, specific heat, yield stress, elastic modulus, and specific resistance are considered. Using the results of temperature distribution obtained from heat conduction analysis, the thermal elastic-plastic analysis is carried out to clarify mechanical behavior of spot welded specimen. In order to evaluate the effect of residual stresses, numerical analyses are carried out under tension-shear load in two cases respectively; one with residual stress, the other without residual stresses.