• 제목/요약/키워드: Process Control Monitor

검색결과 300건 처리시간 0.071초

공정용 컴퓨터를 위한 표준시각 수신장치 개발에 관한 연구 (A study on the development of standard-time receiving device for process computer)

  • 홍용표;손창호
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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    • pp.592-596
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    • 1988
  • PCS(Process Computer System) is installed to monitor various kinds of process parameters in Power Plant and networked for synthetic monitor and event analysis in all site. But when an event is occured sequentially or simultaneously among the plants, it is difficult to analyze it because of different Standard-Time in each Plant. Standard-Time Receiving Device is developed to solve this problem and development procedure is descried here.

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공정용 컴퓨터를 위한 표준시각 수신장치 개발에 관한 연구 (A study on the development of standard-time receiving device for process computer)

  • 홍용표;손창호
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국내학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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    • pp.385-389
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    • 1988
  • PCS(Process Computer System) is installed to monitor various kinds of process parameters in Power Plant and networked for synthetic monitor and event analysis in all site. But when an event is occured sequentially or simultaneously among the plants, it is difficult to analyze it because of different Stardard-Time in each plant. Standard-Time Receiving Device is developed to solve this problem and development procedure is described here.

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Monitor Backcover의 사이클 타임 단축에 관한 연구 (A Study on The Reduction of Cycle Time in Injection Molding Process of The Monitor Backcover)

  • 윤경환;김주권
    • 소성∙가공
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    • 제14권4호
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    • pp.368-374
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    • 2005
  • In the present study we used a diagrammatic analysis of 6 sigma quality control and Taguchi method for injection molding of monitor back-cover, evaluated the influence on the cycle time with part design, mold design, molding process and standardization activity involving design and molding, adopted analysis of sensitivity and effective factors of the part design and molding process conditions for productivity, identified main design molding factors. The contributing factors for the final cycle time could be enumerated as follows; the thickness of hot spot, main nominal part thickness, coolant inlet temperature, melt temperature and cooling line layout, etc.. As a first step, all the critical factors of design process applied to the current monitor housing were investigated through 6 sigma process. Thereafter, the optimal and better critical factors found in the first step were applied to new product design to prove that our process was correct. The Moldflow was used for injection molding simulation, and Minitab software for the statistical analysis, respectively. Finally, the productivity of new design was increased about 33 percents for our specific case.

Monitor backcover의 사출시간 단축에 관한 연구 (A Study on The Reduction of Cycle Time in Injection Molding Process of The Monitor Backcover)

  • 김주권;김종선;윤경환
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 춘계학술대회 논문집
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    • pp.269-272
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    • 2004
  • The present study used a diagrammatic analysis of 6 sigma quality control and Taguchi method for injection molding process of monitor back-cover, evaluated the influence on the cycle time with part design, mold design, molding process and standardization activity involving design & molding, adopted analysis of sensitivity and effective factors of the part design and molding process conditions for productivity, identified main design molding factors, as critical ones influencing on the quality and productivity, of which is summarized as design guidance. The main contribution factors for cycle time can be sequentially enumerated as follows; hot spot, part thickness, coolant inlet temperature, melt temperature cooling line layout, etc.. As a first step critical factors of the design process of current monitor housing were investigated. And the optimal and better critical factors found in the first step were applied to a new product proving our process was correct. Moldflow software was used for injection molding simulation, and Minitab software for the statistical analysis. Finally, the productivity was increased by about 33 percents for our specific case.

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Design an Automatic System to Control and Monitor the Process of Straw Mushrooms Indoors Cultivation

  • Quoc Cuong Nguyen;Quoc Huy Nguyen;Jaesang Cha
    • International Journal of Internet, Broadcasting and Communication
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    • 제16권2호
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    • pp.59-67
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    • 2024
  • Current straw mushroom farming in countries with large rice growing areas has great development potential, and was once considered a way to generate additional income and reduce poverty in rural areas. However, currently most people still grow mushrooms using traditional processes, leading to low productivity and unguaranteed output quality. Currently, due to climate change and unusual weather changes, people tend to switch to growing straw mushrooms indoors. In the process of growing straw mushrooms indoors, the design of an automatic control and monitoring system is very important to ensure the growing process is carried out effectively and achieves high yields. In this paper, we propose a system that can automatically control and monitor the humidity and temperature of the indoor straw mushroom growing process and other parameters that can be monitored through a network system using Internet of Things. The control algorithm automatically adjusts the grow house equipment based on feedback from sensors to maintain an optimal environment for growing straw mushrooms. Experimental results show that the straw mushroom growing system with automatically controlled and monitored environmental parameters helps improve efficiency, reduce costs and increase the sustainability of the current straw mushroom growing industry.

A Study on the Monitoring of Reject Rate in High Yield Process

  • Nam, Ho-Soo
    • Journal of the Korean Data and Information Science Society
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    • 제18권3호
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    • pp.773-782
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    • 2007
  • The statistical process control charts are very extensively used for monitoring of process mean, deviation, defect rate or reject rate. In this paper we consider a control chart to monitor the process reject rate in the high yield process, which is based on the observed cumulative probability of the number of items inspected until r defective items are observed. We first propose selection of the optimal value of r in the CPC-r charts, and also consider the usefulness of the chart in high yield process such as semiconductor or TFT-LCD manufacturing process.

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Plasma control Using a Linear Quadratic Regulated RF Impedance Match Process

  • Kim, Byung-Whan;Park, Jang-Hyun;Park, Gwi-Tae
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.31.2-31
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    • 2001
  • A real-time control strategy is presented for plasma control Rather than in-situ plasma variables, this is based on realtime measurements of two electrical positions that correspond to two match motors. Using the rf match monitor system, the positions were collected. The process of impedance matching was identified with variations in process factors, including rf power, pressure, and O$_2$ flow rate. A state-space model was obtained basing on autoregressive moving average model. For this model, a linear quadratic regulator was designed and applied. Simulation results revealed that match positions could accurately be regulated to follow certain positions arbitrarily chosen.

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EWMA Control Charts to Monitor Correlation Coefficients

  • Chang, Duk-Joon;Cho, Gyo-Young;Lee, Jae-Man
    • Communications for Statistical Applications and Methods
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    • 제6권2호
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    • pp.413-422
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    • 1999
  • Multivariate EWMA control charts to simultaneously monitor correlation coefficients of correlated quality characteristics under multivariate normal process are proposed. Performances of the proposed charts are measured in terms of average run length(ARL). Numerical results show that smalle values for smoothing constant with accumulate-combine approach are preferred for detecting smalle shifts.

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A Study on Arc Force Sensor for a Robotic Welding Control System

  • Son, Joon-Sik;Kim, Ill-Soo;Choi, Seung-Gap;Kueon, Yeong-Seob;Lee, Duk-Man
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2001년도 ICCAS
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    • pp.128.5-128
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    • 2001
  • This paper presents investigation of an arc force sensor for a robotic welding control system. Arc force sensor is employed in this research to monitor the bead geometry of the arc welding process. Arc force sensor mounted at the end of the robot wrist was employed to measure the arc force applied to the weld. Experimental configuration for measurement of arc force was used to quantify the changes in the arc force distributions of the plate being welded. A relationship between the bead dimension and the arc force distributions was established. The sensor information was used to establish a relationship between welding current and arc force. Arc force sensor have shown to be one of the most sophisticated technique to monitor perturbations that occurred during robotic arc welding process.

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A Novel Test Structure for Process Control Monitor for Un-Cooled Bolometer Area Array Detector Technology

  • Saxena, R.S.;Bhan, R.K.;Jalwania, C.R.;Lomash, S.K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제6권4호
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    • pp.299-312
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    • 2006
  • This paper presents the results of a novel test structure for process control monitor for uncooled IR detector technology of microbolometer arrays. The proposed test structure is based on resistive network configuration. The theoretical model for resistance of this network has been developed using 'Compensation' and 'Superposition' network theorems. The theoretical results of proposed resistive network have been verified by wired hardware testing as well as using an actual 16x16 networked bolometer array. The proposed structure uses simple two-level metal process and is easy to integrate with standard CMOS process line. The proposed structure can imitate the performance of actual fabricated version of area array closely and it uses only 32 pins instead of 512 using conventional method for a $16{\times}16$ array. Further, it has been demonstrated that the defective or faulty elements can be identified vividly using extraction matrix, whose values are quite similar(within the error of 0.1%), which verifies the algorithm in small variation case(${\sim}1%$ variation). For example, an element, intentionally damaged electrically, has been shown to have the difference magnitude much higher than rest of the elements(1.45 a.u. as compared to ${\sim}$ 0.25 a.u. of others), confirming that it is defective. Further, for the devices having non-uniformity ${\leq}$ 10%, both the actual non-uniformity and faults are predicted well. Finally, using our analysis, we have been able to grade(pass or fail) 60 actual devices based on quantitative estimation of non-uniformity ranging from < 5% to > 20%. Additionally, we have been able to identify the number of bad elements ranging from 0 to > 15 in above devices.