• 한국염색가공학회지
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• 제6권4호
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• pp.62-71
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• 1994

The weighting increase varies with the condition of tannin-weight process and effects dyeability and physical properties of silk. The purpose of this study is to investigate the optimum condition of tannin-weighting process of silk and the effect of tannin-weighting process on dyeability and properties of silk. The methods of this study are first to examine the change according to the variables such as, weight increase of silk, temperature(30, 50, 70, 80, 9$0^{\circ}C$), time(30, 60, 120, 180, 240, 300min), tannin concentration(3, 5, 10, 20, 30g/l) in order to present the optimum condition, sencond to examine the change of the properties such as surface morphology, strength, elongation, mechanical values, dyeing condition, Basic and Acid dye absorption on silk which are tannin-weight processed in the optimum condition.

• 한국막학회:학술대회논문집
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• 한국막학회 1998년도 제6회 하계 Workshop (98 한국막학회, 국립환경연구원 국제 Workshop, 수자원 보전과 막분리 공정)
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• pp.113-133
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• 1998

In activated sludge process, sludge settling condition is affected by organic loading rate or operation condition, and if settling condition is getting worse, it is common that overall process fails due to wash-out of biomass causing low concentration in the aeration tank. Also activated sludge process has such several problems as requiring large area, consuming a lot of power and producing large volume of sludge. Increased public concern over health and the environment combined with a strong desire to reduce capital, operating and maintenance costs, have created a need for innovative technologies for building new high quality effluents which vail meet 21st century crkeria. MBR(Membrane Bioreactor) process consists of a biological reactor and ultrafiltration(UF) membrane system that replaces the conventional clarifier of an activated sludge process. The main operating advantages of this system are that the quality of the effluent is independent of the settleability of the mixed liquor and that the effluent is free of suspended solids in any operating condition. It is possible to eliminate clarifier and to reduce the volume of aeration tank because it can afford to accumulate high biomass concentration in the bioreactor(20, 000~30, 000mg/L), which would not be possible in a conventional activated sludge process. Therefore, this process reduces overall treatment plant area. In addition to those advantages, Longer SRT condition enables higher sludge digestion in MBR process so the sludge volume produced is 50 to 70% lower than that of conventional activated sludge process There are two kinds of MBR process according to the allocations of membrane. One is cross flow type MBR of which module is located outside of the bioreactor and mixed liquor is driven into the membrane module. The other is submerged type MBR process of which module is submerged in the bioreactor and mixed liquor is generally sucked from the lumen side. addition to that the cake layer is often removed by the uplifting flow of bubbling air. A submerged MBR process is superior to a crossflow MBR in regard to the power consumption because suction pressure of a submerged MBR is generally lower than that of a crossflow MBR which has recirculation pump. A submerged MBR, therefore, has the potential to be applied to small wastewater treatment plants that need low cost treatment systems.

• 멤브레인
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• 제9권4호
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• pp.193-201
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• 1999

기존의 정수처리 공정인 응집 침전 과정을 대체하여 분리막을 이용한 상수처리 시스템의 개발을 목적으로한다. 따라서 4가지 형태의 정수처리 공정과 분리막의 분획 분자량을 변화시켰을 때 막 투과수의 변화와 안정적이며 높은 투과수를 얻기 위해 필요한 운전 조건의 최적화를 실험하였다 실험결과 한외여과막이 정밀여과막보다 막 투과수 감소경향이 완만했으며 초기 투과수 회복율은 더 높았다. 수질 분석의 결과 한회여과막이 정밀 여과막보다 우수하였지만 전처리에 의한 차이는 나지 않았다. 운전 조건에 따른 flux 는 온도, 선속도가 높을수록 압력이 낮을수록 flux 감소율이 적은 경향을 나타내었다.

• 한국기계가공학회지
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• 제8권1호
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• pp.31-36
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• 2009

Micro-machining technology has been adopted for shape accuracy of micrometer and sub-micrometer scale, surface roughness of tens nanometer in industries. In micro-machining process the quality of machined surface is derived from machining condition and tooling. This paper investigates AE(acoustic emission) and cutting force signals according to machined surface quality related to machining condition. Machined surface quality was analyzed by the AE and cutting force parameter which reflect surface morphology. The characteristics of signal were extracted for process optimization by monitoring both the tool condition and the machined surface texture in micro end milling process.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2014년도 추계학술대회 논문집
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• pp.739-742
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• 2014

In the process of MLCC manufacturing, MLCC stacking process is the key process of making high quality MLCC. Since MLCC is small components, the entire process of MLCC stacking process is minute and sensitive to micro errors. To prevent micro error, we suggest condition-based monitoring which quantifies error based on feature extraction and quantifying error method. As results, it has been shown that the suggested algorithm has effectiveness of condition based monitoring of MLCC stacker.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 B
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• pp.1365-1367
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• 2003

In this paper, element technologies such as soldering. arrangement and lamination processes for photovoltaic module manufacture were examined and described as main processes. Especially solder paste and temperature condition in soldering process, loss factor in arrangement process and process conditions in lamination process are investigated to minimize the electrical loss. As a results, temperature condition in soldering process was found to be critical to contact resistance of electrode and life-time. Productivity of the process decreases dramatically by physical damage during arrangement process. Pressure level and press condition of upper chamber in lamination process were important parameters for the reliability. According to the test result of photovoltaic module, electrical properties dropped about $5{\sim}25%$ after 5 years.

• 한국기계가공학회지
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• 제11권1호
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• 한국기계가공학회지
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• 제14권1호
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• pp.70-77
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• 2015

This paper develops and evaluates a mechanical machining process which involves drilling on PVS material. According to the material, two treatment experiments were conducted, one involving drilling in a wet condition or using a lubricant and one involving drilling in a dry condition with no lubricant. Drilling in a dry condition showed better performance in terms of the cutting time than in the wet condition. Otherwise, the wet condition has several advantages. The lubricant influenced the burr diameter size and minimized the temperature on the surface of the work piece. During the wet condition drilling process, a smaller burr diameter size was noted as compared to the dry condition. The temperature showed a linear correlation with the drill bit size, where a least-square analysis provided an $R^2$valuewhichexceeded 0.95. The wet condition required more cutting time than the dry condition. In this condition, the water provides a lubrication effect. A thin layer between the cutting edges and the surface of the work piece is formed. The chip formation is affected by the drilling depth. The color on the tips of the chips was darker than in the initial condition. No correlation between the drilling depth and the bore roughness was noted, but the variation of the cutting speed or the RPM influenced the roughness of the bore. The optimum cutting speed ranged from 40 RPM to 45 RPM in the condition which provided the finest roughness surface.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2015년도 춘계 학술논문 발표대회
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• pp.230-231
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• 2015

Recently, although researching and developing of safety and maintenance on domestic infrastructure facilities in KOREA are important, there has been very little research regarding on a comprehensive and integrated survey of actual condition. Therefore this study asserts the necessity of the survey process of actual condition by period planning(short-term, middle-term, long-term). The purpose of this study is to investigate current situation and to suggest the whole process method, and to establish survey process of actual condition on domestic infrastructure facilities.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2002년도 춘계종합학술대회
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• pp.279-282
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• 2002

In this paper, we discuss influence of process condition on contact resistance in WSix deposition process. In the WSix deposition process, we confirmed that word line to bit line contact resistance(WBCR) due to temperature of word line WSix deposition among various process condition split experiment. RTP treatment, d-poly ion implantation dose and thickness was estimated a little bit influence on contact resistance. Also, life time of shower head in the process chamber for WSix deposition related to contact resistance. The results obtained in this study are applicable to process control and electrical characteristics for high reliability and high density DRAM's.