• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1189-1192
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• 2009

Short channel a-Si:H TFT devices with Cu electrodes have been investigated. Short channel TFTs are defined by new plasma etch process. When the channel length becomes shorter, the TFT characteristics (threshold voltage, off current, sub threshold voltage, etc.,) are degraded. These degraded characteristics can be improved through the hydrogen plasma treatment and new gate insulator structure. Using these processes, 15.0 inch XGA LCD panel was fabricated successfully where the channel length of the TFT devices was about 2.5 micrometers.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.1
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• pp.48-56
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• 2021

In this study, the heat transfer process around the finned channel tubes is numerically examined. Serially arranged tubes of an evaporator were used for heat exchange. The numerical analysis results confirmed that the vortex generated at the rear of the channel pipe was caused by the fin. Furthermore, it was also confirmed that the temperature difference was large between the inlet and outlet ends of the fin. The temperature of the location where the fin was attached to the channel pipe was found to be close to the surface temperature of the channel wall. However, the temperature rose rapidly closer to the ambient air temperature of 350 K towards the fin end, located at a distance of 0.035 m; it was found to have a significant influence on the heat transfer around the fin-attached channel tube. The wider the vertical flow path, the lower the total heat transfer coefficient. However, the overall heat transfer coefficient increased as the horizontal flow path narrowed. The increment is attributed to an increase in the heat transfer amount due to increased heat transfer surface.

• Transactions of Materials Processing
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• v.9 no.3
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• pp.219-225
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• 2000

Equal channel angular pressing (ECAP) is a convenient forming process to extrude material without substantial changes in the sample geometry and this deformation process gives rise to produce ultrafine grained materials. The properties of the materials are strongly dependent on the plastic deformation behaviour during ECAP. The major process variables during ECAP are 1) die geometries, such as a channel angle and coner angles, and 2) the processes variables, such as lubrication and deformation speed. In this study, the plastic deformation behaviour of materials during the ECAP has been theoretically analysed by the finite element method (FEM). The effect of the die friction on the plastic deformation behaviour during the pressing is discussed by means of FEM calculations.

• Transactions of Materials Processing
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• v.21 no.3
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• pp.164-171
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• 2012

This paper focuses on the development of a new SPD (severe plastic deformation) process named HCAE (half channel angular extrusion). HCAE technology is based on principled similar to ECAE, but imposes a larger amount and more effective plastic deformation on materials. The amount of shear deformation can be altered by varying the process parameters. Finite element analyses of HCAE were conducted in order to investigate the characteristics of deformation during HCAE and the simulated results show that the predicted value of imposed plastic strain in a single pass reaches 2.5.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.6
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• pp.421-425
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• 2016

Micro-EDM is one of the recent fine-machining technologies. Micro-EDM is widely used in precision processes because products manufactured via EDM are free from workpiece hardness. However, the debris produced during the process cause many problems such as reduced precision of the process. The first solution of this problem involves using the milling hole process. Micro-EDM hole process involves an electrode moving rapidly in the vertical direction via a servo system to disperse debris. However, this process can cause reduced work efficiency owing to contact between the electrode and workpiece. In this study, ultrasonic vibration is added to micro-EDM channel machining. Ultrasonic vibration removes the debris during machining and enables precision machining. Consequently, a clean work environment for the subsequent processes is maintained.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.9
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• pp.729-734
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• 2000

Recently, Very Large Scale Integrated (VLSI) circuit & deep-submicron bulk Complementary Metal Oxide Semiconductor(CMOS) devices require gate electrode materials such as metal-silicide, Titanium-silicide for gate oxides. Many previous authors have researched the improvement sub-micron gate oxide quality. However, few have reported on the electrical quality and reliability on the ultra thin gate oxide. In this paper, at first, I recommand a novel shallow trench isolation structure to suppress the corner metal-oxide semiconductor field-effect transistor(MOSFET) inherent to shallow trench isolation for sub 0.1${\mu}{\textrm}{m}$ gate oxide. Different from using normal LOCOS technology deep-submicron CMOS devices using novel Shallow Trench Isolation(STI) technology have a unique"inverse narrow-channel effects"-when the channel width of the devices is scaled down, their threshold voltage is shrunk instead of increased as for the contribution of the channel edge current to the total channel current as the channel width is reduced. Secondly, Titanium silicide process clarified that fluorine contamination caused by the gate sidewall etching inhibits the silicidation reaction and accelerates agglomeration. To overcome these problems, a novel Two-step Deposited silicide(TDS) process has been developed. The key point of this process is the deposition and subsequent removal of titanium before silicidation. Based on the research, It is found that novel STI structure by the SEM, in addition to thermally stable silicide process was achieved. We also obtained the decrease threshold voltage value of the channel edge. resulting in the better improvement of the narrow channel effect. low sheet resistance and stress, and high threshold voltage. Besides, sheet resistance and stress value, rms(root mean square) by AFM were observed. On the electrical characteristics, low leakage current and trap density at the Si/SiO$_2$were confirmed by the high threshold voltage sub 0.1${\mu}{\textrm}{m}$ gate oxide.

• Design & Manufacturing
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• v.16 no.3
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• pp.58-65
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• 2022

Micro-fluidic chip has been fabricated by lithography process on silicon or glass wafer, casting using PDMS, injection molding of thermoplastics or 3D printing, etc. Among these processes, 3D printing can fabricate micro-fluidic chip directly from the design without master or template for fluidic channel fabricated previously. Due to this direct printing, 3D printing provides very fast and economical method for prototyping micro-fluidic chip comparing to conventional fabrication process such as lithography, PDMS casting or injection molding. Although 3D printing is now used more extensively due to this fast and cheap process done automatically by single printing machine, there are some issues on accuracy or surface characteristics, etc. The accuracy of the shape and size of the micro-channel is limited by the resolution of the printing and printing direction or layering direction in case of SLM type of 3D printing using UV curable resin. In this study, the printing direction and thickness of each printing layer are investigated to see the effect on the size, shape and surface of the micro-channel. A set of micro-channels with different size was designed and arrayed orthogonal. Micro-fluidic chips are 3D printed in different directions to the micro-channel, orthogonal, parallel, or skewed. The shape of the cross-section of the micro-channel and the surface of the micro-channel are photographed using optical microscopy. From a series of experiments, an optimal printing direction and process conditions are investigated for 3D printing of micro-fluidic chip.

• The Research Journal of the Costume Culture
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• v.24 no.6
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• pp.803-816
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• 2016

The purposes of this study were to investigate the influences of channel assessments on the usage of multi-channels by product types, and the differences in the usage of multi-channels among product types in buying decision making process for fashion products. Data were collected from 510 consumers in their 20s to 50s with purchasing experiences through multi-channel distribution system and living in Seoul and Kyunggi province; 491 were analyzed after deleting incomplete questionnaires. Factor analysis, multiple regression analysis and one-way ANOVA were used for statistical analysis by using SPSS 18.0. The results were as follows: 5 factors were extracted for channel assessment: utility, accuracy, risk, price benefit and sharing information. Price benefits, utility and sharing information for online channel tended to influence positively on the usage of online channel and online+offline channels. Accuracy and low perceived risk of offline influenced positively on offline and on+offline channel usages. The usage levels of on-line and off-line channels for cosmetics were significantly lower than the usage levels for clothes and accessories on information search, evaluation of alternatives, and purchase stages. Significant differences were also found in the usage levels of multi-channels (on+off-line) on information search and evaluation of alternatives stages. The usage levels of the multi-channels for clothes were the highest followed by those of accessories and cosmetics in order.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.33-33
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• 2009

Silicon nano-structures have great potential in bionic sensor applications. Atomic force microscopy (AFM) anodic oxidation have many advantages for the nanostructure fabrication, such as simple process in atmosphere at room temperature, compatibility with conventional Si process. In this work, we fabricated simple FET structures with channel width W~ 10nm (nanowire) and $1{\mu}m$ (nano-ribbon) on ~10, 20 and 100nm-thinned silicon-on-insulator (SOI) wafers in order to investigate the surface effect on the transport characteristics of nano-channel. For further quantitative analysis, we carried out the 2D numerical simulations to investigate the effect of channel surface states on the carrier distribution behavior inside the channel. The simulated 2D cross-sectional structures of fabricated devices had channel heights of H ~ 10, 20, and 100nm, widths of L ~ $1{\mu}m$ and 10nm respectively, where we simultaneously varied the channel surface charge density from $1{\times}10^{-9}$ to $1{\times}10^{-7}C/cm2$. It has been shown that the side-wall charge of nanowire channel mainly affect the I-V characteristics and this was confirmed by the 2D numerical simulations.

• The Research Journal of the Costume Culture
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• v.26 no.1
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• pp.109-124
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• 2018

As fashion and distribution companies have increasingly turned to implementing marketing activities that use omni-channel strategies, it is imperative to explore consumer-oriented evaluations of omni-channel shopping for fashion products. Through contributing to the growing research flow of consumer behavior within omni-channel contexts, the current study explores consumer motivations for omni-channel fashion shopping and their impacts on the decision-making stages of fashion products. The authors first performed in-depth interviews with six Korean consumers and confirmed the four types of consumer motivation for omni-channel shopping, and how decision-making processes react to fashion companies' omni- channel marketing strategies. These findings were used to set survey items for the main study. Based on the results and findings of previous literature, an online survey was conducted with 300 participants who had actual experience with omni-channel shopping for fashion products. The statistic results from the survey revealed the following: First, the in-depth interviews allowed the authors to confirm four factors of omni-channel shopping motivation (ubiquity, efficiency, convenience, and impulsiveness). Second, the survey showed the authors that among the four factors of omni-channel shopping orientation, impulsiveness had the greatest effect on consumer behaviors at the preand on-purchase stages, while the ubiquity factor had the greatest effect at the post-purchase stage. As such, the study empirically tested the omni-channel-specific factors of shopping orientation and motivation. In addition, it showed the effect of omni-channel marketing on various stages of the decision- making process and the study's limitations and implications were discussed.