• 제목/요약/키워드: Printed model

검색결과 326건 처리시간 0.022초

Screen printed contacts formation by rapid thermal annealing in multicrystalline silicon solar cells

  • Kim, Kyung hae;U. Gangopadhyay;Han, Chang-Soo;K. Chakrabarty;J. Yi
    • Journal of Korean Vacuum Science & Technology
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    • 제6권3호
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    • pp.120-125
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    • 2002
  • The aim of the present work is to optimized the annealing parameter in both front and back screen printed contacts realization on p-type multicrystalline silicon and with phosphorus diffused. The RTA treatments were carried out at various temperatures from 600 to 850$\^{C}$ and annealing time ranging from 3 min to 5 min in air, O$_2$and N$_2$ ambiance. The contacts parameters are obtained according to Transmission Line Model measurements. A good RTA cycle is obtained with a temperature plateau of 700$\^{C}$-750$\^{C}$ and annealing ambiance of air. Several processing parameters required for good cell efficiency are discussed with an emphasis placed on the critical role of the glass frit in the aluminum paste. A anamolus behaviour of Aluminum n-doping on p-type Si wafer, contact at high temperature have also been studied.

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PC 기반의 무인 소화물 접수장치 설계에 관한 연구 (Development of Small Package Drop-Off System)

  • 남병근;한경호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2001년도 합동 추계학술대회 논문집 정보 및 제어부문
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    • pp.450-452
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    • 2001
  • In this paper, we proposed the automatic postal drop-off system based on the microprocessor board or PC. The weight of the small postal package is transmitted from the electronic scale and user-entered addresses and delivery rate are processed by the controller to calculate the fee. For 24 hour out-door operation and maintenance, non-cash payment methods such as credit card payment is used. The post stamp and receipt are printed by the thermal printer. For the electronic processing of the parcel, serial code is also printed on the stamp and receipts in bar code format. The parcel information obtained by the automatic postal drop-off system is transferred to remote central system by dial-up modem shared by the on site office. The proposed system and its control software are built for prototype model operation and the result met the design requirements. For real time processing, data reception through three serial ports is handled by interrupt routine. The proposed system is expected to be applied for commercial logistics system and pc automation system.

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PCB상의 전력 배분망 설계를 위한 임피던스 계산법 (Estimation Method for Power Distribution Network of Impedance Characteristic on Printed Circuit Board)

  • 조태호;박중호;백종흠;김석윤
    • 대한전기학회논문지:시스템및제어부문D
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    • 제52권4호
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    • pp.246-251
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    • 2003
  • This paper proposes a new methodology for the estimation of impedance characteristics, which is one of the important issue in the power distribution network design of printed circuit boards. The modeling process of the proposed method divides the power distribution network into uniform segment, and each segment is modeled by distributed RLC transmission lines. Then, for the efficient computation of impedance characteristics in frequency domain. the proposed method uses a model-order reduction method.

PCB 조립 공정의 작업 투입 순서 및 부품함 배치 문제에 관한 연구 (A Study on Job Sequence and Feeder Allocation Problem in PCB Assembly Line)

  • 유성열;이강배
    • 산업경영시스템학회지
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    • 제29권1호
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    • pp.63-71
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    • 2006
  • In this paper, we consider a planning problem arising from printed circuit board manufacturing industries. Given a set of several types of PCBs, component feeders and surface mounting machines in series in a PCB assembly line, the problem is to define the feeder allocation and job sequence with the objective of minimizing the total operation time of the line. We formulate the problem as a mathematical model. And, the problem is proven to be NP-hard, so a genetic algorithm is developed. Finally, we give test results to evaluate the performance of the genetic algorithm.

밀집구역분리와 슬롯이중배정에 의한 효율적 PCB 조립 방법의 연구 (A study on the method of efficient PCB assembly by separation of crowed area and double allocation of slot)

  • 문기주;장재혁
    • 한국시뮬레이션학회논문지
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    • 제14권2호
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    • pp.25-34
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    • 2005
  • Determination of component mounting sequence on printed circuit board assembly process is a typical NP-hard problem. It is a kind of traveling salesman problems, but it has one more hard to meet constraint of matching component type per mounting position as well as searching the shortest path. An efficient method is developed by separation of crowed area and allowing up to two slots per component type. A simulation model is constructed using Visual C++ for evaluation of the suggested heuristic.

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Solder paste의 용융 및 bridge현상 관찰연구 (A Study on melting and bridge phenomena of solder paste)

  • 안병용;정재필
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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    • pp.442-446
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    • 1999
  • Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

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제어보드와 파워보드에 관한 발열성능 평가 (Evaluation of Control Board and Power Board Thermal Performance)

  • 장성철;권민수
    • 한국산업융합학회 논문집
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    • 제20권2호
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    • pp.187-194
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    • 2017
  • This study examined the validity and reliability of the thermal safety design, in order to maintain the heat generated from integrated circuit (IC) chips in the converter, condenser, resistor, and transistor (which are considered as heat sources for thermoelectric devices with a printed circuit board) below target levels during the process of developing a control board and a main power board. The study analyzed the heat generation and dissipation characteristics of the entire printed circuit board (PCB) model to examine its thermal safety.

Recent advances in the reconstruction of cranio-maxillofacial defects using computer-aided design/computer-aided manufacturing

  • Oh, Ji-hyeon
    • Maxillofacial Plastic and Reconstructive Surgery
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    • 제40권
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    • pp.2.1-2.7
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    • 2018
  • With the development of computer-aided design/computer-aided manufacturing (CAD/CAM) technology, it has been possible to reconstruct the cranio-maxillofacial defect with more accurate preoperative planning, precise patient-specific implants (PSIs), and shorter operation times. The manufacturing processes include subtractive manufacturing and additive manufacturing and should be selected in consideration of the material type, available technology, post-processing, accuracy, lead time, properties, and surface quality. Materials such as titanium, polyethylene, polyetheretherketone (PEEK), hydroxyapatite (HA), poly-DL-lactic acid (PDLLA), polylactide-co-glycolide acid (PLGA), and calcium phosphate are used. Design methods for the reconstruction of cranio-maxillofacial defects include the use of a pre-operative model printed with pre-operative data, printing a cutting guide or template after virtual surgery, a model after virtual surgery printed with reconstructed data using a mirror image, and manufacturing PSIs by directly obtaining PSI data after reconstruction using a mirror image. By selecting the appropriate design method, manufacturing process, and implant material according to the case, it is possible to obtain a more accurate surgical procedure, reduced operation time, the prevention of various complications that can occur using the traditional method, and predictive results compared to the traditional method.

Ultrasonic Estimation and FE Analysis of Elastic Modulus of Kelvin Foam

  • Kim, Nohyu;Yang, Seungyong
    • 비파괴검사학회지
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    • 제36권1호
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    • pp.9-17
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    • 2016
  • The elastic modulus of a 3D-printed Kelvin foam plate is investigated by measuring the acoustic wave velocity of 1 MHz ultrasound. An isotropic tetrakaidecahedron foam with 3 mm unit cell is designed and printed layer upon layer to fabricate a Kelvin foam plate of 14 mm thickness with a 3D CAD/printer using ABS plastic. The Kelvin foam plate is completely filled with paraffin wax for impedance matching, so that the acoustic wave may propagate through the porous foam plate. The acoustic wave velocity of the foam plate is measured using the time-of-flight (TOF) method and is used to calculate the elastic modulus of the Kelvin foam plate based on acousto-elasticity. Finite element method (FEM) and micromechanics is applied to the Kelvin foam plate to calculate the theoretical elastic modulus using a non-isotropic tetrakaidecahedron model. The predicted elastic modulus of the Kelvin foam plate from FEM and micromechanics model is similar, which is only 3-4% of the bulk material. The experimental value of the elastic modulus from the ultrasonic method is approximately twice as that of the numerical and theoretical methods because of the flexural deformation of the cell edges neglected in the ultrasonic method.

3D 프린터 출력을 위한 토목구조물의 3D 모델링 구성 및 활용방안 (3-Dimensional Modelling of Civil Engineering Structures for 3D Printing and Its Application)

  • 박상미;김현승;한선주;강인석
    • 대한토목학회논문집
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    • 제37권6호
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    • pp.1109-1117
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    • 2017
  • 최근 3D 프린터 기술은 다양한 산업분야에서 주목받는 기술로, 건설 산업에서도 3D 프린터를 활용하고자 하는 연구들이 활발히 진행되고 있다. 실제 교량, 건축물 등 구조물을 3D 프린터로 출력하는 사례가 증가하고 있으며, 3D 프린터를 활용한 목업 구조물 등 다양한 활용 방안이 제시되고 있다. 3D 프린터 기술을 건설 분야에 활용하기 위해서는 3D 모델이 필요하며, 설계단계에서 제작된 3D BIM데이터를 3D 프린터로 출력 시 3D 모델 제작비용과 시간을 절약할 수 있다. 하지만 설계단계의 3D BIM데이터는 3D 프린터 출력을 위한 조건을 만족하지 않는 경우가 많아 출력 시 많은 오류를 발생시킨다. 이에 본 연구에서는 BIM데이터의 3D 모델을 3D 프린터로 출력 시 발생하는 문제점 분석과 오류를 줄일 수 있는 방안을 제시하고자 하며, 더불어 3D 프린터로 출력된 BIM모델의 실무적 활용방안을 제시한다.