• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1069-1070
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• 2013

• Journal of Institute of Control, Robotics and Systems
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• v.6 no.6
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• pp.506-513
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• 2000

This paper proposes a path planning algorithm for dispensers to increase the productivity in printed circuit board assembly lines. We analyze the assembly sequence of the dispenser, and formulate it as an integer programming problem. The mathematical formulation can accomodate multiple heads and different types of heads through extended cost matrix. The TSP algorithms are then applied to the formulated problem to find the near-optimal solution. Simulation results are presented to verify the usefulness of the proposed scheme.

• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.9-12
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• 2000

This paper describes the modeling and experimental results of coreless printed circuit board (PCB) based transformer that can be used for power conversion at high frequency operation. The principle of using coreless PCB based transformer in 2MHz, 10W class ZVS Flyback DC-DC converter has been successfully demonstrated. The maximum power conversion efficiency is 79%. Even for high operating frequency, an efficiency greater than 70% can be obtained with under 1% regulation error.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.304-304
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• 2000

품질이 우수한 에어콘 제어기 콘트롤라를 생산하기 위해서는 기본적인 설계에서 한층 진보된 설계기법과 광도에 맞는 PCB(Printed Circuit Board)를 선택하여야만 생산성 향상과 안정성을 확보할 수 있다. 이는 설계의 다양한 기법과 전문성을 요구함으로써 해결될 수 있다. 정보화 사회의 구현에 맞추어 전기 및 전자산업의 빠른 속도로 변화함으로써 개발자도 여러 가지 기법과 낑산성, 신뢰성을 고려하여 설계할 수가 있어야 하겠다.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.20-24
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• 2010

High speed cutting processes of rigid flexible printed circuit board by making use of high power UV laser with nano-second pulse width have been proposed and investigated experimentally. Also robust laser cutting system has been designed and developed in order to obtain a good cutting quality of rigid and flexible PCB with multi-layers (2-6 layers). Power controller module developed for ourselves is adapted to control the laser output power in the range less than 1%. The systems show the good performance of cutting speed, cutting width and cutting accuracy, respectively. Especially we have confirmed that the short circuit problem due to the carbonized contamination occurred in cross section of multi-layers by thermal effect of high power laser has been improved largely by using multi-pass cutting process with low power and high speed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.545-545
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• 2007

Recently, innovative process has been investigated in order to replace the conventional high-cost micro patterning processes on the electronic products. To produce desirable profit margins from this low cost products, printed circuit board(PCB), will require dramatic changes in the current manufacturing philosophies and processes. Innovative process using metal nano particles replaces the current industry standard of subtractive etched of copper as a highly efficient way to produce robust circuitry on low cost substrates. An advantage of using metal nano particles process in patterned conductive line manufacturing is that the process is additive. Material is only deposited in desired locations, thereby reducing the amount of chemical and material waste. Simply, it just draws on the substrate as glass epoxy or polyimide with metal nano particles. Particles, when their size becomes nano-meter scale, show some specific characteristics such as enhanced reactivity of surface atoms, decrease in melting point, high electric conductivity compared with the bulk. Melting temperature of metal gets low, the metal nano particles could be formated onto polymer substrates and sintered under $300^{\circ}C$, which would be applied in PCB. It can be getting the metal line of excellent electric conductivity.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.17-22
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• 2013

We investigated the optimum bonding conditions for thermo-compression bonding of electrodes between flexible printed circuit board(FPCB) and rigid printed circuit board(RPCB) with Sn-58Bi solder as interlayer. In order to figure out the optimum bonding conditions, peel test of FPCB/RPCB joint was conducted. The peel strength was affected by the bonding conditions, such as temperature and time. The fracture energies were calculated through F-x (Force-displacement) curve during peel test and the relationships between bonding conditions and fracture behaviors were investigated. The optimum condition for the thermo-compression bonding with Sn-58Bi solder was found to be temperature of $195^{\circ}C$ and time of 7 s.

• Journal of the Korean Ceramic Society
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• v.40 no.8
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• pp.735-738
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• 2003

The PTFE composites for the microwave printed circuit board were prepared using woven glass fiber. The dielectric constant of the PTFE composites with oven glass fiber tended to decrease with an increase of immersion time, and was saturated at 3 times immersion. It resulted from the fact that fine powders of PTFE filled up at the pore and bend of woven glass fiber sufficiently. As the immersion time increased, the propagation velocity increased due to the reduction of dielectric constant.

• Journal of Electrical Engineering and Technology
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• v.8 no.3
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• pp.603-609
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• 2013

In this paper, we describe the analysis of inkjet-printed silver (Ag) patterns on epoxy-coated substrates according to several reliability evaluation test method guidelines for conventional printed circuit boards (PCB). To prepare patterns for the reliability analysis, various regular test patterns were created by Ag inkjet printing on flame retardant 4 (FR4) and polyimide (PI) substrates coated with epoxy for each test method. We coated the substrates with an epoxy primer layer to control the surface energy during printing of the patterns. The contact angle of the ink to the coated epoxy primer was $69^{\circ}$, and its surface energy was 18.6 $mJ/m^2$. Also, the substrate temperature was set at $70^{\circ}C$. We were able to obtain continuous line patterns by inkjet printing with a droplet spacing of $60{\mu}m$. The reliability evaluation tests included the dielectric withstanding voltage, adhesive strength, thermal shock, pressure cooker, bending, uniformity of line-width and spacing, and high-frequency transmission loss tests.

• Proceedings of the KIPE Conference
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• 2001.10a
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• pp.11-16
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• 2001

Recent publications showed that a pair of neighboring printed circuit board (PCB) windings can be used as a contactless energy transfer device. As a continued study on this area, the current paper presents the modeling, analysis, and application of the neighboring PCB windings with an emphasis on their circuit properties and device characteristics as a contactless energy transfer device. Theoretical results of the paper are confirmed with experiments on a prototype contactless energy transfer circuit that delivers 24W output power at $68\%$ efficiency through two 35mm-diameter PCB windings separated each other by 2.4mm.