• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.6
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• pp.1103-1108
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• 2003

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz local wireless communication system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed. By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.4 % frequency bandwidth for VSWR under 1.5 and 3dB gain.

• Journal of the Korean Society for Industrial and Applied Mathematics
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• v.10 no.1
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• pp.31-45
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• 2006

Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.3
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• pp.7-12
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• 2002

In the measurement of the RF properties, the LTCC substrate must be considered as a system including various conductor patterning processes. In this paper, the LTCC substrate system is compared with a conventional PCB(Printed Circuit Board) substrate such as FR-4, Duroid and Teflon, etc. The microstrip resonator method is employed for the measurement of the RF properties in the range of DC to 20 GHz. Experimental results show that the ring resonator method is suitable for system loss measurement, and the series gap resonator method for dielectric constant measurement. The process of conductor patterning and its effect on the system loss were also studied.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.

• Nuclear Engineering and Technology
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• v.50 no.7
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• pp.1068-1078
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• 2018

Experiments were performed to investigate bubble behaviors and pool boiling Critical Heat Flux (CHF) on a thin flat rectangular copper heater fabricated on Printed Circuit Board (PCB), at various inclination angles. The surface inclination angles were $0^{\circ}$, $45^{\circ}$, $90^{\circ}$, $135^{\circ}$, and $180^{\circ}$. Results showed the Onset of Nucleate Boiling (ONB) heat flux increased with increasing heater orientation from $0^{\circ}$ to $90^{\circ}$, while early ONB occurred when the heater faced downwards ($135^{\circ}$ and $180^{\circ}$). The nucleate boiling was observed to be unstable at low heat flux (1-21% of CHF) and changed into typical boiling when the heat flux was above 21% of CHF. The result shows the CHF decreased with increasing heater orientation from $0^{\circ}$ to $180^{\circ}$. In addition, the bubble departure diameter at the heater facing upwards ($0^{\circ}$, $45^{\circ}$, and $90^{\circ}$) was more prominent compared to that of the heater facing downward ($135^{\circ}$). The nucleation site density also observed increased with increasing heat flux. Moreover, the departed bubbles with larger size were observed to require a longer time to re-heat and activate new nucleation sites. These results proved that the ONB, CHF, and bubble dynamics were strongly dependent on the heater surface orientation.

• Journal of the Korean Electrochemical Society
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• v.2 no.3
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• pp.138-143
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• 1999

Recently, miniaturization of large scale integrated circuits (LSI) and printed circuit board (PCB) have become essential with the downsizing of electronic devices. Gold electroplating is applied of conductivity wiring or terminals for improvement of conductivity and corrosion resistance. However, electroplating is not applicable since the circuits are becoming finer and denser. Accordingly, electroless plating is recently highly attractive method because of the simplicity of the operation requiring no external source of current and no elaborate equipment. In this work, we tried to develop a plating technique on electroless Ni/Au plating. First, the electroless Ni plating was deposited on the PCB with agitation in the bath at $85^{\circ}C$. Then the Au layer was deposited on the Ni layer surface by same method at $90^{\circ}C$. The bonderability were tested in order to evaluate the stability of the electroless Ni/Au by gold wire or solder ball test.

• Resources Recycling
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• v.26 no.4
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• pp.95-100
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• 2017

In this study, $Fe_2O_3$ was added as a flux to decrease melting temperature and refine during melting of Cu powder from scraped surface of the waste PCB (printed circuit board). The effect of $Fe_2O_3$ ratio to Cu powder and temperature on the recovery of Cu and content of impurities were investigated. It was found that the recovery of Cu was increased with increasing addition ratio of $Fe_2O_3$ and reaction temperature. The contents of O, Si and Fe in Cu phase were also decreased with increasing addition ratio of $Fe_2O_3$ and temperature. The formation of fayalite ($2FeO{\cdot}SiO_2$) and iron oxides phases in the slag was confirmed by XRD analysis after reaction with $Fe_2O_3$. Therefore, it was considered that the decrease of melting temperature and viscosity of slag by formation of fayalite slag contributed remarkably to the Cu recovery.

• Journal of Industrial Technology
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• v.21 no.B
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• pp.67-74
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• 2001

According as the patterns of PCB (Printed Circuit Board) become denser and complicated, quality and accuracy of PCB influence the performance of final product. It's attempted to obtain trust of 100% about all of parts. Because human inspection in mass-production manufacturing facilities are both time-consuming and very expensive, the automation of visual inspection has been attempted for many years. Thus, automatic visual inspection of PCB is required. In this paper, we used an algorithm which compares the reference PCB patterns and the input PCB patterns are separated an object and a scene by filtering and edge detection. And than compare two image using pattern matching algorithm. We suggest an defect inspection algorithm in PCB pattern, to be satisfied low cost, high speed, high performance and flexibility on the basis of $640{\times}480$ binary pattern.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.6 no.5
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• pp.412-417
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• 2005

The objective of study is design and structural analysis of multi-axis drill machine for PCB. This is able to reduce the unit cost of manufacture and to ensure safety, that is with the result of analysis by design the multi-axis drill machine for the use of PCB to enhancing suitability and exactitude in mass production the process of PCB.

• Journal of Welding and Joining
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• v.18 no.2
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• pp.222-222
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• 2000

PBGA(Plastic Ball Grid Array) is composed of some materials such as PCB(Printed Circuit Board), epoxy molding compound, die attach and so on. Reliability of PBGA package is weak compared with plastic packages. The weak points of reliability are the lower resistance to popcorn cracking, which is induced by moisture absorption in PCB, and the pressure cooker test corrosion, which is the basic problem due to the material characteristics of PCB. Introducing the PCB baking and the plasma treatment cleared the popcorn cracking phenomenon. The PCB baking and plasma treatment reduced the epoxy void by eliminating the source of moisture vaporization during the epoxy curing and enhanced the adhesion between PCB and epoxy. Also, plasma treatment enhanced the wettability of epoxy on PCB. The problem of corrosion is cleared using multi-functional epoxy. This type of EMC(Epoxy Molding Compound) is recommended in package using PCB as a substrate. (Received November 19, 1999)