• Asian-Australasian Journal of Animal Sciences
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• 제21권8호
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• pp.1196-1200
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• 2008

An experiment was conducted to evaluate the physiological changes of laying hens subjected to feed removal during induced molting while received probiotics in the drinking water. Post-molt performance and egg quality criteria were also studied. Ninety 78-week-old Hy-line W36 laying hens were divided into two treatment groups according to equal body weight and subjected to induced molting by continuous feed removal until around 30% BW reduction. The experiment lasted 12 wks consisting of 4-wk molting and 8-wk post-molt periods. Treatment 1 received no probiotics and was considered as the control. Treatment 2 was similar to the control except that hens received probiotics in the drinking water at 400 mg/L during feed deprivation. The results indicated that hens in both groups went out of production by Day 5. However, hens received probiotics reached 5 and 50% egg production sooner than the control (30 and 52 days vs. 31 and 54 days). Starvation during molting increased heterophil to lymphocyte (H/L) ratio, hematocrit and plasma T4 and $Na^+$ levels while plasma T3 and Cl- levels were decreased. Probiotics had no significant impact on BW reduction during molt. Post-molt egg production and egg mass were higher in hens which previously received probiotics, but these responses were not significant. However, feed conversion ratio was significantly better in hens which received probiotics. Hematocrit, plasma thyroid hormone concentrations (T3 and T4) and plasma $Na^+$, $K^+$ and Cl- levels during molting were not significantly influenced by supplementation of probiotics. However, H/L ratio showed a significant (p<0.05) reduction in birds which received probiotics suggesting beneficial effects of this product for feed-deprived laying hens. No significant difference was observed in post-molt egg quality criteria.

• Journal of Dental Anesthesia and Pain Medicine
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• 제17권1호
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• pp.47-53
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• 2017

Background: Every patient who undergoes mandibular third molar surgery is concerned about post-operative pain. Indeed, previous researchers have used various methods to treat such pain. This study aimed to assess the effectiveness of sublingual injection of dexamethasone (8 mg) to treat post-operative pain after mandibular third molar surgery. Method: This was a randomized, double-blind, split-mouth, clinical trial, involving 48 healthy patients who required surgical removal of two mandibular third molars with similar bilateral positions. All operations were performed by the same experienced surgeon. The patients were randomized into a study group (8 mg dexamethasone injection) and a placebo group (normal saline injection). Both interventions were injected into the sublingual space immediately after local anesthesia, 30 min before the first incision. The study group received an 8 mg dexamethasone injection, while the placebo group received a normal saline injection. The wash period between the patients' two operations was 3 to 4 weeks. Pain was assessed by recording the number of analgesic tablets (rescue drug) consumed, as well as by noting the patients' responses to the visual analog scale (VAS) on the first, second, and third days after surgery. Results: The study group differed significantly from the placebo group in terms of VAS score and analgesic consumption. Conclusion: Dexamethasone (8 mg), injected sublingually, significantly eased post-operative pain after surgical removal of the mandibular third molar.

• Restorative Dentistry and Endodontics
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• 제8권1호
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• pp.45-51
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• 1982

An endodontically treated tooth is likely to be brittle than a vital tooth. Internal structure of the tooth has been weakened due to a significant removal of dentin by coronal access, canal preparation. There are many controversies concerning with various methods of reinforcing an intact anterior tooth that has endodontic treatment. In this experiment, 128 extracted maxillary anterior teeth were endodontically treated, and prepared with 4 methods of restorations; Composite resin filling with zinc phosphate cement, composite resin filling without zinc phosphate cement, composite resin filling with post, and metal crown with post. An Instron testing machine was used to measure the fracture loads of the specimens. The means of the failure loads for the 4 groups were compared by F-test statistically and the failure modes were observed. The results were as follows; 1. There were no statistically significant difference between the failure loads of the four methods of restoration. 2. Teeth without post were fractured in a horizontal or oblique plane through upper or middle third of the root. 3. In the posted teeth, fractures were occurred around the post. 4. In the metal crowned teeth with post, the fracture were occurred around the post or coronal area.

• Tribology and Lubricants
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• 제31권6호
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2004년도 하계학술대회 논문집 C
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• pp.1600-1604
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• 한국환경과학회지
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• 제7권1호
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• pp.74-80
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• 1998

Because permeate flux was very low as It has the suspension soled of higher concentration In the trafiltration membrane separation treatment of dyestuff wastewater, pre-treatment of Ponton reaction was carried out. In the case of pH 3, COD removal rate was the hi각erst of 58%. When PAC was added into the pre-treatment supernatant, the COD removal rate was found to be 53% , and when COD was 153mg/L, the removal rate was 92.3% in the trafiltration separation. In addition, the effect of the addition of PAC on the permeate flux was also investigated. The decrease of permeate flux In the presence of PAC was higher than In the abscence of PAC, but the recovery of permeability by cleaning was better In the case of PAC system.

• Journal of Korean Neurosurgical Society
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• 제39권5호
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• pp.385-388
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• 2006

An Intramedullary subependymoma of the spinal cord is a rare tumor with only 43 reported cases in the literature. Most of them are reported to be localized within the cervical spinal cord. We report a rare case of a thoracic spine intramedullary subependymoma in a 37-year-old female who presented with back pain and radiating leg pain. Subtotal resection and post-operative radiotherapy were performed. Subependymomas developing in the spinal cord are benign with a low proliferative potential. Complete resection of the tumor appears to be the optimal method for a complete cure. However aggressive surgery may cause severe neurological deficit. Therefore, if severe neurological deficits are expected after complete removal, a partial removal and postoperative radiation therapy is an alternative method for treatment in selected cases. A large-scale randomized study is mandatory to clarify the effectiveness of radiotherapy and to establish the recurrence rate and prognosis with respect to the surgical removal of these tumors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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• pp.93-96
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis of used slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.184-187
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) lyaer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2-CMP$ process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and nonuniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between partical size and CMP with partical size analysis or used slurry.