• Journal of the Korean Electrochemical Society
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• v.3 no.3
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• pp.152-156
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• 2000

The effect of cupric ion concentration on the throwing power has been studied in the electrodeposition of Cu on the porous reticular electrodes with the electrolytes of $CuSO_4\;and\;H_2SO_4$. Sulfuric acid electrolytes with lower concentration of $CuSO_4$ improved throwing power in electrodeposition of copper not only due to higher cathodic polarizability but also due to higher conductivity of the electrolytes. The increase in conductivity of the electrolytes at low concentration of $CuSO_4$ could be also illustrated by the decrease in viscosity of the electrolytes. It was found that both the throwing power and the limiting current density should be taken into account in the electrodeposition of Cu on the reticular electrodes. According to the experimental results, the electrolyte of 0.2M $CuSO_4$ and 0.5M $H_2SO_4$ was found to be the most appropriate condition at the current density of $10mA/cm^2$.

• Journal of the Korean Electrochemical Society
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• v.4 no.2
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• pp.41-46
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• 2001

The effect of organic additives such as PEG ind MPS on throwing power have been studied in the fabrication of porous reticular metal by electrodeposition using the mixture of cupric sulfate and sulfuric acid as electrolyte. Both the polarization test and the electrodeposition on the stacked electrodes, mean pore diameter of which was $250{\mu}m$, were performed to illustrate the behavior of throwing power quantitatively. As far as PEG was concerned, it lowered throwing power of electrodeposition on the porous electrode used in this work while the addition of MPS up to 500 ppm in electrolyte enhanced throwing power monotonously. When both MPS and PEG were added in electrolyte, the effect of MPS on throwing power was superior to that of PEG. However, the excess addition of MPS was found to cause the defect in mechanical strength of deposit layer. From the result of SEM observation, it could be concluded that less than 50 ppm of MPS in electrolyte was appropriate to avoid the breakage of deposit layer.