• Journal of the Korean Society for Precision Engineering
• /
• v.23 no.10
• /
• pp.103-112
• /
• 2006

This paper describes a theoretical analysis and experimental verification on the performances of a vacuum-compatible air bearing, which is designed with a cascaded exhaust scheme to minimize the air leakage in a vacuum environment. The design of the vacuum-compatible air bearing equipped with the differential exhaust system requires great care because several design parameters, such as the number of exhaust stages, diameter of exhaust tube, pumping speed of a vacuum pump, and bearing clearance greatly influence the air leakage and thus degree of vacuum. In this study, a performance analysis method was proposed to estimate the performances of the air bearing, such as load capacity, stiffness, and air leakage. Results indicate that the load capacity and stiffness of the air bearing was improved as its boundary pressure, which was determined by the $1^{st}$ exhaust method, was lowered, and the dominant factors on the chamber's degree of vacuum were the number of exhaust stages, exhaust tube diameter and bearing clearance. A vacuum chamber and air bearing stage using porous pad were fabricated to verify the theoretical analysis. The results demonstrate that chamber pressure up to an order of $10^{-3}$ Pa was achieved with the air bearing stage operating inside the chamber, and this analysis method was valid by comparing predicted values with experimental data, for the mass flow rates from the porous pad, and pressures at each exhaust port and chamber, respectively.

• Journal of the Semiconductor & Display Technology
• /
• v.8 no.2
• /
• pp.31-35
• /
• 2009

In the silicon wafer polishing process, the mounting stage of silicon wafer on the ceramic carrier block has been using the polishing template which utilizes the porous surface instead of traditional wax mounting method. Here in this article, the experimental study is carried out in order to study the wafer demounting by water jet and the effects of operating conditions such as the water jet flowrate and the number of water jet nozzles on the wafer demounting time. It is found that the measured wafer demounting time is inversely proportional to the water flowrate per nozzle, regardless of number of nozzles used; implying that the stagnation pressure by the water jet impingement is the dominant key factor. Additionally, by using the transparent disk instead of wafer, the air bubble formation and growth is observed under the disk, making the passage of water flow, and subsequently demounting the wafer from the porous pad.

• Journal of Powder Materials
• /
• v.18 no.2
• /
• pp.112-121
• /
• 2011

This study investigated the effect of solvent on the fabrication of Ni-free Fe-based alloy nano powders by employing the PWE (pulsed wire evaporation) in liquid and compared the alloy particles fabricated by three different methods (PWE in liquid, PWE in Ar, plasma arc discharge), for high temperature oxidation-resistant metallic porous body for high temperature soot filter system. Three different solvents (ethanol, acetone, distilled water) of liquid were adapted in PWE in liquid process, while X-ray diffraction (XRD), field emission scanning microscope (FE-SEM), and transmission electron microscope (TEM) were used to investigate the characteristics of the Fe-Cr-Al nano powders. The alloy powder synthesized by PWE in ethanol has good particle size and no surface oxidation compared to that of distilled water. Since the Fe-based alloy powders, which were fabricated by PWE in Ar and PAD process, showed surface oxidation by TEM analysis, the PWE in ethanol is the best way to fabricate Fe-based alloy nano powder.

• Analytical Science and Technology
• /
• v.25 no.3
• /
• pp.164-170
• /
• 2012

Cyanoacrylate fuming mehod is effective for latent fingerprints developing on non-porous surfaces. In this study, we investigated optimal conditions for latent fingerprint development using cyanoacrylate fuming method in vacuum chamber. The effects of temperature, relative humidity, fuming method and processing time were checked throughly. The amount of evaporated cyanoacrylate was increased at higher temperature, but cyanoacrylate polymerization on the fingerprint ridge was best at $30^{\circ}C$. With a relative humidity of 40% to 50% conditions, good quality of fingerprints were developed. If a relative humidity is lower than 30% or higher than 60%, polymerization rate of cyanoacrylate monomers on the fingerprint ridge was decreased. It was identified that application of $OMEGA-PRINT^{TM}$ dispersal pad or cotton ball with sodium hydroxide fuming method in vacuum chamber was more effective than natural fuming method. We found that cyanoacrylate processing time in vacuum chamber did not have more significant than relative humidity.

• Archives of Craniofacial Surgery
• /
• v.17 no.4
• /
• pp.218-221
• /
• 2016

Temporal hollowing is a common complication that occurs after coronal approach surgeries. However, temporal hollowing without previous nerve damage or trauma history is rare. Herein, we present a patient with cryptogenic temporal hollowing. A 22-year-old man without any history of craniofacial interventions or trauma presented with temporal hallowing. Magnetic resonance imaging revealed fatty degeneration of the left temporalis muscle. Electromyography and nerve conduction study showed no signs of neurologic abnormalities. The patient received autologous fat injection of 30 mL harvested from the left thigh using the modified Coleman technique. Temporal hollowing is commonly caused by atrophy of the superficial temporal fat pad. Its incidence is reported to be as high as 6% after coronal approach operation. Augmentation using porous hydroxyapatite or titanium mesh is a treatment option. Autologous fat graft can also be an option for mild to moderate temporal hollowing. In this case, a patient with no history of trauma, surgery, or myogenic disease developed temporal hollowing. Further study of the little-known cryptogenic form of temporal hollowing is warranted.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2007.06a
• /
• pp.78-78
• /
• 2007

In semiconductor devices, Cu has been used for the formation of multilevel metal interconnects by the damascene technique. Also lower dielectric constant materials is needed for the below 65 nm technology node. However, the low-k materials has porous structure and they can be easily damaged by high down pressure during conventional CMP. Also, Cu surface are vulnerable to have surface scratches by abrasive particles in CMP slurry. In order to overcome these technical difficulties in CMP, electro-chemical mechanical planarization (ECMP) has been introduced. ECMP uses abrasive free electrolyte, soft pad and low down-force. Especially, electrolyte is an important process factor in ECMP. The purpose of this study was to characterize KOH and $KNO_3$ based electrolytes on electro-chemical mechanical. planarization. Also, the effect of additives such as an organic acid and oxidizer on ECMP behavior was investigated. The removal rate and static etch rate were measured to evaluate the effect of electro chemical reaction.

• Journal of Sensor Science and Technology
• /
• v.5 no.5
• /
• pp.21-29
• /
• 1996

A piezoresistive silicon acceleration sensor with 8 beams, utilized by an unique silicon micromachining technique using porous silicon etching method which was fabricated on the selectively diffused (111)-oriented $n/n^{+}/n$ silicon subtrates. The width, length, and thickness of the beam was $100\;{\mu}m$, $500\;{\mu}m$, and $7\;{\mu}m$, respectively, and the diameter of the mass paddle (the region suspended by the eight beams) was 1.4 mm. The seismic mass on the mass paddle was formed about 2 mg so as to measure accelerations of the range of 50g for automotive applications. For the formation of the mass, the solder mass was loaded on the mass paddle by dispensing Pb/Sn/Ag solder paste. After the solder paste is deposited, Heat treatment was carried out on the 3-zone reflow equipment. The decay time of the output signal to impulse excitation of the fabricated sensor was observed for approximately 30 ms. The sensitivity measured through summing circuit was 2.9 mV/g and the nonlinearity of the sensor was less than 2% of the full scale output. The output deviation of each bridge was ${\pm}4%$. The cross-axis sensitivity was within 4% and the resonant frequency was found to be 2.15 KHz from the FEM simulation results.