• Korean Journal of Agricultural Science
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• v.36 no.2
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• pp.211-217
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• 2009

Total fatty acid compositions, total content of crude fat, saturated, unsaturated and trans fatty acid content were studied in children's favorite foods such as hot dog, chicken popcorn, fried potato, snack and cookies, and imported biscuit. The samples were obtained from various stores in Daejeon. After fat extraction, methylation was carried out to analyze the fatty acid compositions by gas chromatography. The results showed that content of the trans fatty acid per 100 g of the hot dog, chicken popcorn, fried potato, snack and cookies, and imported biscuit were 0.02~0.03 g, 0.05~0.08 g, 0.02~0.05 g, 0.02~0.27 g, and 0.05~0.83 g, respectively. The highest content of saturated fatty acid (66.24%) was observed in the imported biscuit among the 20 analyzed samples.

• The Korean Journal of Food And Nutrition
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• v.25 no.2
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• pp.398-406
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• 2012

The acid value of the oil extracted from the three kinds of 15 fried foods ranged from 0.89 to 3.92, the peroxide value ranged 10.0~57.14 meg/kg. Among the samples, popcorn chicken contained the highest crude fat content, showing $6.64{\pm}0.26(%)$, while the french-fries showed $2.87{\pm}0.31(%)$, which was the lowest. The content of the trans fatty acid per 100 g of the foods were; the fried foods: 0.02~0.06 g. The french-fries contained the lowest saturated fatty acid per 100 g of the foods, showing 0.41~1.55 g, while the popcorn chicken showed the highest content, 1.16~3.43 g. The fried foods contained the highest linoleic acid content. Further, fried foods exhibited safe levels of trans fat content. The "School Zone", which sells snacks, candies, chocolates flow, was not detected in the saccharin. Cookies, candies, chocolate was not detected in the tar colors. Aerobic plate count were ranged from 0~4,700 cfu/g in cookies, Salmonella test came out negative.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.4
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• pp.517-526
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• 2013

This thesis revolves around dual sensory therapy techniques using perception arts group counseling program focused on Popcorn Brain phenomenon. The program emphasizes intrinsic motivations for changes by activating the brain's dual sensory such as a sense of smell, tactile sensation and vision to deal with brain issues caused by digital devices addiction. Perception arts group counseling program is based on voluntary satisfaction of relationship desires, which can lead to a sense of accomplishment and belonging. Expression methods using dual sensory were presented as an alternative to resolving digital devices addiction by blending cognitive-behavioral counseling technique and group art therapy technique. The blending method offers an environment that can maintain a change to a senseless and lackluster brian due to excessive uses of digital devices, the main cause of Popcorn Brain, by emphasizing "thoughts${\rightarrow}$emotions${\rightarrow}$behavior" with a structural expression approach. If perception arts group counseling program is established in more systematic fashion and used strategically to offer such environment, it may be used as a treatment for brain issues described above. In addition, the program can be used a basis for encouraging voluntary treatment to satisfy relationship desires.

• Research in Plant Disease
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• v.13 no.3
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• pp.131-136
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• 2007

Occurrence of popcorn disease on mulberry fruits was surveyed in several locations in Korea from 2005 to 2007. The diseased fruits turned grayish white and changed to hard and black sclerotia during overwintering after falling onto the ground. Apothecia produced from overwintered sclerotia in the fields of mulberry trees were observed in early May. Two types of apothecia were produced from the sclerotia, which were cup-shaped or club-shaped. The fungus with cup-shaped apothecia was identified as Ciboria shiraiana, and that with club-shaped apothecia as Scleromitrula shiraiana. C. shiraiana occurred at the ratio of about 6 vs. 4 in the fields. Occurrence of the disease differed remarkably depending on years, locations, and varieties of mulberry trees investigated. Field survey of the disease incidence showed that Baekhahyeongsang, Dahojosaeng, Hasusang, a native variety and Sawonppong 22 were resistant to the disease, Cheongilppong, Daeseongppong, Guksang 20 and Turkey-D were moderately susceptible, and Cateneo, Moreji and Sanggwa were highly susceptible. Disease incidence in the fields mulched with nonwoven fabrics or plastic films was much lower than that in the non-mulched fields. Disease incidence in the fields mulched with rice straws was similar to that in the non-mulched fields.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.992-999
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• 1999

Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.37-48
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• 1998

The popcorn cracking phenomena in plastic IC packages during reflow soldering are investigated by considering the heat transfer and moisture diffusion through the epoxy molding compound(EMC) along with the mechanics of interface delamination. Heat transfer and moisture diffusion through EMC under die pad are analyzed by finite difference method (FDM)during the pre-conditioning and subsequent reflow soldiering pro-cess and the amounts of moisture mass and vapor pressure at delaminated die pad/ EMC interface are calculated as a function of the reflow soldering time. The energy release rate stress intensity factor and phase angle were obtained under various loading conditions which are thermal crack face vapor pressure and mixed loadings. It was shown that thermal loading was the main driving force for the crack propagation for small crack lengths but vapor pressure loading played more significant role as crack grew.

• Journal of Welding and Joining
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• v.18 no.4
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• pp.64-69
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• 2000

Reliability of PBGA(Plastic Ball Grid Array) package is very weak compared with normal plastic packages. The reliability are the lower resistance to popcorn cracking, which is reduced by moisture absorption in PCB(Printed Circuit Board). This paper adapts plasma treatment process and analyzes their effect. The contents of C and Cl decrease after plasma treatment but O, Ca and N relatively increase. The Plasma treatment to improve the adhesion between EMC(Epoxy Molding Compound) and PCB(solder mask). The degree of improvement was over 100% Max., which is depend on the properties of EMC. Ar+H$_2$as plasma gas show good result. There is a little difference in RF power and treatment time.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.10
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• pp.805-811
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• 2000

Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

• Journal of the Korean institute of surface engineering
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• v.33 no.4
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• pp.241-250
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• 2000

Popcorn cracking phenomena frequently occur in thin plastic packages during the solder reflow process, which are definitely affected by poor adhesion of Cu-based leadframe to epoxy molding compounds (EMCs). In the present work, in order to enhance the adhesion strength, a brown-oxide treatment on the Cu-based leadframe was carried out and the adhesion strength of leadframe/EMC interface was measured in terms of fracture toughness by using sandwiched double-cantilever beam (SDCB) specimens. After the adhesion tests, fracture surfaces were analyzed by SEM, AES, EDS and AFM to make the failure path clear. Results showed that failure path was closely related to the oxidation time and the interfacial fracture toughness.

• International Journal of Industrial Entomology and Biomaterials
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• v.37 no.2
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• pp.55-62
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• 2018

We bred a mulberry cultivar named 'Saealchan' through local adaptability test, which is under registration as a new cultivar for fruit production. Local adaptability test had been carried out at four local places (Jeonju, Gongju, Jangseong, and Sangju) for five years from 2013. This variety 'Saealchan' belongs to Morus alba L. selected from seedlings collected from mother mulberry 'Shimheung'. Saealchan was resistant to popcorn disease and high yielding variety in fruit productivity by 194% compared to control cultivar 'Shimheung (Morus alba L.)' for three years. Although fruits of 'Saealchan' was smaller in size and lower in sugar content of mulberry fruits compared to control variety 'Shimheung', it showed strong resistance to sclerotial disease compared to 'Shimheung'.