• Journal of the Korean Ceramic Society
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• v.36 no.3
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• pp.266-273
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• 1999

본 연구에서는 겔캐스팅법의 제조공정 확립을 위하여 분산제의 분자구조가 질화규소 슬립의 점성특성 및 성형체의 상대밀도와 기계적 특성에 미치는 영향을 조사하였다. 슬립과 겔캐스팅 성형체의 제조방법은 기보고된 방법과 동일하게 하였다. 그 결과, 겔캐스팅 슬립의 점성은 분산제의 분자구조와 모노머와 분산제의 구성비율에 크게 의존하였다. PMAA 분산제를 사용한 슬립의 점성은 PAA 및 PAAm 분산제 보다 높은 점도를 나타내었다. 성형체의 상대밀도는 슬립의 농도에 크게 의존하였으며, 분산제양과 모노머의 양변화에는 그다지 변화가 없었다. 그리고, 겔캐스팅 성형체의 기계적 특성은 크게 모노머의 농도에 의존하였으며, 분산제양과 슬립의 농도에는 큰 변화가 없었다.

• Polymer(Korea)
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• v.33 no.5
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• pp.397-406
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• 2009

We have fabricated source-drain electrodes for OTFTs using a screen-printing technique with carbon-black pastes as conductive paste. And effects of dispersants contents (SOP 10-40%) on the dispersity of carbon-black pastes and characteristics of screen-printed source-drain electrodes for OTFTs using two types of dispersants (DB-2150, DB-9077) were investigated. As contents of both dispersants were increased the dispersity of carbon-black mill-bases was improved, whereas the carbon-black pastes exhibited different dispersion characteristics. For the case of DB-2150, the dispersity of the pastes was improved with increasing dispersant content and the storage modulus G' in their rheology characteristics were reduced. But, for the DB-9077, the storage modulus G' of pastes were increased with dispersant content due to the flocculated network structure formed by interactions among carbon-black powders and dispersants. But, since this flocculated network structure of the pastes using DB-9077 resulted in the conduction path of carbon-black structures, the conductivities of screen-printed electrodes and mobilities of the OTFTs with them were better than those using pastes with DB-2150.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.4
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• pp.297-302
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• 2009

We have successfully fabricated the alumina thick films using inkjet printing processes without a high temperature sintering process. Alumina suspension as dielectric ink was formulated by combining nano-sized alumina powders with an anionic polymer dispersant in formamide/water as co-solvent. The thickness of the printed alumina thick film was measured at around 5 um by field emission scanning electron microscope. The calculated packing density of 68.5 % from the printed alumina thick film was much higher than the same films fabricated by conventional casting or dip coating processes. Q factor of the dielectrics thick film infiltrated with cyanate ester resin was evaluated by impedance analyzer.