• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.3
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• pp.11-16
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• 2006

A new method to fabricate metal electrodes on side wall of the microchannel is presented. Electrical signal can be measured by the metal electrodes on channel side wall when microparticles pass through a polymer microchannel. 3 dimensional metal electrodes on channel side wall could be fabricated by local deposition of metal through a shadowmask and inclined evaporation. The polymer microchannel with side wall electrodes could be precisely aligned onto metal contact patterns on pyrex glass. The impedance measurement test showed possibility of electrical signal measurement using the fabricated device.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.67 no.10
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• pp.1317-1321
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• 2018

PVDF as a semicrystal polymer, having a structure with C-F dipole moments, has been widely investigated because of its excellent chemical stability, mechanical strength, and ferroelectricity. In this study, ferroelectic ${\beta}$ type - PVDF layer was prepared by using an electrostatic spray deposition method and the effects of the addition of Ni-nitrate in precursor solution on the properties of PVDF layer were evaluated. Crystallinity and chemical structure of the PVDF layer were analyzed by a X-ray diffraction and Fourier Transform Infrared Spectrophotometer. Surface structure and fractured cross section of the layer were examined by a field emission-scanning electron microscope. LCR meter was used to obtain the dielectric properties of the layer. As the addition of an inorganic metal salt in PVDF sol, ${\beta}$ type - PVDF crystals were appeared in the hydrated metal salts doped-layer since the strong hydrogen bondings $(O-H{\cdots}F-C)_n$ due to high polarity of OH- were formed.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1352-1353
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• 2008

In this study, aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET(polyethylen terephthalate) substrate by r.f. magnetron sputtering method. PET substrate was surface-treated in an atmospheric pressure DBD(dielectric barrier discharge) plasma to increase deposition rate and to improve electrical propesties. Morphological changes by DBD plasma were obsered using contact angle measurement. The contact angle of water on PET was reduced from 62$^{\circ}$ to 42$^{\circ}$ by DBD plasma surface treatment. The plasma treatment also increased deposition rate and electrical propesties. The electrical resistivity as low as $4.97{\times}10^{-3}[{\Omega}-cm]$ and the deposition rate of 234[${\AA}$-m/min] were obtained in ZnO:Al film with surface treatment time of 5min, and 20min., respectively.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1425_1426
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• 2009

In this study, commercially available polyethylene terephthalate(PET), which is widely used as a substrate of flexible electronic devices, was modified by dielectric barrier discharge(DBD) method in an air condition at atmospheric pressure, and aluminium - doped zinc oxide (ZnO:Al) transparent conducting film was deposited on PET substrate by r. f. magnetron sputtering method. Surface analysis and characterization of the plasma-treated PET substrate was carried out using contact angle measurements, X-ray Photoelectron Spectroscopy(XPS) and Atomic Force Microscopy (AFM). Especially the effect of surface state of PET substrate on some important properties of ZnO:Al transparent conducting film such as electrical and morphological properties and deposition rate of the film, was studied experimentally. The results showed that the contact angle of water on PET film was reduced significantly from $62^{\circ}$ to $43^{\circ}$ by DBD surface treatment at 20 min. of treatment time. The plasma treatment also improved the deposition rate and electrical properties. The deposition rate was increased almost linearly with surface treatment time. The lowest electrical resistivity as low as $4.97{\times}10^{-3}[\Omega-cm]$ and the highest deposition rate of 234[${\AA}m$/min] were obtained in ZnO:Al film with surface treatment time of 5min. and 20min., respectively.

• Journal of the Korean Physical Society
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• v.81
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• pp.942-947
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• 2022

We report the electrical transport properties of a dual-gate graphene device placed on a CaF₂ substrate. A hexagonal boron nitride top-gate dielectric was introduced to confirm the electrical characteristics of the CaF₂/graphene transistor because it is difficult to inject sufficient carriers through the CaF₂ substrate owing to its thickness of 500 ㎛, and the typical ambipolar behavior of graphene with a slight n-doping effect was clearly observed. In addition, we used a polymethyl methacrylate (PMMA) film as a top-gate dielectric for large-scale graphene devices grown via chemical vapor deposition, which was transferred onto a CaF₂ substrate. We controlled the high gate leakage current caused by the breakdown of the polymer due to non-uniformity by applying the film-transfer process rather than the direct coating method on the graphene device. Furthermore, the transport properties of large-area graphene in contact with CaF₂ are discussed with respect to the effect of top-contacted PMMA.

• Journal of the Korean Society for Precision Engineering
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• v.33 no.5
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• pp.333-339
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• 2016

In this paper, a fundamental experiment regarding the formation of porous 3D structures for personal safety products using 3D PPP (Porous Polymer Printing) was introduced for the first time. The filament was manufactured by mixing PP (Polypropylene) and CBA (Chemical Blowing Agent) with polymer extruder, and the diameter of the filament was approximately 1.75mm. The proposed 3D PPP method, combined with the conventional FDM (Fused Deposition Modeling) procedure, was influenced by process parameters, such as the nozzle temperature, printing speed and CBA density. In order to verify the best processing conditions, the depositing parameters were experimentally investigated for the porous polymer structure. These results provide parameters under which to form a multiple of 3D porous polymer structures, as well as various other 3D structures, and help to improve the mechanical shock absorption for personal safety products.

• Applied Chemistry for Engineering
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• v.32 no.4
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• pp.371-378
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• 2021

The formation of hydrophilic surface based on polymers has received great attention due to the anti-adhesion of bacteria on solid substrates. Anti-adhesion coatings are aimed at suppressing the initial step of biofilm formation via non-cytotoxic mechanisms, and surfaces applied hydrophilic or ionic polymers showed the anti-adhesion effect for bioentities, such as proteins and bacteria. This is attributed to the formation of surface barrier from hydration layers, repulsions and osmotic stresses from polymer brushes, and electrostatic interactions between ionic polymers and cell surfaces. The antifouling polymer coating is usually fabricated by the grafting method through the bonding with functional groups on surfaces and the deposition method utilizing biomimetic anchors. This mini-review is a summary of representative antifouling polymers, coating strategies, and antibacterial efficacy. Furthermore, we will discuss consideration on the large area surface coating for application to public facilities and industry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.37-37
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• 2008

에어로졸데포지션법을 이용하여 집적화 기판을 위한 $Al_2O_3$-PMMA 복합체 후막을 상온에서 구리 기판 위 에 제조하였다. XRD, FT-IR 분석을 통해 코팅된 막은 $Al_2O_3$와 PMMA의 혼합물로 존재함을 확인하였으며 성막 중 $Al_2O_3$. PMMA의 상호작용과 PMMA 파우더의 거동에 대한 분석을 통해 $Al_2O_3$-PMMA 복할체 후막의 성막 양상을 확인할 수 있었다. 또한 기판 거칠기에 따라 초기 계면의 양상이 달라질 수 있음을 확인하였고 이러한 초기 계면의 상태가 $Al_2O_3$-PMMA 복합체 후막의 제조에 있어 매우 중요함을 알 수 있었다. 본 연구에서는 에어로졸데포지션법을 이용한 $Al_2O_3$-PMMA 복합체 후막의 성막 양상을 통해 세라믹-폴리머 복합체의 제조에 있어서의 주요 변수들을 알아보고 $Al_2O_3$-PMMA 복합체 후막의 전기적인 특성을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.90.2-90.2
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• 2013

Vertically-aligned silicon nanostructure arrays (SNAs) have been drawing much attention due to their useful electrical properties, large surface area, and quantum confinement effect. SNAs are typically fabricated by chemical vapor deposition, reactive ion etching, or wet chemical etching. Recently, metal-assisted chemical etching process, which is relatively simple and cost-effective, in combination with nanosphere lithography was recently demonstrated for vertical SNA fabrication with controlled SNA diameters, lengths, and densities. However, this method exhibits limitations in terms of large-area preparation of unperiodic nanostructures and SNA geometry tuning independent of inter-structure separation. In this work, we introduced the layerby- layer deposition of polyelectrolytes for holding uniformly dispersed polystyrene beads as mask and demonstrated the fabrication of well-dispersed vertical SNAs with controlled geometric parameters on large substrates. Additionally, we present a new means of building in vitro neuronal networks using vertical nanowire arrays. Primary culture of rat hippocampal neurons were deposited on the bare and conducting polymer-coated SNAs and maintained for several weeks while their viability remains for several weeks. Combined with the recently-developed transfection method via nanowire internalization, the patterned vertical nanostructures will contribute to understanding how synaptic connectivity and site-specific perturbation will affect global neuronal network function in an extant in vitro neuronal circuit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.170-170
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• 2009

aerosol deposition method(ADM)은 에어로졸화 된 고상의 원료분말을 노즐을 통해 분사시켜 소결과정을 거치지 않고도 상온에서 고밀도 후막을 제조할 수 있으며, 세라믹, 고분자, 금속 등의 다양한 코팅이 가능하다. 본 연구에서는 ADM들 이용하여 세라믹 후막 및 세라믹-폴리머 복합체 후막을 제조하였고 60 mm 노즐을 이용하여 대면적 세라믹 후막 성장도 시도되었다. 세라믹 후막의 원료로는 낮은 유전율과 우수한 품질계수를 갖는 $Al_2O_3$ 분말과 AlN의 분말이 사용되었으며, 세라믹에 비하여 높은 탄성과 1,500~2,000의 품질계수를 갖는 테프론(teflon) 분말이 세라믹과의 복합체 후막성장에 사용되었다. 세라믹-폴리머 복합체의 경우, 폴리머의 함유량에 따라 후막 내부의 결정립 크기가 20 때의 평균 결정립을 갚는 세라믹 후막에 비해 최대 10배 정도까지 증가하는 것을 확인할 수 있었으며, 이에 따라 후막에서의 유전특성 및 전기적인 특성, 열전도도, 투과율이 크게 변화하는 것을 확인할 수 있었다. 본 연구에서는 이러한 물성 변화에 대한 원인 고찰을 위하여 후막의 미세구조 및 화학조성 등에 다양한 분석이 이루어졌으며, 상온에서 성막되는 후막의 고분자 기판으로의 응용을 위한 최적의 공정조건을 제시하고자 한다.