• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.6 no.3
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• pp.73-81
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• 1997

This study was to find the best adhesive condition comparing mechanical property in case of hot-melt adhesion using glue-gun, ultrasonic welding with adhesion and only ultrasonic welding in order to adhere thermoplastic resin of polyethylene (PE) in which reliable adhesion was resulted in case of ultrasonic welding with same materials of PE. The best welding condition were acquired at welding time 1 second, welding pressure 250kPa for PE-PE where welding time and welding pressure were increased in accordance with the increase of material strength. At the best ultrasonic welding conditions, bonding strength of PE-PE welding was about 21MPa of which material have tensile strength of 24MPa. Through the analysis of microscophic test for ultrasonic welding structure, it was distinguished between well welded structure with higher intermolecule flow and bad welded structure with lower flow, of which result is mostly correspond with the result of tensile strength test.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2006.05a
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• pp.31-34
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• 2006

In this study on the appliable Asphalt sheet of monolithic and inorganic matter waterproofing material using of field because of problem of complex waterproofing sheet. Before this cement polymer modified waterproof coating and appliable asphalt sheet of monolithic whether have stability by method of construction about all style waterproofing that evaluate to new method of construction development naturally big emphasis put and try to approach. Did performance test item first at, as a result, drew by suitable thing in all KS items. This is considered to have more effective spot construction work because if means that have stability by material as well as method of construction.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.7
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• pp.701-706
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• 2015

In this study, experimental and computer simulation results are compared and analyzed. Three-dimensional (3D) fabricated matrices from an MJM 3D printer were joined with poly-acetate thermoplastic polymers using a diode laser. A power range of 5-7 W was used to irradiate the boundary of two polymers. The heated polymers flowed into the matrices of the 3D fabricated structure, and reliable mechanical joining was achieved. Computer simulation showed the temperature distribution in the polymers, and flow direction was estimated based on the flux and temperature information. It was found that the more than the minimum energy threshold was required to effectively join the polymers and that two scans at low-speed were more effective than four scans at high speed.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• Polymer(Korea)
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• v.31 no.1
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• pp.58-67
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• 2007

Fully cholesteryloxycarbonated and (8-cholesteryloxycarbonyl) heptanoated disaccharide derivatives were synthesized by reacting cellobiose, maltose, and lactose with cholesteryl chloroformate or 8- cholesteryloxycarbonylheptanoyl chloride, and their thermotropic liquid crystalline properties were investigated. All the cholesteryloxycarbonated derivatives (CH1DSs) formed enantiotropic cholesteric phases, whereas all the (8-cholesteryloxycarbonyl) heptanoated derivatives (CH8DSs) exhibited monotropic cholesteric phases with left-handed helicoidal structures whose optical pitches (${\lambda}m's$) decrease with increasing temperature. All the CH1DSs, contrast with the CH8DSs, did not display reflection colors over the full cholesteric range, suggesting that the helicoidal twisting power of the cholesteryl group highly depends on the length of the spacer joining the cholesteryl group to the disaccharide chain. The thermal stability and degree of order in the mesophase and the temperature dependence of the ${\lambda}m$ observed for EH8DSs were entirely different from those reported for the cholesterol-bearing dimers and triplet and the (8-cholesteryloxycarbonyl) heptanoated polysaccharide derivatives. The results were discussed in terms of the difference in the number of the mesogenic units per mole of repeating unit and the flexibility of the main chain.

• Polymer(Korea)
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• v.31 no.4
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• pp.356-367
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• 2007

Three kinds of amylose derivatives such as: cholesteryloxycarbonated amyloses(CAMs) with degree of esterification(DE) ranging from 1.8 to 3, (6-cholesteryloxycarbonyl)pentanoated amyloses(PAMs) with DE ranging from 0.3 to 3, and fully cholesteryloxycarbonated PAMs(CPAMs) were synthesized, and their thermotropic liquid crystalline properties were investigated. CAMs with $DE{\geq}2.6$, PAM with DE=1.6 and all the CPAMs formed enantiotropic cholesteric phases, whereas PAM with $DE{\geq}2.2$ exhibited monotropic cholesteric phases. PAM with $DE{\geq}2.2$ and CPAMs with (6-cholesteryloxycarbonyl)pentanoyl DE (DS) more than 1.0 formed cholesteric phases with left-handed helical structures whose optical pitches (${\lambda}_{m'}s$) decrease with increasing temperature. However, the ${\lambda}_{m'}s$ of these samples decreased with increasing DS at the same temperature. On the other hand, CAMs, PAM with DE=1.6, and CPAM with DS=0.3 did not display reflection colors over the full cholesteric range, suggesting that the helicoidal twisting power of the cholesteryl group highly depends on the length of the spacer joining the cholesteryl group to the main chain and DS. The thermal stability and degree of order in the mesophase observed for the amylose derivatives highly depended on DE or DS. The results were discussed in terms of the difference ul the hydrogen bond, the internal plasticization, and the decoupling of the motion of side group with the main chain.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.4-4
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• 2009

Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) was welded through a combination of a diode laser and CNC. Laser beam passed the transparent PC and was absorbed in an opaque ABS. Polymers were melted and welded by absorbed and conducted heat. Experiments were carried out by varying working distance from 44mm to 50mm for the focus spot diameter control, laser input power from 10W to 25W, and scanning speed from 100 to 400mm/min. The weld bead size and the specimen cross-section were analyzed, and tensile results were presented through the joint force measurement. With focus distance at 48mm, laser power with 20W, and welding speed at 300mm/min, experimental results showed the best welding quality which bead size was 3.75mm and the shear strength was $22.8N/mm^2$. Considering tensile strength of ABS is $43N/mm^2$, shear strength was sufficient to hold two materials. A single process was possible in CNC machining processes, surface processing, hole machining and welding. As a result, the process cycle time was reduced to 25%. Compared to a typical process, specimens were fabricated in a single process, with high precision. By combining two operations processes developed process gained 50% more efficiency.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.8
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• pp.773-780
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• 2015

Traditionally, additive manufacturing (AM) technology has been used to fabricate prototypes in the early development phase of a product. This technology is being applied to release manufacturing of a product because of its low cost and fast fabrication. AM technology is a process of joining materials to fabricate a product from the 3D CAD data in a layer-by-layer manner. The orientation of a layer during manufacturing can affect the mechanical properties of the product because of its anisotropy. In this paper, tensile testing of polymer-based specimens were built with a typical AM process (FDM, PolyJet and SLA) to study the mechanical properties of the AM materials. The ASTM D 638 tensile testing standard was followed for building the specimens. The mechanical properties of the specimens were determined on the basis of stress-strain curves formed by tensile tests. In addition, the fracture surfaces of the specimens were observed by SEM to analyze the results.