• 제목/요약/키워드: Polymer Joining

검색결과 44건 처리시간 0.023초

다중적층 소재 레이저용접 인자별 열영향 해석 (Parametric Analysis of Thermal Effects on Multi Layered Laser Welding)

  • 최세훈;최해운
    • 한국기계가공학회지
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    • 제20권8호
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    • pp.18-24
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    • 2021
  • Polymers, polymer compounds, are very moldable at low temperatures and have good strength against weight, and hence, are often used in the interior and exterior materials of cars. Owing to the increasing environmental problems, emission regulations have become stricter, which has increased the use of lightweight polymers as substitutes for metal materials. Therefore, as the use of polymer increases, extensive research is being conducted on the bonding technology of polymers, such as polyurethane and epoxy. However, the increased cost and environmental pollution by adhesives caused by the polymer manufacturing plant depend on the chemical composition or the manufacturer's mix ratio. To compensate for this issue, a laser beam is irradiated through a highly permeable polymer (PC) placed on top of an absorbent polymer (ABS) to transfer the laser output to the ABS polymer and fuse them at the interface. Moreover, enabling laser penetrating bonding by placing a stainless steel wire mesh between the two polymers can achieve improved bonding strength compared to conventional heterogeneous polymer bonding.

초음파 용접을 이용한 합성수지의 결합 (Joining of Polymer Materials with Ultrasonic Welding)

  • 이철구;정규창
    • Journal of Welding and Joining
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    • 제16권2호
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    • pp.48-56
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    • 1998
  • This study was performed to find the best bonding conditions by comparing mechanical properties in thermoplastic resin of polyethylene (PE) and polyamide (PA) adhesion. Following results were obtained from the tests with varying welding time and welding pressure. Satisfactory adhesion was executed in ultrasonic welding for the same materials of PE and PA. The best welding conditions were found to be welding time of 1 second, welding pressure of 250kPa for PE-PE weding, 2 second and 350kPa for PA-PA welding. Welding time and welding pressure end to increase with the increase of materials strength. Dissimilar materials were adhered when adhesion and ultrasonc welding were performed simultaneously. The observation of the structure of ultrasonic welding area with microscope showed differenticated structures between well adhered region and badly adhered region.

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A coupled finite element/meshfreemoving boundary method for self-piercing riveting simulation

  • Cai, Wayne;Wang, Hui-Ping;Wu, C.T.
    • Interaction and multiscale mechanics
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    • 제6권2호
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    • pp.257-270
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    • 2013
  • The use of lightweight materials has been steadily increasing in the automotive industry, and presents new challenges to material joining. Among many joining processes, self-piercing riveting (SPR) is particularly promising for joining lightweight materials (such as aluminum alloys) and dissimilar materials (such as steel to Al, and metal to polymer). However, to establish a process window for optimal joint performance, it often requires a long trial-and-error testing of the SPR process. This is because current state of the art in numerical analysis still cannot effectively resolve the problems of severe material distortion and separation in the SPR simulation. This paper presents a coupled meshfree/finite element with a moving boundary algorithm to overcome these numerical difficulties. The simulation results are compared with physical measurements to demonstrate the effectiveness of the present method.

폴리카보네이트와의 레이저 투과 용접성 개선을 위한 폴리프로필렌 개질 (Modification of Polypropylene for Improving the Laser Transmission Weldability to Polycarbonate)

  • 김대진;전일련;박해윤;서관호
    • 폴리머
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    • 제37권6호
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    • pp.753-763
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    • 2013
  • 동종 혹은 이종의 고분자를 레이저로 접착시키는 방법은 레이저 접착이 가지는 장점들로 인해 많은 산업분야에서 광범위하게 사용되고 있다. 산업적으로 많이 사용되는 폴리프로필렌(PP)과 폴리카보네이트(PC)가 레이저 투과용접이 가능하다면 자동차 헤드램프에 큰 이점을 갖고 적용할 수 있을 것이다. 하지만, 폴리프로필렌과 폴리카보네이트는 상용성이 낮아 레이저 접착을 시켜도 강도가 낮은 문제점이 있다. 본 연구에서는 반응압출을 통해 폴리프로필렌을 글리시딜메타크릴레이트(GMA)로 개질하고, 폴리카보네이트와의 상용성, 기계적 물성 및 레이저 투과 용접을 통해 접착성을 조사하였다.

BGA 패키지를 위한 언더필의 열적 특성과 유동성에 관한 연구 (Evaluation of Thermal Property and Fluidity with Underfill for BGA Package)

  • 노보인;이보영;김수종;정승부
    • Journal of Welding and Joining
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    • 제24권2호
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    • pp.57-63
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    • 2006
  • In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.

폴리머와 산화알루미나 연마재를 이용한 마이크로 버 제거 특성에 관한 연구 (A Study of Micro De-burring Characteristics using Polymer and $Al_2O_3$ Abrasive)

  • 손종인;이정원;김준기;윤길상
    • 한국정밀공학회지
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    • 제28권5호
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    • pp.578-584
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    • 2011
  • In mechanical cutting process, burr was generated at workpiece by cutting tool generally. It is working disturbance during manufacturing process. Besides burr was taken shape relatively large size more micro scale machining than macro scale machining. Many researches have been studied to remove micro burr(de-burring), because it was negative effect for accuracy of machining shape. However, micro de-burring was constrained by burr height, micro feature and so on. In this paper, experimental research was carried out to compare de-burring characteristics of $Al_2O_3$ abrasive and polymer.

폴리머 마이크로 칩에 대한 레이저 투과 마이크로 접합 (Analysis of Transmission Infrared Laser Bonding for Micro Polymer Devices)

  • 김주한;신기훈
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.43-45
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    • 2005
  • A precise bonding technique, transmission laser bonding using energy transfer, for polymer micro devices is presented. The irradiated IR laser beam passes through the transparent part and absorbed on the opaque part. The absorbed energy is converted to heat and bonding takes place. In order to optimize the bonding quality, the temperature profile on the interface must be obtained. Using optical measurements of the both plates, the absorbed energy can be calculated and heat transfer model was applied for obtaining the transient temperature profile. The transmission laser bonding has a potential in the local precise bonding in MEMS or Lab-on-a-chip.

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분말송급장치의 개조에 의한 미세$5\mu\textrm{m}$ $Al_2O_3$분말의 송급 특성개선 및 플라즈마 용사조건에 따른 코팅층의 특성분석 (Improvement of Powder Feeding Characteristics of Fine$5\mu\textrm{m}$ $Al_2O_3$ Powder by Modification of the Powder Feeding Systems and Characterization of the Coating Layer depending on Plasma Spraying Conditions)

  • 설동욱;김병희;정민석;임영우;서동수
    • Journal of Welding and Joining
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    • 제15권1호
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    • pp.116-124
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    • 1997
  • A scope of this study is to establish the optimum plasma spray conditions for fine ($5\mu\textrm{m}$) $Al_2O_3$ powder. However, the flowability of the $Al_2O_3$ powder is not so good because of irregular particle shape and fine particle size. Therefore, powder feeding system was modified by 1) change of powder feeding line material from polymer to copper 2) shorten the powder feeding tube length 3) heating the powder feeding system to $80^{\circ}C$4) vibrating the powder feeding line continuously, in order to feed the fine powder homogeneously. The homogeneous powder feeding conditions were obtained with the modified powder feeding system by controlling the powder carrier gas flow and the powder flow rate indicator. The best plasma spraying conditions for the fine $Al_2O_3$ powder were found out as 40kw gun power, 80 g/min. powder feed rate and 50 mm working distance after characterizing the microstructure, hardness and wear loss of the $Al_2O_3$ coating layer.

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Bendable 임베디드 전자모듈의 손상 메커니즘 (Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions)

  • 조윤성;김아영;홍원식
    • Journal of Welding and Joining
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    • 제31권5호
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    • pp.59-63
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    • 2013
  • A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

폴리[1-(콜레스테릴옥시카보닐옥시)에틸렌]과 폴리[1-(콜레스테릴옥시카보닐헵타노일옥시)에틸렌]의 열방성 액정 거동 (Thermotropic Liquid Crystalline Behavior of Poly(1-cholesteryloxycarbonyloxy]ethylene] and Poly[1-(cholesteryloxycarbonylheptanoyloxy)ethylene])

  • 정승용;마영대
    • 폴리머
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    • 제30권1호
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    • pp.35-44
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    • 2006
  • 폴리(비닐 알코올)을 콜레스테릴 클로로포메이트 또는 8-콜레스테릴옥시카보닐헵타노일 클로라이드(CH8C)와 반응시킴에 의해 폴리[1-(콜레스테릴옥시카보닐옥시)에틸렌](PCOE)와 폴리[1-콜레스테릴옥시카보닐헵타노일옥시)에틸렌](PCOSE)를 합성함과 동시에 이들의 열 및 광학 특성을 검토하였다. CH8C는 단방성 콜레스테릭 상을 형성하는 반면 PCOE와 PCOSE는 쌍방성 콜레스테릭 상들을 형성하였다. CH8C의 경우와 같이, PCOSE의 광학피치$(\lambda_m)$는 온도가 상승함에 따라 감소하였다. PCOE는 PCOSE와 달리 반사색깔을 나타내지 않았다. 이러한 사실은 콜레스테릴 그룹에 의한 나선의 비틀림력은 콜레스테릴 그룹과 주사슬을 연결하는 스페이서의 길이에 민감하게 의존함을 시사한다 PCOE와 PCOSE가 나타내는 액정 특성들은 폴리(콜레스테릴-$\omega$-아크릴로일옥시알카노에이트들)이 나타내는 액정 특성들과 전혀 다르다. 이러한 결과들은 곁사슬과 주사슬의 화학결합의 양식이 콜레스테릭 상의 형성능, 안정성 그리고 $\lambda_m$의 온도 의존성에 중요한 역할을 함을 시사한다.