• 한국정보디스플레이학회:학술대회논문집
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• 2007.08b
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• pp.1719-1721
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• 2007

Major display equipment suppliers have introduced equipment using ink jets for manufacturing steps such as printing the polyimide alignment layer and printing color filters. This paper will discuss the status of ink jets as precision deposition tools and the new technology being introduced for ink jet manufacturing.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.144-144
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• 2006

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1313-1316
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• 2005

In the present paper, it was investigated that adhesion layer on gate insulator could affect the electrical characteristics for the organic thin film transistors (OTFTs). The polyimide (PI) as organic adhesion layer was fabricated by using the vapor deposition polymerization (VDP) processing . It was found that electrical characteristics improved comparing OTFTs using adhesion layer to another. We researched adhesion layer as a function of thickness. For inverted-staggered top contact structure, field effect mobility, threshold voltage, and on-off current ratio of OTFTs using adhesion layer of PI 15 nm thickness on the gate insulator with a thickness of 0.2 ${\mu}m$ were about 0.5 $cm^2/Vs$, -0.8 V, and $10^6$, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.958-961
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• 2007

The electrical characteristics of organic thin-filmtransistor (OTFTs) can be improved by inserting adhesion layer on gate dielectrics. Adhesion layer was used as polymeric adhesion layer deposited on inorganic gate insulators such as silicon dioxide $(SiO_2)$ and it was formed by vapor deposition polymerization (VDP) instead of spin-coating process. The OTFTs obtained the on/off ratio $of{\sim}10^4$, threshold voltage of 1.8V, subthreshold slop of 2.9 V/decade and field effect mobility about $0.01\;cm^2/Vs$.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.166-168
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• 2007

스퍼터링법으로 제작된 FCCL은 PI필름(Poly-imide film)과 Cu layer사이에 Tie-coating layer로 Ni-Cr을 많이 사용한다. 하지만 완성된 FCCL에서 페터닝을 실시할 때 Cr성분이 소멸되지 않고 잔존하는 현상으로 누설전류가 발생 한다. 또한 Cr으로 인해 Eatching액의 오염으로 재사용의 어려움도 발생된다. 이러한 원인들은 제품의 특성들을 저하 시키므로 이를 개선할 필요가 있다. 따라서 본 연구에서는 기존의 Tie-coating layer를 대체할 물질로 Acrylic acid를 이용하여 FCCL을 제작하여 표면특성 평가를 위해 Contact angle측정과 부착력을 위한 Peel test측정과 조직분석 및 성분분석을 위해 SEM-EDS를 측정을 통하여 Polymerization을 이용한 Ti-coating layer 개발의 가능성을 확인하였다.

• Polymer(Korea)
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• v.36 no.2
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• pp.145-148
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• 2012

The effects of the linearly polarized UV (LPUV) irradiation and thermal treatment of a photo-degradable polyimide (CBDA-ODA) alignment layer (AL) on its AL properties, liquid crystal (LC) alignment, and LCD characteristics have been investigated. The best quality of LC photo-alignment have been induced by the LPUV-irradiation with much (about 5~10 times) less dosage than that generating the maximum anisotropy of the AL. A thermal treatment of the LPUV-irradiated AL has effectively removed the undesirable, low-M.W. fragments of the AL generated during the photo-decomposition and increased the stability of the AL, which has resulted in improvement of the LC alignment and the LCD property.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.7
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• pp.635-640
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• 2005

In this paper, we have improved a novel high tilted optically compensated bend (OCB) (HTOCB) mode by using high tilt angle that was generated by the unique baking condition on the homeotropic alignment layer. The high tilt angle of liquid crystal (LC) was generated by new alignment process that tilt angle changed homeotropic state to homeogenous state using Hot-plate equipment; we obtained about $40\~50^{\circ}$ tilt angle with negative and positive dielectric anisotropy on the homeotropic polyimide (PI), and then LC tilt angle decreased as increasing baking temperature and time. At last, we obtained about $10^{\circ}$ with positive type NLC $({\Delta}n>0)$. Also, the LC tilt angle of positive type NLC $({\Delta}n>0)$ decreased as increasing rubbing strength at the same baking temperature and time. The novel LC operating mode (HTOCB) that used the high tilt angle by the new alignment method was improved. The response time of the novel HTOCB cell was faster than that of conventional OCB cell. We suggest that the developed the novel HTOCB cell using control of tilt angle on the homeotropic surface is a promising technique for the achievement of a fast response time and a high contrast ratio.

• Proceedings of the KIEE Conference
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• 1993.11a
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• pp.204-206
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• 1993

In this paper we represented electroplating process without seed layers for making metal micro structures needed for applying terminal voltage for one-to-one cell fusion system. In this system, we need thick insulator and metal structures because the diameter of a cell is approximately $40{\mu}m$. So, we adopted the photo-sensitive polyimide as electroplating molds and structural material. Generally, the processes utilizing the photo-sensitive polyimide as molds have metal seed layers on the substrate as electroplating electrodes and requires wiring tasks to these seed layers. We proposed electroplating process without any seed layer on the Si-substrate and simulated P-N-P (electrode - Si substrate - electrode) junction on N-type silicon substrate. Leakage current from one metal structure to another which arise when terminal voltage is applied can be remarkably decreased by doping Boron in the region to be electroplated.

• Macromolecular Research
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• v.15 no.2
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• pp.114-128
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• 2007

Polyimides are one of the most important classes of polymers used in the microelectronics and photoelectronics industries. Because of their high thermal stability, chemical resistance, and good mechanical and electric properties, polyimides are often applied in photoresists, passivation and dielectric films, soft print circuit boards, and alignment films within displays. Recently, fully aliphatic and alicyclic polyimides have found applications as optoelectronics and inter layer dielectric materials, due to their good transparencies and low dielectric constants $(\varepsilon)$. The low molecular density, polarity and rare probability of forming inter- or intra-molecular charge transfers, resulting in lowering of the dielectric constant and high transparency, are the most striking characteristics of aliphatic polyimide. However, the ultimate end use of polyimides derived from aliphatic monomers is in their targeted applications that need less stringent thermal requirements. Much research effort has been exerted in the development of aliphatic polyimide with increased thermal and mechanical stabilities, while maintaining their transparencies and low dielectric constants, by the incorporation of rigid moieties. In this article, the recent research process in synthesizing fully aliphatic polyimides, with improved dimensional stability, high transparency and low $\delta$values, as well as the characterizations and future scope for their application in micro electric and photo-electronic industries, is reviewed.

• Journal of the Korean Applied Science and Technology
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• v.19 no.2
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• pp.73-78
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• 2002

The polyimide(PI) Langmuir-Blodgett(LB) ultra thin films were prepared by imidizing the PAAS LB films of PMDA and benzidine system with a thermal treatment at $250^{\circ}C$ for 30min, where the PAAS LB films were formed on substrates by using LB technique. The thicknesses of one layer of PAAS and PI LB film that deposited at the surface pressure of 27mN/m were 20.9 and 4A, respectively. At low electric field, ohmic conduction($I^{\propto}$ V) was observed and the calculated electrical conductivity was about $4.23{\times}10^{-15}{\sim}9.81{\times}10^{-15}S/cm$. The dielectric constant of LB film was about 7.0.