• Journal of the Semiconductor & Display Technology
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• v.19 no.1
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• pp.93-96
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• 2020

Polyimide thin film was prepared by annealing the polyamic acid that was synthesized through co-deposition of diamine and dianhydride. The polyamic acid and polyimide thin film were characterized with FT-IR and HR FE-SEM. The average roughness of the film surface, evaluated with AFM, were 0.385 nm and 0.299 nm after co-deposition, and annealing at 120 ℃ respectively. OLED was passivated with the polyimide layer of 200 nm thickness. While the inorganic passivation layer enhances the WVTR of OLED, the organic passivation layer gives flexibility to the OLED. The in-situ passivation of OLED with organic thin film layer provides the leading technique to develop flexible OLED Display.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.672-676
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• 2009

Polymide is widely used alignment material of recent commercial LCD panel structure. Generally, polyimide alignment material is classified soluble polyimide type and polyamic acid type with their main bond structure of solution state. specially, compared to polyamic acid alignment layer, soluble polyimide type alignment layer have excellent reliability during long term LCD driving cause of their high imidazation ratio(%), high voltage holding ratio(%) and low ion density. The other side, this type alignment materials has significant DC image stickicng side effect for using in-plane switching mode lcd structure cause of their slow DC discharging property. we applied inorganic salt to usual soluble polyimide type alignment layer and found out this technique had good DC image sticking property without any loss of reliability property in inplane switching LCD cell structure. This approach leads excellent DC image sticking property with maintaining high reliability property this approach confirmed improves an image sticking and a reliability simultaneously from the horizontality aligned LCD mode whose relatively bad image sticking property.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.3
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• pp.380-385
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• 1996

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1063-1068
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• 2002

Polyimide/silica(PI/silica) hybrid materials having physical or chemical bonds between the PI and silica network were prepared using sol-gel process through hydrolysis and polycondensation of tetraethoxysilane with the polyamic Acid(PAA) or end-capped PAA solution. PAA solution was synthesized by ring opening reaction of pyromellitic dianhydride and oxydianiline monomers in dimethyl acetamide solution. End-capped PAA solution was synthesized by the addition of 3-aminopropyltriethoxysilane in PAA solution. PI/silica hybrid samples were characterized by infrared spectroscopy, differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, and tensile tester. It has been demonstrated that the properties of hybrid samples were affected by the silica content and the bond type between PI and silica.

• Proceedings of the Membrane Society of Korea Conference
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• 1994.10a
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• pp.56-57
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• 1994

Polyimides are one of the most important classes of highperformance polymers. Due to their excellent electriccal, thermal, and high-temperature mechanical properties. The polyimide and its derivatives have found many applications. But their uses are limited by their poor solubilities. In fact, most polyimides were processed in the form of their precursors, polyamic acid, which were subsequently converted to the imide structure.

• Proceedings of the Korean Fiber Society Conference
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• 1995.10a
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• pp.117-118
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• 1995

• Electrical & Electronic Materials
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• v.11 no.10
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• pp.60-65
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• 1998

Deposition conditions, surface morphology, and electrical properties of polyamic acid alkylamine salts (PAAS) Langmuir-Blodgett(LB) films have been investigated through a study of surface pressure-area $\pi$-A isotherms, AFM (atomic force microscopy), and current-voltage characteristics. To obtain the optimum conditions of film deposition, the $\pi$-A isotherms were examined by varying temperature, barrier moving speed, dipping speed, spreading amount of solution etc. The Z-type LB films were made at the surface pressure of 5 mN m-1 and 25 mN m-1 for the AFM study; the former surface pressure forms the gas phase and the latter one forms the solid phase. The LB film made in the gas phase show domains with a size of about 200 A diameter and 70 A height. However, the LB films made in the solid phase show a very smooth surface with 2 A surface roughness. In the current-voltage characteristics measured along the perpendicular direction of the films, ohmic conduction has been observed below 105 V cm-1 and the calculated electrical conductivity is about 10-13 S cm-1. Nonohmic conduction has been observed above = 10-11 V cm and the conduction mechanism can be explained by the Schottky effect.

• Applied Microscopy
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• v.25 no.1
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• pp.130-138
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• 1995

TEM specimen preparation methods have been examined to characterize Cu oxide particles in the polyimide film. Polyimide films were prepared by coating polyamic acid onto Cu films which had been deposited on TEM-mask and glass substrates and Cu foil, followed by thermal curing. In case of TEM-mask, direct observation was possible without further preparation. In other cases, TEM specimen were made by separating polyimide film from the substrate. Polyimide films were removed from glass and Cu foil by dissolving glass in HF solution and Cu foil in $H_{2}SO_{4}$ solution. TEM-mask observation confirms that fine $Cu_{2}O$ particles precipitate in the polyimide as a result of reaction of polyamic acid with Cu. However $Cu_{2}O$ particle reacts with HF and $H_{2}SO_{4}$ solution during dissolving the substrate and interpretation could be misled. It is concluded characterization of $Cu_{2}O$ particle in polyimide using TEM-mask is better than other methods.

• Proceedings of the KIEE Conference
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• 1997.07d
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• pp.1216-1218
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• 1997

Hydrolysis of BTDA-ODA: MPDA, PMDA-ODA, PIQ polyimides were investigated by FT-IR. The results showed that hydrolysis depends on structure of polyimide and that polyimide obtains hydrolytic stability by curing. Polyimide-aluminum interfaces were characterized by RAIR. It was concluded that imidization of the polyamic acid to polyimde was inhibited by interaction of acid groups with substrate to form aluminum carboxylate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.8
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• pp.581-586
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• 1998

This paper describes athermally stimulated displacement current (TSDC) of arachidic acid(AA) and polyamic acid alkylamine salts(PAAS) Langmuir-Blodgett(LB) films, which is a precursor of polyimide(PI). The TSDC measurements of AA LB film were performed from temperature to about 11$0^{\circ}C$ at a rate of 0.2$^{\circ}C$/ｓ inside a vacuum chamber for a reference. And the TSDC measurements PAAS LB film were performed from room temperature to about 25$0^{\circ}C$ and temperature was increased at the same rate as that of AA LB film. They show that there are TSDC peaks at about 7$0^{\circ}C$ in the arachidic acid LB films, and at about 7$0^{\circ}C$ and 16$0^{\circ}C$ in the PAAs LB films. Results of these measurements indicate the one small peak at 7$0^{\circ}C$ is resulted from a softening of the alkyl group and the large peak at 16$0^{\circ}C$ is possibly due to dipole of C-O group in the PASS molecule. We have calculated the vertical component of the AA and PAAs L film out of the TSDC curves. It shows that the dipole moment of the AA LB film is about 70-mD at 7$0^{\circ}C$. And the dipole moment of PAAS LB film is about 040mD at 7$0^{\circ}C$ and about 200mD at 16$0^{\circ}C$ in the first measurement of TSDC. In the second measurement of TSDC of PASS LB film after cooling down to room temperature, the TSDC peaks are almost disappeared.