• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 1999년도 춘계종합학술대회
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• pp.403-406
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• 1999

고상결정화(SPC)로 제작된 다결정 박막의 전기적 특성 변화를 측정함으로서 다결정 박막 트랜지스터(poly-Si TFT's)에 대한 온도 변화 (25～1$25^{\circ}C$)의 영향을 연구하였다. 채널 길이가 각각 1.5, 10 $\mu\textrm{m}$인 SPC로 제작된 n-채널 poly-Si TFT는 온도 변화에도 불구하고 높은 전계 효과 이동도 ($\mu$$_{FE}$ : 1.5와 10$\mu\textrm{m}$에서 각각 $\geq$82 and $\geq$60$\textrm{cm}^2$/V-s), 낮은 문턱전압 (V$_{th}$ : 1.5 와 10$\mu\textrm{m}$에서 각각 $\leq$ 1.52 and $\leq$ 2.75V), 낮은 Subthreshold swing (S$_{t}$), 그리고 양호한 ON-OFF 특성이 나타났다. 따라서, SPC로 제작된 poly-Si TFT는 액정표시장치의 주변회로에 적용할 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.60-61
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• 2007

In this paper, the p-channel poly Si thin-film transistors (Poly-Si TFT's) using formed by solid phase crystallization (SPC) on glass substrate were fabricated. And we propose an ONO(Oxide-Nitride-Oxide) multilayer as the gate insulator for poly-Si TFT's to indicate non-volatile memory (NVM) effect. Poly-Si TFT is investigated by measuring the electrical properties of poly-Si films, such as I-V characteristics, on/off current ratio. NVM characteristics is showed by measuring the threshold voltage change of TFT through I-V characteristics.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.173-176
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• 2005

Teijin사의 HT100-B60의 폴리카보네이트(polycarbonate) $100{\mu}m$, I-Component사의 PES(polyethersulfone) $200{\mu}m$, Ferrania사의 PAR(polyacrylate) $100{\mu}m$와 $200{\mu}m$를 사용하였다 열팽창계수의 차이로 인해 공정상 기판의 가열과 냉각시 열응력이 발생하여 기판의 크랙발생의 원인이 된다. 이를 최소화하기 위해 모든 공정이 시작하기 전에 pre-annealing을 통해 plastic 기판의 시간별 공정을 실시하였다. plastic film의 annealing time은 0h, 12h, 24, 40h, 50h, 60h, 70h, 80h으로 사간을 달리하여 오븐 안의 진공상태를 조성하여 실험하였다. Thermal evaporator로 Al을 약 170nm 증착하였으며 (주)동진 세미캠의 DTFR-1011s DR LCD용 감광액을 Spin Coating Spread(500rpm/6sec), Spin(3000rpm/20sec)으로 coating하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.470-470
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• 2013

Recently, active materials such as amorphous silicon (a-Si), poly crystalline silicon (poly-Si), transition metal oxide semiconductors (TMO), and organic semiconductors have been demonstrated for flexible electronics. In order to apply flexible devices on the polymer substrates, all layers should require the characteristic of flexibility as well as the low temperature process. Especially, pentacene thin film transistors (TFTs) have been investigated for probable use in low-cost, large-area, flexible electronic applications such as radio frequency identification (RFID) tags, smart cards, display backplane driver circuits, and sensors. Since pentacene TFTs were studied, their electrical characteristics with varying single variable such as strain, humidity, and temperature have been reported by various groups, which must preferentially be performed in the flexible electronics. For example, the channel mobility of pentacene organic TFTs mainly led to change in device performance under mechanical deformation. While some electrical characteristics like carrier mobility and concentration of organic TFTs were significantly changed at the different temperature. However, there is no study concerning multivariable. Devices actually worked in many different kinds of the environment such as thermal, light, mechanical bending, humidity and various gases. For commercialization, not fewer than two variables of mechanism analysis have to be investigated. Analyzing the phenomenon of shifted characteristics under the change of multivariable may be able to be the importance with developing improved dielectric and encapsulation layer materials. In this study, we have fabricated flexible pentacene TFTs on polymer substrates and observed electrical characteristics of pentacene TFTs exposed to tensile and compressive strains at the different values of temperature like room temperature (RT), 40, 50, $60^{\circ}C$. Effects of bending and heating on the device performance of pentacene TFT will be discussed in detail.