• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.480-484
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• 2013

Since SiOC was introduced as an anode material for lithium ion batteries, it has been studied with different chemical compositions and microstructures using various silicon based inorganic polymers. Poly(phenyl carbosilane) is a SiOC precursor with a high carbon supply in the form of the phenyl unit, and it has been investigated for film applications. Unlike any other siloxane-based polymers, oxygen atoms must be utilized in an oxidation process, and the amount of oxygen is controllable. In this study, SiOC anodes were prepared using poly(phenyl carbosilane) with different heat treatment conditions, and their electrochemical properties as an anode material for lithium ion batteries were studied. In detail, cyclic voltammetry and charge-discharge cycling behavior were evaluated using a half-cell. A SiOC anode which was prepared under a heat treatment condition at $1200^{\circ}C$ after an oxidation step showed stable cyclic performance with a reversible capacity of 360 mAh/g.

• Journal of the Korean Chemical Society
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• v.40 no.5
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• pp.347-356
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• 1996

The selective cleavage of phenylsilane by triflic acid gives silyltriflates. The removal of phenyl groups in $Ph_3SiH$ and carbosilane polymer $(Ph_2SiCH_2CH_2CH_2)n$ with one to two equiv of triflic acid leads to formation of mono- and disubstituted silyltriflate ester bonds. Reaction with allylmagnesium bromide produces corresponding derivatives with good yields. An organosilane dendrimer with allylated carbosilane polymer has been synthesized up to G3 using repetitive allylation hydrosilylation cycles.

• Journal of the Korean Ceramic Society
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• v.52 no.4
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• pp.243-247
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• 2015

Si(Al)ON precursor was synthesized by formation of new Si-N bond using organoaluminum imine and liquid type poly(phenyl carbosilane). It was decomposed between $200-600^{\circ}C$, and the ceramic yield was 51% after pyrolysis. 150 - 200 nm in thickness of coating film was obtained by spin coating method. The precursor was easily oxidized during process because it was unstable in air. However the oxygen content was limited to 0.5 - 0.7 to silicon in heat treatment step. Even though the content of nitrogen was decreased by pyrolysis, Al-N and Si-N bonds were formed in ammonia atmosphere, and Si(Al)ON film was formed with 0.2 in content to silicon.