• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• International Journal of Ocean System Engineering
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• v.2 no.3
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• pp.185-194
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• 2012

A Macroscopic combination of two or more distinct materials is commonly referred to as a "Composite Material", having been designed mechanically and chemically superior in function and characteristic than its individual constituent materials. Composite materials are used not only for aerospace and military, but also heavily used in boat/ship building and general composite industries which we are seeing increasingly more. Regardless of the various applications for composite materials, the industry is still limited and requires better fabrication technology and methodology in order to expand and grow. An example of this is that the majority of fabrication facilities nearby still use an antiquated wet lay-up process where fabrication still requires manual hand labor in a 3D environment impeding productivity of composite product design advancement. As an expert in the advanced composites field, I have developed fabrication skills with the use of machinery based on my past composite experience. In autumn 2011, the Korea government confirmed to fund my project. It is the development of a composite sanding machine. I began development of this semi-robotic prototype beginning in 2009. It has possibilities of replacing or augmenting the exhaustive and difficult jobs performed by human hands, such as sanding, grinding, blasting, and polishing in most often, very awkward conditions, and is also will boost productivity, improve surface quality, cut abrasive costs, eliminate vibration injuries, and protect workers from exposure to dust and airborne contamination. Ease of control and operation of the equipment in or outside of the sanding room is a key benefit to end-users. It will prove to be much more economical than normal robotics and minimize errors that commonly occur in factories. The key components and their technologies are a 360 degree rotational shoulder and a wrist that is controlled under PLC controller and joystick manual mode. Development on both of the key modules is complete and are now operational. The Korean government fund boosted my development and I expect to complete full scale development no later than 3rd quarter 2012. Even with the advantages of composite materials, there is still the need to repair or to maintain composite products with a higher level of technology. I have learned many composite repair skills on composite airframe since many composite fabrication skills including repair, requires training for non aerospace applications. The wind energy market is now requiring much larger blades in order to generate more electrical energy for wind farms. One single blade is commonly 50 meters or longer now. When a wind blade becomes damaged from external forces, on-site repair is required on the columns even under strong wind and freezing temperature conditions. In order to correctly obtain polymerization, the repair must be performed on the damaged area within a very limited time. The use of pre-impregnated glass fabric and heating silicone pad and a hot bonder acting precise heating control are surely required.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.61-66
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• 2012

Chemical Mechanical Planarization (CMP) is a polishing process used in the microelectronic fabrication industries to achieve a globally planar wafer surface for the manufacturing of integrated circuits. Pad conditioning plays an important role in the CMP process to maintain a material removal rate (MRR) and its uniformity. For metal CMP process, highly acidic slurry containing strong oxidizer is being used. It would affect the conditioner surface which normally made of metal such as Nickel and its alloy. If conditioner surface is corroded, diamonds on the conditioner surface would be fallen out from the surface. Because of this phenomenon, not only life time of conditioners is decreased, but also more scratches are generated. To protect the conditioners from corrosion, thin organic film deposition on the metal surface is suggested without requiring current conditioner manufacturing process. To prepare the anti-corrosion film on metal conditioner surface, vapor SAM (self-assembled monolayer) and FC (Fluorocarbon) -CVD (SRN-504, Sorona, Korea) films were prepared on both nickel and nickel alloy surfaces. Vapor SAM method was used for SAM deposition using both Dodecanethiol (DT) and Perfluoroctyltrichloro silane (FOTS). FC films were prepared in different thickness of 10 nm, 50 nm and 100 nm on conditioner surfaces. Electrochemical analysis such as potentiodynamic polarization and impedance, and contact angle measurements were carried out to evaluate the coating characteristics. Impedance data was analyzed by an electrical equivalent circuit model. The observed contact angle is higher than 90o after thin film deposition, which confirms that the coatings deposited on the surfaces are densely packed. The results of potentiodynamic polarization and the impedance show that modified surfaces have better performance than bare metal surfaces which could be applied to increase the life time and reliability of conditioner during W CMP.