• 한국정밀공학회지
• /
• 제16권2호통권95호
• /
• pp.5-14
• /
• 1999

The necessity of six axis force-torque sensors is well recognized in the fields of automatic fine assembly, deburring polishing, and automatic fish processing using robotic manipulators. The paper proposes a simple and compact elastic structure of the force-torque sensor which senses externally applied three force and three torque components. Rough surface strain distribution of the elastic structure is examined analytically, and then more accurate surface strain are obtained from finite element analysis. The compliance matrix which is a linear relationship between force components and strain measurements is obtained for the proposed sensor. Some basic principles of measuring 3 force and torque components are also presented.

• 한국공작기계학회:학술대회논문집
• /
• 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
• /
• pp.155-160
• /
• 2001

In the use of glass fiber reinforced plastics(GFRP) it is often necessary to cut the components, but the cutting of GFRP is often made difficult by the delamination of the compositions and short tool life. Experimental investigation was conducted to evaluate the chip formation of the glass fiber reinforced plastics during orthogonal cutting. The chip formation process, cutting force, and thrust force were studied. The chip formation processes were studied through the use of quick-stop device. Chip-tool contact areas were obtained with the use of the quick-stop device, and observed using optical microscopy after polishing. Cutting force and thrust force were measured through the use of the tool dynamometer.

• 반도체디스플레이기술학회지
• /
• 제18권1호
• /
• pp.25-31
• /
• 2019

In this study, a new adhesion evaluating equipment and data processing methods were developed to overcome some limitations of existing evaluating equipment. Nano-diamond coated tool is a specimen of experiment. When applying frictional force and shear force on the specimen by a rotating polishing pad, delamination occurs at a moment. During each experiment, the vibration, load, and torque is obtained by accelerometer, loadcell and torque s+ kpensor. Frictional force and coefficient of friction are obtained by calculating torque and load. Based on FFT transformation, acceleration is processed and analyzed. As a result, the moment of delamination and the load at that time can be detected by the new developed equipment and measurement system. Finally, we call this load as an Adhesion force.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2012년도 추계학술대회 논문집
• /
• pp.937-938
• /
• 2012

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2010년도 추계학술대회 논문집
• /
• pp.127-128
• /
• 2010

• 대한기계학회:학술대회논문집
• /
• 대한기계학회 2001년도 춘계학술대회논문집B
• /
• pp.59-64
• /
• 2001

The necessity of six axis force-torque sensors have been increased in the field of automatic assembly, polishing and deburing using robotic manipulator recently. This paper presents a simple and compact elastic structure design of the six axis force-torque sensor with a cross-shaped structure and the expected deflection value was induced by theoretical method to design a six axis force-torque sensor and then this theoretical method was verified by comparing with the results using the Finite Element Method(FEM).

• 대한기계학회논문집A
• /
• 제37권3호
• /
• pp.313-318
• /
• 2013

전자기력을 이용한 자기연마 공정은 전통적 가공방식으로 버를 제거하기 힘든 비자성체의 소재 및 마이크로 형상의 가진 제품에 활용될 수 있는 새로운 정밀 디버링 방식이다. 그러나 이러한 자기연마법은 자기연마입자를 이용한 기계적 절삭력을 이용하고 있기 때문에 마이크로 단위의 구조물의 형상을 변형시킬 가능성이 높다. 따라서 본 연구에서는 탄소나노튜브-코발트 금속복합체를 이용한 전해-자기복합가공을 STS316 소재의 미세 그루브의 마이크로 디버링공정에 적용하고 그 특성을 분석하였다. 그 결과 자기연마공정을 적용한 공정에서는 공정 후 그루브에 생성된 버는 효율적으로 제거되었으나 그루브 끝단의 형상변화가 두드러지게 관찰되었다. 반면 전해-자기복합가공을 이용한 경우에는 재료제거율이 낮아 그루브 끝단의 형상변화 없이 디버링 공정이 진행됨을 확인하였다.

• Transactions on Electrical and Electronic Materials
• /
• 제12권2호
• /
• pp.56-59
• /
• 2011

The characterization of the chemical mechanical polishing (CMP) process for undensified phophosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been used by experimenters to understand the relationship between the input variables and responses of interest in a simple and efficient way, and it typically is beneficial for determining the appropriatesize of experiments with multiple process variables and making statistical inferences for the responses of interest. The equipment controllable parameters used to operate the machine consist of the down force of the wafer carrier, pressure on the back side wafer, table and spindle speeds (SS), slurry flow (SF) rate, pad condition, etc. None of these are independent ofeach other and, thus, the interaction between the parameters also needs to be understoodfor improved process characterization in CMP. In this study, we selected the five controllable equipment parameters the most recommendedby process engineers, viz. the down force (DF), back pressure (BP), table speed (TS), SS, and SF, for the characterization of the CMP process with respect to the material removal rate and film uniformity in percentage terms. The polished material is undensified PSG which is widely used for the plananization of multi-layered metal interconnects. By statistical modeling and the analysis of the metrology data acquired from a series of $2^{5-1}$ fractional factorial designs with two center points, we showed that the DF, BP and TS have the greatest effect on both the removal rate and film uniformity, as expected. It is revealed that the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that process control based on a better understanding of the process is the key to success in current semiconductor manufacturing, in which the size of the wafer is approaching 300 mm and is scheduled to continuously increase up to 450 mm in or slightly after 2012.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2002년도 춘계학술대회 논문집 유기절연재료 전자세라믹 방전플라즈마 일렉트렛트 및 응용기술
• /
• pp.228-232
• /
• 2002

The rise throughput and the stability in the device fabrication can be obtained by applying chemical mechanical polishing(CMP) process in 0.18 ${\mu}m$ semiconductor device. However it does have various problems due to the CMP equipment. Especially, among the CMP components, process variables are very important parameters in determining removal rate and non-uniformity. In this paper, We studied the DOE(design of experiment) method for the optimized CMP process. Various process variations, such as table and head speed, slurry flow rate and down force, have investigated in the viewpoint of removal rate and non-uniformity. Through the above DOE results, we could set-up the optimal process parameters.

• Tribology and Lubricants
• /
• 제30권3호
• /
• pp.139-145
• /
• 2014

Nowadays, most micro-patterns are manufactured during flow line production. However, a conventional rotary chemical mechanical polishing (CMP) system has a limited throughput for the fabrication of large and flexible electronics. To overcome this problem, we propose a novel linear roll-CMP system for the planarization of large-area electronics. In this paper, we present a statistical analysis on the linear roll-CMP process of copper-clad laminate (CCL) to determine the impacts of process parameters on the material removal rate (MRR) and its non-uniformity (NU). In the linear roll-CMP process, process parameters such as the slurry flow rate, roll speed, table feed rate, and down force affect the MRR and NU. To determine the polishing characteristics of roll-CMP, we use Taguchi's orthogonal array L16 (44) for the experimental design and F-values obtained by the analysis of variance (ANOVA). We investigate the signal-to-noise (S/N) ratio to identify the prominent control parameters. The "higher is better" for the MRR and "lower is better" for the NU were selected for obtaining optimum CMP performance characteristics. The experimental and statistical results indicate that the down force and roll speed mainly affect the MRR and the down force and table feed rate determine the NU in the linear roll-CMP process. However, over 186.3 N of down force deteriorates the NU because of the bending of substrate. Roll speed has little relationship to the NU and the table feed rate does not impact on the MRR. This study provides information on the design parameter of roll-CMP machine and process optimization.