1 |
Park, J, H., Kinoshita, M., Yoshida, K., Matsumura, S. and Jeong, H. D., "Stability and Improvement of Polishing Pad in W CMP", J. Korean Inst. Electr. Electron. Mater. Eng., Vol. 20, No. 12, pp. 1027-1033, 2007.
과학기술학회마을
DOI
ScienceOn
|
2 |
Lee, S. H., Kim, H. J., Ahn, D. G. and Jeong, H. D., "A Study on Novel Conditioning for CMP", J. Kor. Soc. Precis. Eng., Vol. 16, No. 5, pp. 40-47, 1999.
과학기술학회마을
|
3 |
Lu, W. J., Jin, J., Ko, T. J. and Beak, D. K., "Study of Optimal Machining Conditions of Ultrasonic Machining By Taguchi's Method", Trans. Korean Soc. Mech. Eng. A, Vol. 37, No. 2, pp. 213-218, 2013.
과학기술학회마을
DOI
ScienceOn
|
4 |
Joo, S. B., Lee, H. L. and Jeong, H. D., "Analysis of Cu CMP according to The Variation of Corrosion Inhibitor Concentration", J. Korean Inst. Electr. Electron. Mater. Eng., Vol. 27, No. 1, pp. 121-124, 2008.
|
5 |
Tosun, N., Cogun, C. and Tosun, G., "A study on kerf and material removal rate in wire electrical discharge machining based on Taguchi method", J. Mater. Process. Technol., Vol. 152, pp. 316-322, 2004.
DOI
ScienceOn
|
6 |
Ikram, A., Mufti, N. A., Saleem, M. Q. and Khan, A. R., "Parametric optimization for surface roughness, kerf and MRR in wire electrical discharge machining (WEDM) using Taguchi design of experiment", J. Mater. Sci. Technol., Vol. 27, Issue 7, pp. 2133-2141, 2013.
|
7 |
Yang, W. Y., Yang, J. C. and Sung, I. H., "A Study of the Effects of Pressure Velocity and Fluid Viscosity in Abrasive Machining Process", J. Korean Soc. Tribol. Lubr. Eng., Vol. 27, No. 1, pp. 7-12, 2011.
과학기술학회마을
DOI
ScienceOn
|
8 |
Lee, H. S. and Jeong, H. D., "Chemical and mechanical balance in polishing of electric materials for defectfree surfaces", CIRP Ann. Manuf. Technol., Vol. 58, pp. 485-490, 2009.
DOI
ScienceOn
|
9 |
Lee, H. S. and Jeong, H. D., "A wafer-scale material removal rate profile model for copper chemical mechanical planarization", Int. J. Mach. Tool. Manufact., Vol. 51, pp. 395-403, 2011.
DOI
ScienceOn
|
10 |
Yang, W. Y. and Sung, I. H., "Study on Within-Wafer Non-uniformity Using Finite Element Method", J. Korean Soc. Tribol. Lubr. Eng., Vol. 28, No. 6, pp. 272-277, 2012.
과학기술학회마을
DOI
ScienceOn
|
11 |
Copperta, J., Rogers, C., Phillpossian, A. and Kaufman, F. B., "Characterizing Slurry Flow During CMP Using Laser Induced Fluorescence", Proceedings of CMP-MIC, pp. 307-314, 1997.
|
12 |
Kim, S. S., Development of linear roll CMP system for large area micropatterns, M.S, Thesis, Graduate School of Mechanical Engineering, Pusan National University, Republic of Korea, 2013.
|
13 |
Jeong, Y. S., Kim, H. J. and Jeong, H. D., "The Effect of Slurry Flow Rate and Temperature on CMP Characteristic", JKSPE, Vol. 21, No. 11, pp. 46-52, 2004.
과학기술학회마을
|
14 |
Chio, M. H., Kim, N. H., Kim, S. Y. and Chang, E. G., "A Study on DOE Method to Optimize the Process Parameters for Cu CMP", J. Korean Inst. Electr. Electron. Mater. Eng., Vol.18, pp. 24-29, 2005.
과학기술학회마을
DOI
|