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http://dx.doi.org/10.9725/kstle.2014.30.3.139

Statistical Analysis on Process Variables in Linear Roll-CMP  

Wang, Han (School of Mechanical Engineering, Pusan National University)
Lee, Hyunseop (Dept. of Mechanical Engineering, Tongmyong University)
Jeong, Haedo (School of Mechanical Engineering, Pusan National University)
Publication Information
Tribology and Lubricants / v.30, no.3, 2014 , pp. 139-145 More about this Journal
Abstract
Nowadays, most micro-patterns are manufactured during flow line production. However, a conventional rotary chemical mechanical polishing (CMP) system has a limited throughput for the fabrication of large and flexible electronics. To overcome this problem, we propose a novel linear roll-CMP system for the planarization of large-area electronics. In this paper, we present a statistical analysis on the linear roll-CMP process of copper-clad laminate (CCL) to determine the impacts of process parameters on the material removal rate (MRR) and its non-uniformity (NU). In the linear roll-CMP process, process parameters such as the slurry flow rate, roll speed, table feed rate, and down force affect the MRR and NU. To determine the polishing characteristics of roll-CMP, we use Taguchi's orthogonal array L16 (44) for the experimental design and F-values obtained by the analysis of variance (ANOVA). We investigate the signal-to-noise (S/N) ratio to identify the prominent control parameters. The "higher is better" for the MRR and "lower is better" for the NU were selected for obtaining optimum CMP performance characteristics. The experimental and statistical results indicate that the down force and roll speed mainly affect the MRR and the down force and table feed rate determine the NU in the linear roll-CMP process. However, over 186.3 N of down force deteriorates the NU because of the bending of substrate. Roll speed has little relationship to the NU and the table feed rate does not impact on the MRR. This study provides information on the design parameter of roll-CMP machine and process optimization.
Keywords
linear roll-CMP; taguchi method; material removal rate; non-uniformity;
Citations & Related Records
Times Cited By KSCI : 6  (Citation Analysis)
연도 인용수 순위
1 Park, J, H., Kinoshita, M., Yoshida, K., Matsumura, S. and Jeong, H. D., "Stability and Improvement of Polishing Pad in W CMP", J. Korean Inst. Electr. Electron. Mater. Eng., Vol. 20, No. 12, pp. 1027-1033, 2007.   과학기술학회마을   DOI   ScienceOn
2 Lee, S. H., Kim, H. J., Ahn, D. G. and Jeong, H. D., "A Study on Novel Conditioning for CMP", J. Kor. Soc. Precis. Eng., Vol. 16, No. 5, pp. 40-47, 1999.   과학기술학회마을
3 Lu, W. J., Jin, J., Ko, T. J. and Beak, D. K., "Study of Optimal Machining Conditions of Ultrasonic Machining By Taguchi's Method", Trans. Korean Soc. Mech. Eng. A, Vol. 37, No. 2, pp. 213-218, 2013.   과학기술학회마을   DOI   ScienceOn
4 Joo, S. B., Lee, H. L. and Jeong, H. D., "Analysis of Cu CMP according to The Variation of Corrosion Inhibitor Concentration", J. Korean Inst. Electr. Electron. Mater. Eng., Vol. 27, No. 1, pp. 121-124, 2008.
5 Tosun, N., Cogun, C. and Tosun, G., "A study on kerf and material removal rate in wire electrical discharge machining based on Taguchi method", J. Mater. Process. Technol., Vol. 152, pp. 316-322, 2004.   DOI   ScienceOn
6 Ikram, A., Mufti, N. A., Saleem, M. Q. and Khan, A. R., "Parametric optimization for surface roughness, kerf and MRR in wire electrical discharge machining (WEDM) using Taguchi design of experiment", J. Mater. Sci. Technol., Vol. 27, Issue 7, pp. 2133-2141, 2013.
7 Yang, W. Y., Yang, J. C. and Sung, I. H., "A Study of the Effects of Pressure Velocity and Fluid Viscosity in Abrasive Machining Process", J. Korean Soc. Tribol. Lubr. Eng., Vol. 27, No. 1, pp. 7-12, 2011.   과학기술학회마을   DOI   ScienceOn
8 Lee, H. S. and Jeong, H. D., "Chemical and mechanical balance in polishing of electric materials for defectfree surfaces", CIRP Ann. Manuf. Technol., Vol. 58, pp. 485-490, 2009.   DOI   ScienceOn
9 Lee, H. S. and Jeong, H. D., "A wafer-scale material removal rate profile model for copper chemical mechanical planarization", Int. J. Mach. Tool. Manufact., Vol. 51, pp. 395-403, 2011.   DOI   ScienceOn
10 Yang, W. Y. and Sung, I. H., "Study on Within-Wafer Non-uniformity Using Finite Element Method", J. Korean Soc. Tribol. Lubr. Eng., Vol. 28, No. 6, pp. 272-277, 2012.   과학기술학회마을   DOI   ScienceOn
11 Copperta, J., Rogers, C., Phillpossian, A. and Kaufman, F. B., "Characterizing Slurry Flow During CMP Using Laser Induced Fluorescence", Proceedings of CMP-MIC, pp. 307-314, 1997.
12 Kim, S. S., Development of linear roll CMP system for large area micropatterns, M.S, Thesis, Graduate School of Mechanical Engineering, Pusan National University, Republic of Korea, 2013.
13 Jeong, Y. S., Kim, H. J. and Jeong, H. D., "The Effect of Slurry Flow Rate and Temperature on CMP Characteristic", JKSPE, Vol. 21, No. 11, pp. 46-52, 2004.   과학기술학회마을
14 Chio, M. H., Kim, N. H., Kim, S. Y. and Chang, E. G., "A Study on DOE Method to Optimize the Process Parameters for Cu CMP", J. Korean Inst. Electr. Electron. Mater. Eng., Vol.18, pp. 24-29, 2005.   과학기술학회마을   DOI