• Proceedings of the Korean Society of Precision Engineering Conference
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• 1996.04a
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• pp.24-28
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• 1996

Mirror-like polishing system of hemisphericall high-speed precision bearing for digital VTR drum was developed. Mechamism of the polishing process was analyzed in the view point of polishing contact range and contact length between the tool and the workpiece surface. It was suggested that the two stage polishing process adoptiong the diamond grinding wheel and polishing tool instead of multistage lapping processes, which enables the mass production of the bearing by reduction of polishing time.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.225-229
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• 2004

Chemical Mechanical Polishing(CMP) process becomes one of the most important semiconductor processes. But the basic mechanism of CMP still does not established. Slurry fluid dynamics that there is a slurry film between a wafer and a pad and contact mechanics that a wafer and a pad contact directly are the two main studies for CMP. This paper based on the latter one, especially on the abrasion wear model. Material Removal Rate(MRR) is calculated using the trajectory length of every point on a wafer during the process time. Both the rotational velocity of a wafer and a pad and the wafer oscillation velocity which has omitted in other studies are considered. For the purpose of the verification of our simulation, we used the experimental results of S.H.Li et al. The simulation results show that the tendency of the calculated MRR using the relative velocity is very similar to the experimental results and that the oscillation effect on MRR at a real CMP condition is lower than 1.5%, which is higher than the relative velocity effect of wafer, and that the velocity factor. not the velocity itself, should be taken into consideration in the CMP wear model.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.7
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• pp.51-58
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• 2002

In this paper, the characteristics of silicon wafer surface which is textured by KOH anisotropic etching method and mechanical polishing are investigated from the viewpoint of stiction and friction. It was found that the characteristics of stiction and friction of each textured surface are dependent on the contact area characterized by surface parameters such as bearing length ratio and peak count. To find the mechanism of the variation of stiction and friction in textured surface, OTS SAM coated wafer was used. In this case, the variation of stiction and friction was diminished, Therefore, it is concluded that the reason of variation of stiction and friction on textured surface is mainly caused by capillary which in turn is affected by the surface topography

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.1
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• pp.94-101
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• 2014

Recently, in order to reduce the time required to replace an optical jumper cord, many researchers are using a field-installable connector and applying the ferrule polishing method, ferrule mechanical contact method, or ferrule fusion contact method. However, the process of arranging the length of the optical fiber, i.e., inserting the optical fiber into the ferrule by hand and checking its cross section, takes 60% of the time required for the entire process, which increases the overall cost. Therefore, in order to make this task more cost-effective, we will develop an automated inspection system with automatic cross-sectional arrangement of a field-installable connector. This system will be able to decrease the failure rate from 10% to 2% compared with the conventional method when cutting the optical fiber inserted into the ferrule. It will also improve the productivity by decreasing the test time by 28% compared with the conventional method. Our studies showed that it was possible to reduce the production costs and improve the quality of a field-installable connector, and we expect it to dominate the market.