• 한국공작기계학회논문집
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• 제12권5호
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• pp.59-66
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• 2003

This study suggests the new ultraprecision finishing techniques for micro die and mold parts using magnetic field-assisted polishing. Conventional magnetic abrasives have several disadvantages, which are missing of abrasive particle and inequal mixture between magnetic particle and abrasive particle. Therefore, bonded magnetic abrasive particles are fabricated by several method. For example, plasma melting and direct bonding. Carbonyl iron powder is used as magnetic particle there silicon carbide and alumina are abrasive particles. Developed magnetic abrasives are analyzed using SEM. Feasibility of magnetic abrasive and polishing performance of this magnetic abrasive particles also have been investigated. After polishing, surface roughness of workpiece is reduced from 85.4 ㎚ Ra to 9 ㎚ RA.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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• pp.1312-1315
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• 2004

Chemical Mechanical Polishing is referred to as a three body tribological system, because it includes two solids in relative motion and the slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason of not only the friction force but also material removal during polishing. The friction force generated by the abrasives was inspected with the change of abrasive size and concentration in this paper. The variation of coefficient of friction with abrasive concentration and size could result from the condition of contact and load balance between wafer and abrasives carried by pad asperity. The simulation was performed in this paper and compared with the result of experiment. The material removal rate also estimated with abrasive concentration and size increasement.

• 한국정밀공학회지
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• 제29권3호
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• pp.266-272
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• 2012

This paper has aims to share fundamental knowledge for magnetic abrasive polishing and to mainly introduce recent research results. In order to enhance a magnetic flux density for nonferrous materials, advanced magnetic abrasive polishing system which is called 2nd generation system was established by electro-magnet array table, and the effectiveness of the electromagnet array table was evaluated in real polishing experiments. To increase adhesiveness of the abrasives in high speed polishing, a silicone gel agent was proposed and carbon nanotube particles as new magnetic abrasives were applied in the magnetic abrasive polishing. In addition, a strategy for optimal step-over determination by heuristic algorithm was introduced for applying large size workpiece. Curved surfaces having a uniform radius were simulated and tested with installed electro-magnet array table.

• 한국생산제조학회지
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• 제19권2호
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• pp.184-190
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• 2010

Recently, the polishing process using magnetorheological fluids(MR fluids) has been focused as a new ultra-precision polishing technology for micro and optical parts such as aspheric lenses, etc. This method uses MR fluid as a polishing media which contains required micro abrasives. In the MR polishing process, the surface roughness and material removal rate of a workpiece are affected by the process parameters, such as the properties of used nonmagnetic abrasives(particle material, size, aspect ratio and density, etc.), rotating wheel speed, imposed magnetic flux density and feed rate, etc. The objective of this research is to predict MRR according to the polishing conditions based on the multiple regression analysis. Three polishing parameters such as wheel speed, feed rates and current value were optimized. For experimental works, an orthogonal array L27(313) was used based on DOE(Design of Experiments), and ANOVA(Analysis of Variance) was carried out. Finally, it was possible to recognize that the sequence of the factors affecting MRR correspond to feed rate, current and wheel speed, and to determine a combination of optimal polishing conditions.

• 대한기계학회논문집A
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• 제38권9호
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• pp.1013-1018
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• 2014

자기연마가공은 연마입자와 자성입자를 혼합한 공구의 유연성을 이용하여, 공작물 표면을 폴리싱하는 특수가공법이다. 기존 연구의 대부분은 가공 정밀도를 향상시키기 위해서 연마입자의 크기를 달리 하는 것에 관한 내용들이다. 그러나 자기연마 가공에서는 연마입자의 크기뿐만 아니라, 자성입자의 크기도 가공에 많은 영향을 미칠 것으로 판단되며 이에 대한 연구가 반드시 필요하다. 따라서 본 연구에서는 크기가 다른 자성입자들을 사용하여 자기연마가공의 효과를 평가하였다. 자성입자는 철분말을 사용하였으며, 직경이 평균 8, 78, $250{\mu}m$의 크기이다. 공작물의 표면거칠기 향상 정도를 비교하여 자성입자의 크기가 자기연마가공의 정밀도에 미치는 효과를 평가하였다. 자성입자의 크기는 표면거칠기의 향상에 많은 영향을 미치며, 직경이 $78{\mu}m$일 때 가장 좋은 표면거칠기의 향상을 나타내었다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.775-778
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• 2000

Magnetorheological Finishing(MRF) is a newly developed and recently commercialized for finishing optical components. The magnetorheological fluid consists of a water based suspension of carbonyl iron, nonmagnetic polishing abrasives, and small amounts of stabilizer. Theoretical analysis of MRF, based on Bingham lubrication theory, is illustrated and a correlation between surface shear stress on the workpiece and material removal is obtained.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.850-853
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• 2000

It is well-known that Electro-rheological(ER) fluid is a material(suspension) which shows the dramatic change of rheological properties under an electric field. Using these properties, the concept that variable apparent viscosity of ER fluid could be applicable to the polishing for micro parts was introduced. It was investigated that how it works for polishing and how it affects ER effect when abrasives were mixed with an ER fluid. Therefore a few structures for polishing using ER fluid was suggested and evaluated by means of experiments. In this paper, fundamental mechanism and experimental results are described.

• 한국정밀공학회지
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• 제18권11호
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• pp.168-173
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• 2001

The chemical mechanical polishing (CMP) is generally consisted of pad, slurry including abrasives and so on. However, there are some problems in a general CMP: defects, a high Cost of Consumable (CoC), an environmental problem. The slurry including abrasives especially gives rise to not only increase a CoC, but also prohibition from achieving an eco-process. This paper introduces an abrasive capsulation pad to achieve an eco-process decreasing abrasives used is CMP. The binder wth a water a water swelling and a water soluble characteristic is used for an auto-conditioning, and the $CeO_2$abrasive is selected for an abrasive capsulation pad. Comparing with a conventional CMP, an abrasive capsulation pad appears good characteristics in ILD CMP and is able to achieve an eco-process decreasing wasted slurry.

• 한국윤활학회:학술대회논문집
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• 한국윤활학회 1999년도 제30회 추계학술대회
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• pp.263-268
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• 1999

Langasite, a new piezoelectric material was polished by CMP(chemical mechanical polishing). To enhance the polishing rate, alumina abrasives were added to commercial ILD1300 slurry which contains silica abrasive. The effect of added alumina 0 the silica slurry on the polishing rate and damage of langasite was investigated, Experimental results show that the polishing rate and roughness increases with increasing added alumina particle size, Crystallinity of the langasite is also lowered by alumina addition.

• Tribology and Lubricants
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• 제34권6호
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• pp.209-216
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• 2018

Sapphire is a substrate material that is widely used in optical and electronic devices. However, the processing of sapphire into a substrate takes a long time owing to its high hardness and chemical inertness. In order to process the sapphire ingot into a substrate, ingot growth, multiwire sawing, lapping, and polishing are required. The lap grinding process using pellets is known as one of the ways to improve the efficiency of sapphire substrate processing. The lap grinding process ensures high processing efficiency while utilizing two-body abrasion, unlike the lapping process which utilizes three-body abrasion by particles. However, the lap grinding process has a high material removal rate (MRR), while its weakness is in obtaining the required surface roughness for the final polishing process. In this study, we examine the effects of free abrasives in lap grinding on the material removal characteristics of sapphire substrate. Before conducting the lap grinding experiments, it was confirmed that the addition of free abrasives changed the friction force through the pin-on-disk wear test. The MRR and roughness reduction rate are experimentally studied to verify the effects of free abrasive concentration on deionized water. The addition of free abrasives (colloidal silica) in the lap grinding process can improve surface roughness by three-body abrasion along with two-body abrasion by diamond grits.