• Journal of the Korean Society for Precision Engineering
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• v.17 no.3
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• pp.184-191
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• 2000

Properties of pad are investigated to find the relationship between the chemical mechanical polishing(CMP) results, such as material removal rate and within wafer non-uniformity(WIWNU), and its properties. Polishing pressure is considered as important factors to affect the results, so behavior of ordinary polymer is studied to define the polishing result affecting properties of pad. Experimental setup is devised to identify the behavior of pad and several different pads are used in chemical mechanical polishing experiments to verify the correlations between pad properties and polishing results. The results indicate that the viscoelastic properties of pad had relationships with the polishing results, and shows correlation between suggested properties of pad and polishing result.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.950-955
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• 2001

For the development of an ultra-precision CNC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We analyze and test the unit removal profiles for a ball type polishing tool. Using these results we calculate dwell time distributions and residual errors for a target removal shape. We use the polishing simulation method and feed rate calculation method for the dwell time calculation. We test corrective polishing algorithm with an optical glass. The target removal shape is a sine wave that has amplitude 0.3 micro meters. We find this polishing process has a machining resolution of nanometer order and is effective for sub-micrometer order machining. This result will be used for the software development of the CNC polishing system.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.783-786
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• 2000

For the development of a ultra-precision CMC polishing system including on-machine measurement system, we study a corrective polishing algorithm. We calculated unit removal profiles for various polishing tools and polishing tool positions. Using these results we simulate the corrective polishing process based on dwell time control. We calculate dwell time distributions and residual error of the polishing simulation method and the FFT calculation method. We got good dwell time distributions and small residual when we used the FFT calculation method. This results will be used for the optimization of corrective polishing process.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2001.04a
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• pp.327-331
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• 2001

In the process of optical parts machining, polishing has been applied. Traditional polishing process is suitable for spherical optical parts. But it is very difficult to apply traditional process for aspheric optical parts. Nowadays, as growing needs for aspherical optic parts, many researches have been conducted. In this study, we developed computer controlled polishing system which consists of three major parts of active pressure control for correcting polishing process, mechanical on-machine measurement for rough polishing, and optical on-machine measurement for finish polishing, respectively. In this paper, a systematic stretegy for correcting polishing process, pressure control scheme for polishing tool, and on-machine measurement methods for automated and precise polishing are suggested. The information about developed machine is also included.

• Journal of the Semiconductor & Display Technology
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• v.13 no.1
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• pp.13-17
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• 2014

Since the semiconductor manufacturing requires the silicon wafers with extraordinary degree of surface flatness, the surface polishing of wafers from ingot cutting is an important process for deciding surface quality of wafers. The present study introduces the development of wafer polishing equipment and, especially, the wafer polishing head that employs the forced self-driving of installed silicon wafer as well as the wax wafer mounting technique. A series of wafer polishing tests have been carried out to investigate the effects of self-driving function in wafer polishing head. The test results for wafer planarization showed that the LLS counts and SBIR of polished wafer surfaces were generally improved by adopting the self-driven polishing head in wafer polishing stations.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.123-123
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• 2000

Polishing a die that has free-form surfaces is a time-consuming and tedious job, and requires a considerable amount of high-precision skill. In order to reduce the polishing time and cope with the shortage of skilled workers, a user-friendly automatic polishing system was developed in this research. The polishing system with five degrees of freedom is able to keep the polishing tool normal to the die surface. The polishing system is controlled by a PC-NC controller. And, to easily onerate the developed polishing system, this stud)r developed a integrated program in the Windows environment. This program consists of 4 modules: polishing module, a graphic simulator, a polishing data generation module, and a teaching. Also, the automatic teaching system was developed to easily obtain a teaching data. The developed teaching system consists of a three dimensional joystick and a proximity sensor. In order to evaluate stability of the driving program and the leaching system, polishing experiments of the die of saddle shape were carried out.

• Design & Manufacturing
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• v.13 no.3
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• pp.12-18
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• 2019

Fluid jet polishing is a method of jetting a fluid to polish a concave or free-form surface. However, the fluid jet method is difficult to form a stable polishing spot because of the lack of concentration. In order to solve this problem, MR fluid jet polishing system using an abrasive mixed with an MR fluid whose viscosity changes according to the intensity of a magnetic field is under study. MR fluid jet polishing is not easy to formulate for precise optimal conditions and material removal due to numerous fluid compositions and process conditions. Therefore, in this paper, quantitative data on the factors that have significant influence on the machining conditions are presented using various simulations and the correlation studies are conducted. In order to verify applicability of the fabricated MR fluid jet polishing system by nozzle diameter, the flow pattern and velocity distribution of MR fluid and polishing slurry of MR fluid jet polishing were analyzed by flow analysis and shear stress due to magnetic field changes was analyzed. The MR fluid of the MR fluid jet polishing and the flow pattern and velocity distribution of the polishing slurry were analyzed according to the nozzle diameter and the effects of nozzle diameter on the polishing effect were discussed. The analysis showed that the maximum shear stress was 0.45 mm at the diameter of 0.5 mm, 0.73 mm at 1.0 mm, and 1.24 mm at 1.5 mm. The cross-sectional shape is symmetrical and smooth W-shape is generated, which is consistent with typical fluid spray polishing result. Therefore, it was confirmed that the high-quality surface polishing process can be stably performed using the developed system.

• Transactions of Materials Processing
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• v.18 no.2
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• pp.172-176
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• 2009

In this paper, new aspherical surface polishing mechanism is suggested to polish aspherical glass lens mold by both airbag polishing tool and reverse-rotational eccentric motion. Up to now, conventional aspherical lens polishing method by the small tool polishing uses the aspherical surface profile and the trajectory of the polishing tool is also controlled. However, full contact concept by airbag polishing tool and no position control make the easy polishing setup and does not need aspherical design profile. An aspherical lens polishing machine was made for this study and a tool mark removal experiment fur the fine-grounded lens mold was successfully performed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.14 no.2
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• pp.14-20
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• 2005

This paper describes a dwell time calculation algorithm for polishing tool path generation in the small toot polishing process of the axis-symmetrical lens. Generally dwell time control in the polishing machines means that small polishing tool stays for a dwell time at the specific surface position to get the expected polishing depth. Polishing depth distribution on an aspherical lens surface consists of the superposition of the local polishing depth at the each dwell position. Therefore, tool path generation needs each dwell time together with tool positioning data during the polishing tool movements on the aspherical lens surface. The linear algebraic equation of removal depth removal matrix and dwell time is formulated. Parametric effects such as the dwell d interval are simulated to validate the dwell time calculation algorithm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.2
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• pp.80-86
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• 2000

Although polishing process take 30-50% of whole process of manufacturing die and mold it has not been fully automat-ed yet. Considering current trend of manufacturing it is necessary to study on polishing automation. To accomplish automation reliable database must be developed. For developing it polishing mechanism should be defined and a general empirical formula that can be applied widely should be created. In this paper it is found that polishing process must be separated into 2 process such as removing cusp and getting fine surface process and the polishing parameter which is com-posed of major machining parameters and normalization of data can be applied efficiently in making reliable database.