• 제목/요약/키워드: Platinum etching

검색결과 26건 처리시간 0.019초

유도 결합 플라즈마를 이용한 백금 박막의 건식 식각시 가스 첨가 효과 (Effects of $O_2$ Gas Addition to Dry Etching of Platinum. Thin Film by Inductively Coupled Plasma)

  • 김남훈;김창일;권광호;장의구
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제48권6호
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    • pp.451-455
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    • 1999
  • The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and higher etch slope as about 60$^{\circ}$was observed and the selectivity to oxide increased to 2.4 without decreasing of the etch rate $1500{\AA}$/min. XPS surface analysis proved that a only little $O_2$ gas removes the Pt-CI compounds as residues on the etched surface.

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Pt 박막의 SF$_6$/Ar과 C1$_2$/Ar 플라즈마 가스와의 표면반응에 관한 연구 (Study on the Surface Reaction of Pt Thin Film with SF$_6$/Ar and Cl$_2$/Ar Plasma Gases)

  • 김상훈;주섭열;안진호
    • 마이크로전자및패키징학회지
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    • 제8권3호
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    • pp.63-67
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    • 2001
  • 최근가지 Pt박막의 식각은 Cl 계열의 가스에 의한 물리적인 스퍼터링 기구에 초점을 맞추어 연구가 진행되어왔으며 F 계열의 가스에 의한 식각 특성은 상당히 미진하였다. 본 연구에서는 ECR(electron cyclotron resonance) 플라즈마 식각 장비를 이용하여 $Cl_2$/Ar 가스와 $SF_{6}$/Ar 가스를 사용하여 Pt 박막의 식각 특성을 연구하였고, $SF_{6}$/Ar 가스의 경우 Pt 박막과 반응하여 휘발성의 식각 부산물을 형성시킬 수 있음을 확인하였다. 그리고 휘발성있는 platinum fluoride 화합물의 형성에 의해 식각률, 식각 측면형상과 표면 거칠기 특성개선도 얻을 수 있었다.

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유도 결합 BCl$_{3}$/Cl$_{2}$ 플라즈마내에서 Pt 박막의 건식 식각 (Dry etching of pt thin film in inductive coupled BCl$_{3}$/Cl$_{2}$ plasmas)

  • 김남훈;김창일;권광호;장의구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 1998년도 하계종합학술대회논문집
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    • pp.375-378
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    • 1998
  • Platinum thin film which hardly form volatile compounds with any reactive gas at normal process temperature was etched in inductive coupled BCl$_{3}$/Cl$_{2}$ plasma. The etch rate of platinum thin film increased with increasing Cl$_{2}$/(Cl$_{2}$ + BCl$_{3}$) ratio. That reasoned increasing of ion current density.

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$Cl_2/Ar$ 유도 결합 플라즈마에서 Pt 박막 식각시 $N_2$ 가스 첨가 효과 (The Effect Of Additive $N_2$ Gas In Pt Film Etching Using Inductively Coupled $Cl_2/Ar$ Plasmas)

  • 류재흥;김남훈;장의구;김창일
    • 대한전자공학회논문지SD
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    • 제37권7호
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    • pp.1-6
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    • 2000
  • 본 연구에서는 Pt 박막을 식각하기 이하여 기존에 최적화된 가스 혼합비인 $Cl_2$(10)Ar (90)에 $N_2$ 가스를 첨가하기 실험하였다. $Cl_2$(10)/Ar(90)의 가스 혼합비에 20% $N_2$가스 첨가시, $SiO_2$ 마스크에 대한 Pt 박막의 선택비 향상으로 70$^{\circ}$ 이상의 식각 프로파일을 얻을 수 있었다. 이는 $SiO_2$ 마스크 위에 Si-N, Si-O-N과 같은 차단막 생성을 통한 결과로 확인 되어졌다. $SiO_2$ 마스크에 대한 Pt 박막의 최대 선택비와 식각률은 각각 1.71과 4125 ${\AA}$/min 이다. 이는 Pt-N, Pt-N-Cl과 같은 휘발성 화합물의 생성을 통한 결과로 판단된다.

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유도 결합 플라즈마를 이용한 백금 박막의 식각시 $O_2$ 가스 첨가 효과 (Effects of $O_2$ Gas Addition to Etching of Platinum Thin Film by Inductively Coupled Plasmas)

  • 김남훈;김창일;권광호;장의구
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 추계학술대회 논문집 학회본부 C
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    • pp.770-772
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    • 1998
  • The highest etch rate of Pt film was obtained at 10% $Cl_2$/90% Ar gas mixing ratio in our previous investigation. However, the problems such as the etch residues(fence) remained on the pattern sidewall, low selectivity to oxide as mask and low etch slope were presented. In this paper, the etching by additive $O_2$ gas to 10% $Cl_2$/90% Ar gas base was examined. As a result, the fence-free pattern and high etch slope was observed and the selectivity to oxide increased without decreasing of the etch rate. And the reasons for this phenomenon was investigated by XPS(x-ray photoelectron spectroscopy) surface analysis and plasma characteristic.

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초소형 연소기를 위한 촉매 합성, 담지방법 및 담지체 (Catalyst preparations, coating methods, and supports for micro combustor)

  • 진정근;김충기;권세진
    • 한국연소학회:학술대회논문집
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    • 한국연소학회 2006년도 제33회 KOSCO SYMPOSIUM 논문집
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    • pp.235-241
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    • 2006
  • Catalytic combustion is one of the suitable methods for micro power source due to high energy density and no flame quenching. Catalyst loading in the micro structured combustion chamber is one of the most important issues in the development of micro catalytic combustors. In this research, to coat catalyst on the chamber wall, two methods were investigated. First, $Al_2O_3$ was selected as a support of Pt and $Pt/Al_2O_3$ was synthesized through the alumina sol-gel procedure. To improve the coating thickness and adhesion between catalyst and substrate, heat resistant and water solvable organic-inorganic hybrid binder was used. Porous silicon was also investigated as a catalyst support for platinum. Through the parametric studies of current density and etching time, fabrication process of $1{\sim}2{\mu}m$ of diameter and about $25{\mu}m$ depth pores was confirmed. Coated substrates were test in the micro channel combustor which was fabricated by the wet etching and machining of SUS 304. Using $Pt/Al_2O_3$ coated substrate and Pt coated porous silicon substrate, conversion rate of fuel was over 95% for $H_2$/Air premixed gas.

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초소형 연소기를 위한 촉매 합성, 담지방법 및 담지체 (Catalyst Preparations, Coating Methods, and Supports for Micro Combustor)

  • 진정근;김충기;이성호;권세진
    • 한국연소학회지
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    • 제11권2호
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    • pp.7-14
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    • 2006
  • Catalytic combustion is one of the suitable methods for micro power source due to high energy density and it can be applied to micro structured chamber without consideration of quenching since it is flameless combustion. Catalyst loading in the micro structured combustion chamber is one of the most important issues in the development of micro catalytic combustors. In this research, to coat catalyst on the chamber wall, two methods were investigated. First, $Al_2O_3$ was selected as a support of Pt and $Pt/Al_2O_3$ was synthesized through the alumina sol-gel procedure. To improve the coating thickness and adhesion between catalyst and substrate, heat resistant and water solvable organic-inorganic hybrid binder was used. Porous silicon was also investigated as a catalyst support for platinum. Through the parametric studies of current density and etching time, fabrication process of $1{\sim}2{\mu}m$ of diameter and about $25{\mu}m$ depth pores was confirmed. Coated substrates were test in the micro channel combustor which was fabricated by the wet etching and machining of SUS 304. Using $Pt/Al_2O_3$ coated substrate and Pt coated porous silicon substrate, conversion rate of fuel was over 95 % for $H_2/Air$ premixed gas.

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Cl$_2$/Ar 가스 플라즈마에 $O_2$ 첨가에 따른 Pt 식각 특성 연구 (The Study on the Etching Characteristics of Pt Thin Film by $O_2$ Addition to $_2$/Ar Gas Plasma)

  • 김창일;권광호
    • 전자공학회논문지D
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    • 제36D권5호
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    • pp.29-35
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    • 1999
  • Pt박막의 ICP 식각을 위한 Cl\sub 2 \/Ar 가스 플라즈마에 O\sub 2\ 가스를 첨가하여 Pt 식각 메카니즘을 XPS와 QMS로 조사하였다. 또한 single Langmuir probe를 사용하여 이온전류밀도를 Ar/Cl\sub 2 \/O\sub 2\ 가스 플라즈마에서 측정하였다. O\sub 2\가스 첨가비가 증가할수록 Cl과 Ar species가 급격하게 감소하고 이온전류밀도 역시 감소함을 QMS와 single Langmuir probe로 확인하였다. Pt 식각율의 감소는 O\sub 2\가스 첨가비가 증가할수록 반응성 species와 이온전류밀도의 감소에 기인함을 의미한다. 150 nm/min의 치대 식각율과 2.5의 산화막식각 선택비가 50 sccm의 Ar/Cl\sub 2 \/O\sub 2\ 가수 유량, 600 W의 RF 전력, 125 V의 dc 바이어스 전압 및 10mTorr의 반응로 압력에서 얻었다.

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마이크로머시닝 기술을 이용한 3차원 마이크로 챔버형 글루코스 센서의 개발 (Development of Three-dimensional Chamber-type Glucose Sensor Using Micromachining Technology)

  • 김성호;김창교
    • 한국산학기술학회논문지
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    • 제6권1호
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    • pp.24-28
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    • 2005
  • 3차원 실리콘 챔버를 갖는 $15.8{\times}15.8 mm^2$크기의 칩을 바이오 센서용으로 마이크로머시닝 기술을 이용하여 개발하였다. 비등방성 식각기술을 이용하여 (100)방향의 p형 실리콘 웨이퍼위에 마이크로 챔버를 형성하였다. 마이크로 챔버를 갖는 웨이퍼와 백금전극이 도포된 Pyrex 유리를 DGF-48S 접착제를 이용하여 접합하였다. 백금전극과 Ag/AgCl 기준전극에 의한 전기화학적 특성을 조사하였다.

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태양전지 전력을 이용한 316L강의 전해연마 폐액 중 중금속 성분의 회수 (Recovery of Heavy-Metallic Components from a Waste Electro-polishing Solution of 316L Steel by the Solar Cell Electricity)

  • 김기호;장정목
    • 한국표면공학회지
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    • 제42권1호
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    • pp.53-57
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    • 2009
  • Recovery of heavy-metallic component from a waste solution of factory was undertaken by the solar cell electricity. The solution was obtained from an electrolytic etching process of 316L stainless steel. The electrolysis of the solution for recovery of heavy metallic components was made with platinum plated titanium mesh anode and copper plate cathode. Analysis for the solution and electro-winned materials were made by EDS, XRD and SEM. Iron, chromium, and sulfur components were recovered on the cathode from the solution. Result of EDS analysis for the electro-winned materials revealed that some metal oxide were contained in the recovered material. The recovered materials were expected to have metallic form only by the electrolysis, but metal compounds were contained because of weak solar cell power. Nickel and manganese component in the solution doesn't recovered by this electrolysis process, but they made a sludge with phosphoric acid in the solution.