• Journal of Power System Engineering
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• v.4 no.2
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• pp.31-39
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• 2000

Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.

• Journal of the Korean institute of surface engineering
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• v.25 no.4
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• pp.189-206
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• 1992

The effect of activation and electroless nickel plating conditions on contact properties was investi-gated for selective electroless nickel plating of Si wafers in order to obtain an optimum condition of con-tact hole filling. According to RCA prosess, p-type silicon (100) surface was cleaned out and activated. The effects of temperature, DMAB concentration, time, and strirring were investigated for activation of p-type Si(100) surface. The optimal activation condition was 0.2M HF, 1mM PdCl2, 2mM EDTA,$ 70^{\circ}C$, and 90sec under ultrasonic vibration. In electroless nickel plating, the effect of temperature, DMAB concentra-tion, pH, and plating time were studied. The optimal plating condition found was 0.10M NiSO4.H2O, 0.11M Citrate, pH 6.8, $60^{\circ}C$, 30minutes. The contact resistance of films was comparatively low. It took 30minutes to obtain 1$\mu\textrm{m}$ thick film with 8mM DMAB concentration. The film surface roughness was improved with decreasing temperature and decreasing pH of the plating solution. The best quality of the film was obtained at the condition of temperature $60^{\circ}C$ and pH 6.0. The micro-vickers hardness of film was about 800Hv. Plating rate of nickel on the hole pattern was slower than that of nickel on the line pattern.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.913-921
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• 2009

In this study, supercritical nano plating was performed to observe its effect on materials. Using supercritical carbon dioxide as a solvent, we observed how different pressures and temperatures of the supercritical fluid affected the process and its outcome. The plating current increases as pressure increases from 8 MPa to 16 MPa, but it decreases after that. Similarly, the plating current increases as temperature is increased from $35^{\circ}C$ to $45^{\circ}C$, but the current decreases after that. Also, the thickness of the wet electrolyte plating is about $35\sim50{\mu}m$, while the thickness of the plating done using supercritical fluid is about $20\sim25{\mu}m$. At the results, It to it is considered that supercritical nano plating enable to form more thin and stable plating than wet electroplating methods. Also both of the electroplating methods could be affected plating quality by surface condition, and the supercritical nano plating has been confirmed to product more uniform plating surface than wet electroplating.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.112-119
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• 2009

The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

• Journal of the Korean institute of surface engineering
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• v.22 no.1
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• pp.43-51
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• 1989

The characteristion of composite electroless Nikel palting on the condition of adding 3kinds ceramic dispersives, Al2O3, Si3O4 and artificial diamond powder were studied. Decreasing solution temperature for composite plating was required to depress the spontaneous decomposition caused by dispersive including enlargement of reaction surface. The rate of composite plating was faster than that of general electroless-Nickel plating without dispersive. this increasing tendency of plating rate was remarkable for the active catalysis, like diamond powder.

• The korean journal of orthodontics
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• v.23 no.4 s.43
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• pp.671-691
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• 1993

To estimate the possibility in the application of TiN ion-plating to the orthodontic appliance, this study investigated frictional force and frictional coefficient between non-ionplated and TiN ion-plated to the orthodontic appliance. The obtained results were as follows : 1. For each group, the frictional force between metal bracket and arch wire in the wet condition was exhibited lower than that in the dry condition. 2. In the dry condition, the frictional force was lowest with fourth group, and it increased in the order of the 3rd, 1st, and 2nd group. Same situation happened in the wet condition. 3. Experimental results using ceramic & plastic bracket showed that group B was lower than group A, and group D was similar to group C. 4. The surface texture after experiment showed that the scratch due to a friction with bracket was observed in an arch wire of dry contition. Also the surface of bracket was rougher than before. 5. We observed that a specimen surface processed with the TiN ion plating was smoother than that of without the TiN ion plating. 6. The surface texture of a metal bracket and an arch wire in the wet condition was observed smoother than that in the dry condition. 7. In the dry condition, the friction coefficient of each specimen was very similar to each other, but in the wet condition, the friction coefficient of specimen processed with the TiN ion plating showed lower values.

• Journal of the Korean institute of surface engineering
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• v.32 no.3
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• pp.331-335
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• 1999

Electroless plating nickel has superior mechanical property to electroplated nickel. Furthermore nickel can be coated on nonconducting substrate. In this research, electroless plating of nickel were conducted in different bath condition to find optimum conditions of electroless nickel plating for MEMS applications. The selectivity of activation method on several substrates was investigated. The effects of nickel concentration, reducing agent concentration and inhibitor on deposition rate were investigated. The effect of pH on deposition rate and content of phosphorous in deposited nickel was also investigated.

• Journal of the Korean institute of surface engineering
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• v.47 no.3
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• pp.128-136
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• 2014

In the present study, we successfully developed an eco-friendly chemical etching solution and proper condition for plating on ABS material. The mechanism of forming Ni plating layer on ABS substrate is known as following. In general, the etching solution used for the etching process is a solution of chromic acid and sulfuric acid. The etching solution is given to the surface resulting in elution of butadiene group, so-called anchor effect. Such a rough surface can easily adsorb catalyst resulting in the increase of adhesion between ABS substrate and Ni plating layer. However a use of chromic acid is harmful to environment. It is, therefore, essential to develop a new alternative solution. In the present study, we proposed an eco-friendly etching solution composed of potassium permanganate, sulfuric acid and phosphoric acid. This solution was testified to observe the surface microstructure and the pore size of electrical Ni plating layer, and the adhesive correlation between deposited layers fabricated by electro Ni plating was confirmed. The result of the present study, the newly developed, eco-friendly etching solution, which is a mixture of potassium permanganate 25 g/L, sulfuric acid 650ml/L and phosphoric acid 250ml/L, has a similar etching effect and adhesion property, compared with the commercially used chromium acid solution in the condition at $70^{\circ}C$ for 5 min.

• Journal of Power System Engineering
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• v.8 no.3
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• pp.36-43
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• 2004

The effect of bath composition, plating condition and plating rate on the magnetic property of electroless Co-Cu-P deposits were investigated. With increasing $CuCl_2$ concentration in the bath, plating rate increased, while the Br value of deposit decreased sharply. Deposited surface were inferiority by the increase pH above 10.5, bath temperature higher than $80^{\circ}C$. Plating reaction had been ceased by the increase of pH above 11, bath temperature higher than $90^{\circ}C$ and under $40^{\circ}C$. The Br value of deposit was uniform with various concentration of complexing agent(sodium citrate) in the bath. The Br value of deposit was almost equal to that found by the addition of stabilizer (thiourea) and accelerator(NaF). The Br value of deposit was uniform in plating time(20min) and heat treatment temperature(below $200^{\circ}C$), and were confirmed to have adequate bath stability for practical use.

• Applied Chemistry for Engineering
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• v.10 no.1
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• pp.67-72
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• 1999

Optimal pretreatment processes for metal plating on engineering plastics, especially on Nylon-inorganic filler alloy was studied. For Nylon-inorganic filler alloy, adhesion strength between resin surface and metal could be improved by just etching process that eliminate amorphous layer. In the SEM picture and surface roughness measurement, etching treatment was found to make enabled the surface condition very rough and the adhesion strength good. It was also found that the surface condition of plated article and its adhesion strength partly depended upon molding condition of Nylon-inorganic filler alloy. EDS, peaks showed that what kinds of and how much of the metal elements remained on the resin surface after pretreatment processes. Cr did not affect on adsorption of Sn and Pd remarkably.