• Journal of Powder Materials
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• v.15 no.3
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• pp.234-238
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• 2008

Al-Cu alloy nano powders have been produced by the electrical explosion of Cu-plated Al wire. The porous nano particles were prepared by leaching for Al-Cu alloy nano powders in 40wt% NaOH aqueous solution. The surface area of leached powder for 5 hours was 4 times larger than that of original alloy nano powder. It is demonstrated that porous nano particles could be obtained by selective leaching of alloy nano powder. It is expected that porous Cu nano powders can be applied for catalyst of SRM (steam reforming methanol).

• Journal of Powder Materials
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• v.15 no.4
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• pp.308-313
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• 2008

Al-Ni alloy nano powders have been produced by the electrical explosion of Ni-plated Al wire. The porous nano particles were prepared by leaching for Al-Ni alloy nano powders in 20wt% NaOH aqueous solution. The structural properties of leached porous nano powder were investigated by nitrogen physisorption, X-ray diffraction (XRD) and transmission Microscope (TEM). The surface areas of the leached powders were increased with amounts of AI in alloys. The pore size distributions of these powders were exhibited maxima at range of pore diameters 3.0 to 3.5 nm from the desorption isotherm. The maximum values of those were decreased with amounts of Al in alloys.

• Journal of Powder Materials
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• v.14 no.2 s.61
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• pp.108-115
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• 2007

Cu-Ni-P alloy nano powders were fabricated by the electrical explosion of electroless Ni plated Cu wires. The effect of applied voltage on the explosion was examined by applying pulse voltage of 6 and 28 kV, The estimated overheating factor, K, were 1.3 for 6 kV and 2.2 for 28 kV. The powders produced with pulse voltage of 6 kV were composed of Cu-rich solid solution, Ni-rich solid solution, and $Ni_3P$ phase. While, those produced with 28 kV were complete Cu-Ni-P solid solution and small amount of $Ni_3P$ phase. The initial P content of 6.5 at.% was reduced to 2-3 at.% during explosion due to its high vapour pressure.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.11
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• pp.7773-7780
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• 2015

Analysis of existing kettle and its heating system has been the topic for localization technology development. Test pieces are made, polished and etched for existing kettle analysis. Surface of test pieces is observed using SEM, the kettle is verified to be made by deep drawing process from Ferrite-Perlite material. The kettle is also identified to be plated $16{\sim}49{\mu}m$ of thickness with Nickel(16%). Also heat transfer characteristics based on hot wire arrangement is investigated and optimal hot wire system is developed. Developed control system detects overheating and stops the whole system on the long operating time. Developed kettle takes the performance evaluation test for volume expansion and satisfied for standard 'KS G3602'.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.170-174
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• 2024

In this study, we report the microstructural evolution and shear strength of an Sn-Sb alloy, used for die attach process as a solder layer of backside metal (BSM). The Sb content in the binary system was less than 1 at%. A chip with the Sn-Sb BSM was attached to a Ag plated Cu lead frame. The microstructure evolution was investigated after die bonding at 330 ℃, die bonding and isothermal heat treatment at 330 ℃ for 5 min and wire bonding at 260 ℃, respectively. At the interface between the chip and lead frame, Ni₃Sn₄ and Ag₃Sn intermetallic compounds (IMCs) layers and pure Sn regions were confirmed after die bonding. When the isothermal heat treatment is conducted, pure Sn regions disappear at the interface because the Sn is consumed to form Ni₃Sn₄ and Ag₃Sn IMCs. After the wire bonding process, the interface is composed of Ni₃Sn₄, Ag₃Sn and (Ag,Cu)₃Sn IMCs. The Sn-Sb BSM had a high maximum shear strength of 78.2 MPa, which is higher than the required specification of 6.2 MPa. In addition, it showed good wetting flow.

• Proceedings of the KSME Conference
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• 2000.11a
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• pp.481-485
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• 2000

A new type of compliant press-fit pin has been developed and evaluated for use packaging of electronic telecommunications equipments. Main requirements for design are defined the upper limit of pin insertion force and the lower limit of pin retention force. Upper limit of pin insertion force is set to protect the copper plate of the inner PTH wall. Lower limit of pin retention force is set to satisfy a wire-wrapping specification. Results are represented by insertion force and retention force variations according to the front angle, rear angle and material, etc.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.4
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• pp.65-70
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• 2020

While the demand for robots in the manufacturing industry has dramatically increased, the industrial robots' functionality is mainly determined by the effector attached to the end of their arms. They need a flexible gripping system that can act as a human hand and easily grasp a variety of objects, which requires resilient sensors. This study clarifies the electrical output characteristics of elastic tactile sensors according to contact terminals because the output characteristics of the tactile sensors vary greatly, depending on the contact material and the method of contact with the conductive wire. Our research considers the Three Roll Mill and Paste Mixer as the dispersion medium, and a nickel- and gold-plated brass electrode as the contact terminal.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.5
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• pp.495-501
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• 2011

We present an experimental study of electrical discharge in nanoscale gaps. The discharge occurred between a cathode made of sharpened Pt-Ir wire and a gold-plated anode. Electric discharges were detected for electric potentials from 10 V to 80 V, and their gaps ranged from 50 nm to 800 nm. The spark signals indirectly showed spark phenomena such as discharges or shortages in the system. The sparks and discharges strongly depended on the electric potential (voltage) and the radius of the tips. For small gaps, the electrical discharge was random and strongly depended on the radius of the cathode tips.

• Korean Journal of Materials Research
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• v.11 no.10
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• pp.820-832
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• 2001

In order to obtain the basic data on the optimum conditions of electroforming process for fabricating the micro wiring pattern for plate type micro- motor core, characteristics of plating bath and properties of deposits were studied with various copper plating baths which contain sulfate, fluoborate, pyrophosphate and cyanide salt, respectively. Cathodic polarization, throwing power, internal stress, texture and surface morphology of deposits were observed. Throwing power of plating solution is deeply related to the polarization curves and the values are in the range of +20∼20%. The order of values ate as follows- pyrophosphate, cyanide, sulfate and fluoborate bath. Internal stresses of deposits are tensile in all of the copper plating bath. Thickness of the deposits plated at the center of holes has the highest value in the pyrophosphate bath and K factor, ratio of height and width of deposit, is 1.44. It was confirmed that the pyrophosphate bath was the best one for the electroforming of wire pattern.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.6
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• pp.80-87
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• 2018

In recent years, due to the spread of various renewable energy power sources and the pursuit of high efficiency and low-power consumption, not only trends in the electric power industry but also the consumption, control methods, and characteristics are diversified. However, in this diversified electric power industry, the fuse (which is the core part responsible for safety) has not developed significantly in classical operation mode, and thus, fires continue to occur. In this paper, the effects of low melting-point metal plating and high melting-point metal plating on operating characteristics and IT curve movement of the fuse are investigated in a cartridge fuse, which is a classic fuse manufacturing method. The effects of plating on the thickness of the fuse are investigated, and various operating characteristics of the fuse are implemented. In addition, it is suggested that the plating of the low melting-point metal moves the rated current line of the fuse to a low rating, and moves operating characteristics to characteristics of delay operation. It is possible to design various operating characteristics using this characteristic.