• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 제6회 학술대회 논문집 일렉트렛트 및 응용기술연구회
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• pp.18-22
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• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using thin plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles generated are about $3^{\circ}$ by the rubbing alignment method on thin plastic substrates, However, the pretilt angle are at about $1.7^{\circ}$ lower on the glass substrate than on thin plastic substrate. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on glass.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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• pp.1406-1408
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• 2006

Plastic substrate for flexible TFT LCD is developed. The gas barrier, optical properties and conductivity in the substrate is improved through depositing silicon oxide/nitride layer and ITO layer, coating polymer layer on plastic film by sputtering process and wet coating process. The whole production process of the plastic substrate is guaranteed the productivity by using roll to roll process.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 춘계학술대회 논문집 디스플레이 광소자 분야
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• pp.164-168
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• 2005

We report high performance poly (3-hexylthiophene) organic field-effect transistors fabricated on a plastic substrate. The polymer active channel layer was directly printed by the rubber stamp printing method with a pre-patterned elastomer stamp. As a result. organic transistors having average field-effect mobility of 0.079 $cm^2/Vs$ and on/off ratio of $10^4{\sim}10^5$ were realized on a plastic substrate. Also, through the investigation of the molecular ordering of rubber-stamp-printed poly (3-hexylthiophene) films using synchrotron grazing-incidence X-ray diffraction measurements, the films were found to have edge-on structure which is favorable in realizing high performance organic transistors.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2000년도 제1회 학술대회 논문집
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• pp.39-40
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• 2000

STN LCDs on Plastic Film substrates for mobile communication devices have been researched and developed at KETI in KOREA. The Plastic Film substrate is so weak to heat and pressure that its fabrication process is limited to $110^{\circ}C(Tg)$. In order to maintain uniform pressure on Plastic Film substrate we used newly designed jig and fabrication process. Electro-optical characteristics are better than or equivalent to those of typical glass LCD though it is thinner, lighter-weight, and more robust than glass LCD.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.634-638
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• 2003

We reported the a-Si crystallization using a XeCl excimer laser annealing on the plastic substrate. The poly-Si film is able to grow in the low temperature and light substrate like a plastic. For the preparation of sample, substrate is cleaned by organic liquids. The film of $CeO_{2}$ layer as the buffer layer was grown by sputtering methods. After a-Si film deposition using ICPCVD, the film was crystallized by XeCl excimer laser. In this paper, we present the crystallization properties of a-Si on the plastic substrate

• 한국정밀공학회지
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• 제34권3호
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• pp.199-203
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• 2017

Hot embossing techniques are used to engrave patterns on plastic substrates. Roll based hot embossing uses a heated roll for a continuous process. A heated roll with relief patterns is impressed on a preheated plastic substrate. Then, the substrate is cooled down quickly to prevent thermal shrinkage. The roll speed is normally very slow to ensure substrate temperature increase up to the glass transition temperature. In this paper, we propose a noncontact preheating technique using focused infrared light. The infrared light is focused as a line beam on a plastic substrate using an elliptical mirror just before entering the hot embossing roll. The mid range infrared light efficiently raises the substrate temperature. For preliminary tests, substrate deformation and temperature changes were monitored according to substrate speed. The experiments show that the proposed technique is a good possibility for high speed hot embossing.

• 한국재료학회지
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• 제14권5호
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• pp.343-347
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• 2004

We investigated the growth feasibility of polycrystalline Si film on mica substrate for the transfer of the layer to a plastic substrate. The annealing temperature was limited up to $600^{\circ}C$ because of crack development in the mica substrate. Amorphous Si film was deposited on mica substrate by PECVD and was crystallized by furnace annealing. During the annealing, bubbles were formed at the Si/mica interface. The bubble formation was avoided by the Ar-plasma treatment before amorphous Si deposition. A uniform and clean polycrystalline Si film was obtained by coating $NiCl_2$ on the amorphous Si film and annealing at $500^{\circ}C$ for 10 h. The conventional Si lithography was possible on the mica substrate and the devices fabricated on the substrate could be transferred to a plastic substrate.

• Tribology and Lubricants
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• 제37권4호
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• pp.144-150
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• 2021

The most cost-effective method of reducing abrasive wear in mechanical parts is increasing their hardness with thin hard coatings. In practice, the composite hardness of the coated substrate is more important than that of the substrate or coating. After full unloading of the load applied to an indenter, its indentation hardness evaluated based on the dent created on the test piece was almost dependent on plastic deformation of the substrate. Following the first part of this study, which proposes a new Brinell hardness test method for a coated surface, the remainder of the study is focused on practical application of the method. Indentation analyses of a rigid sphere and elastic-perfect plastic materials were performed using finite element analysis software. The maximum principal stress and plastic strain distributions as well as the dent shapes according to the substrate yield stress and coating thickness were compared. The substrate yield stress had a significant effect on the dent size, which in turn determines the Brinell hardness. In particular, plastic deformation of the substrate produced dents regardless of the state of the coating layer. The hardness increase by coating behaved differently depending on the substrate yield stress, coating thickness, and indentation load. These results are expected to be useful when evaluating the composite hardness values of various coated friction surfaces.

• 한국전기전자재료학회논문지
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• 제17권8호
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• pp.866-870
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• 2004

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with rubbing alignment method on polyimide surfaces using plastic substrates. It was found that monodomain alignment of NLC is obtained with rubbing alignment method on polyimide surfaces using thin plastic substrates. The NLC pretilt angles on thin plastic substrates generated higher than that on glass substrate. Also, EO characteristics of the TN-LCD with a rubbed PI surface based on polymer substrate are almost the same as that of the TN-LCD with a rubbed PI surface based on glass. However, the transmittances of the TN-LCD with a rubbed PI surface based on polymer is less than that with a rubbed PI surface based on g1ass.

• 한국전기전자재료학회논문지
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• 제26권9호
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• pp.682-685
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• 2013

We have fabricated blue phosphorescent organic light-emitting devices (OLEDs) on a plastic substrate. The solution coated poly (9-vinylcarbazole) (PVK) host doped with Bis (3,5-difluoro-2-(2-pyridyl)phenyl_(2-carboxypyridyl)irdium(III) (FIrPic) guest molecules was used as an hole transporting emission layer. The device structure was ITO/PVK:FIrpic (50 nm, xwt%)/TAZ 50 nm)/LiF (0.5 nm)/Al (100 nm). The concentration of FIrpic molecule was varied from 1 wt% to 10 wt%. The OLED on plastic substrate exhibited maximum current efficiency of 18 cd/A with 5 wt% FIrpic molecules were doped into the PVK layer.